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NXP Semiconductors MC9S12XEP100CAL
- Part No.:
- MC9S12XEP100CAL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12XEP100CAL.pdf
- Description:
- IC MCU 16BIT 1MB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:574
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Product details
Overview
MC9S12XEP100CAL from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 1 MB Flash with ECC, 64 KB RAM, and 4 KB emulated EEPROM. It integrates five MSCAN modules, dual ATD converters (10-bit, 16-channel), XGATE co-processor running at 100 MHz, and Memory Protection Unit (MPU) for system integrity. Designed for body control modules and gateway applications in vehicles operating from −40°C to 125°C.
For engineers reviewing the MC9S12XEP100CAL datasheet, MC9S12XEP100CAL pinout, MC9S12XEP100CAL application, or MC9S12XEP100CAL equivalent, key selection considerations include CAN mailbox scalability via XGATE, ECC-enabled Flash reliability, non-multiplexed external bus support in 208-pin MAPBGA, and full LIN master/slave capability using integrated SCI modules.
Technical Context
The MC9S12XEP100CAL implements a 16-bit CPU12X core with enhanced indexed addressing and large data segment access independent of PPAGE. Its XGATE co-processor operates at 100 MHz-twice the 50 MHz bus frequency-and handles peripheral interrupts, CAN/LIN messaging, and DMA-like data transfers without CPU intervention.
System integrity is enforced via an 8-region MPU with 8-byte granularity, Flash ECC (1-bit correction / 2-bit detection), and dual-voltage regulator architecture separating I/O and core supplies for optimized EMC filtering. The IPLL clock generator supports spread-spectrum modulation and fast wake-up from STOP mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core compatible with S12 instruction set (excluding 5 fuzzy instructions); enables legacy code reuse with enhanced addressing. |
| Flash Memory | 1 MB with 64+8-bit ECC per word; provides single-bit fault correction and double-bit fault detection for ASIL-B–capable firmware storage. |
| XGATE Performance | 100 MIPS RISC co-processor; offloads CAN/LIN protocol stacks, PWM timing, and sensor data preprocessing from main CPU. |
| CAN Interfaces | 5 independent MSCAN modules supporting CAN 2.0A/B, up to 1 Mbps, with FULL-CAN capability when paired with XGATE. |
| ADC Capability | Dual 10-bit ATD converters with 16-channel multiplexer and 3 µs conversion time; supports analog wake-up and internal oscillator operation in STOP mode. |
| Operating Temperature | −40°C to +125°C ambient range; qualified for under-hood automotive environments including engine control proximity zones. |
| Package | 208-pin MAPBGA (17 mm × 17 mm, case 1159A-01 issueB); supports non-multiplexed external bus for glueless interface to external memory. |
Pinout & Package
MC9S12XEP100CAL is housed in a 208-pin MAPBGA package (17 mm × 17 mm, 0.8 mm pitch), designed for high-density automotive PCB layouts with thermal and EMC robustness. Pinout information is defined in the official MC9S12XEP100 datasheet (Document Number: MC9S12XEP100MRL), where each ball maps to dedicated functional roles across power, ground, I/O, clock, debug, and peripheral interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDX / VDDA | Analog & Core Power Supply | Separate 5.0 V ±10% supplies enable independent EMC filtering and noise isolation between analog peripherals and digital logic. |
| VSSX / VSSA | Analog & Core Ground | Dedicated ground planes reduce coupling between high-speed digital switching and sensitive ADC reference paths. |
| RESET | Active-Low Reset Input | Asynchronous reset assertion clears CPU registers, disables peripherals, and initiates boot sequence from vector table at 0xFFFE. |
| MODB / MODA | Mode Selection Inputs | Configure boot source (internal Flash vs. external memory) and debug interface (BDM vs. xDBG) at power-on reset. |
| XTAL / EXTAL | Crystal Oscillator Interface | Supports 4–16 MHz Pierce crystal; internal transconductance tuning ensures reliable start-up across temperature and voltage extremes. |
| BKGD | Background Debug Single-Wire | Enables non-intrusive in-circuit debugging, flash programming, and real-time memory inspection without halting CPU execution. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 configurable address regions with 8-byte granularity; enforces no-write/no-execute policies and triggers NMI on violation for safety-critical task isolation. |
| ECC-Protected Flash | 64 data bits + 8 syndrome bits per word; corrects single-bit errors and detects double-bit faults during read cycles-critical for ISO 26262 ASIL-B compliance. |
| XGATE Co-Processor | Programmable in C; services all peripherals independently; enables FULL-CAN with unlimited mailboxes and LIN master/slave without CPU overhead. |
| IPLL Clock Generator | Internally filtered phase-locked loop with spread-spectrum option; eliminates external filter components while reducing radiated emissions in EMI-sensitive vehicle cabins. |
| Non-Multiplexed External Bus | Available only on 208-pin MAPBGA; supports asynchronous SRAM/Flash interfacing with programmable wait states and EWAIT deassertion handshake. |
Applications
| Body Control Module | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU managing PWM-driven power outputs, ATD-based sensor inputs (temperature, position), and LIN communication with local nodes. Use Value: XGATE handles LIN protocol stack and PWM timing autonomously, freeing CPU for higher-layer diagnostics and state machine management. |
Use Scenario: Protocol translation and message routing between CAN domains (powertrain, chassis) and LIN clusters (seats, mirrors, sensors). IC Role / Device Role / Timing Role: Dual-role controller executing CAN-to-LIN bridging, message filtering, and priority-based arbitration using five MSCAN modules and integrated SCI. Use Value: FULL-CAN capability via XGATE allows concurrent handling of >32 CAN mailboxes, enabling deterministic latency for safety-critical gateway functions. |
| Engine Bay Sensor Hub | Advanced Lighting Controller |
|
Use Scenario: Aggregation and preprocessing of temperature, pressure, and knock sensor signals near the engine block. IC Role / Device Role / Timing Role: Real-time signal conditioning unit with dual ATD converters, RTI-triggered sampling, and CAN transmission of calibrated values. Use Value: 125°C-rated operation and internal ADC oscillator allow continuous sensing in STOP mode-reducing system power consumption by >40% versus active polling. |
Use Scenario: Adaptive LED headlight control with dynamic beam shaping, dimming, and fault monitoring. IC Role / Device Role / Timing Role: High-precision PWM generator (8×8-bit or 4×16-bit) synchronized to vehicle speed and steering angle inputs via CAN. Use Value: Programmable center/left-aligned outputs and emergency shutdown input ensure fail-safe LED driver control meeting UNECE R149 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XEP100J2 | Same die, but in 144-pin LQFP package; lacks non-multiplexed external bus and 33 fewer I/O pins (119 vs. 152). | Suitable for space-constrained gateways where external memory expansion is unnecessary and I/O count is lower. | Select when board layout constraints favor LQFP and external memory interface is not required. |
| MC9S12XDP512 | 512 KB Flash, no MPU, no ECC, 4 CAN modules, 32 KB RAM; older S12XD family with reduced system integrity features. | Applicable for cost-sensitive body modules with less stringent functional safety requirements (e.g., non-ASIL systems). | Choose only if ASIL-B compliance is not mandated and legacy software compatibility outweighs ECC/MPU benefits. |
Compared with MC9S12XEP100CAL, S912XEP100J2 trades package flexibility and external bus capability for smaller footprint, while MC9S12XDP512 sacrifices MPU, ECC, and CAN count to reduce BOM cost-making MC9S12XEP100CAL the only option supporting full ASIL-B–compliant gateway designs with 1 MB code space.
Availability
MC9S12XEP100CAL is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, engine bay sensor hubs, and adaptive lighting controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S12XEP100CAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in automotive microcontrollers dating to Motorola's S12 lineage.
The MC9S12XEP100CAL belongs to the S12XE family, engineered specifically for automotive body electronics and gateway systems demanding enhanced system integrity-including MPU, ECC, and XGATE acceleration-to meet evolving ASIL-B functional safety requirements.
FAQ
What is the maximum operating temperature range supported by the MC9S12XEP100CAL?
The MC9S12XEP100CAL is rated for operation from −40°C to +125°C ambient temperature. This extended range qualifies it for under-hood applications such as engine bay sensor hubs and transmission control units where thermal stress exceeds standard industrial limits. The device maintains full functionality-including Flash ECC, XGATE operation, and CAN communication-at the upper limit, validated per AEC-Q100 Grade 0 stress testing protocols.
Does the MC9S12XEP100CAL support CAN FD or only classical CAN 2.0?
The MC9S12XEP100CAL supports only classical CAN 2.0A/B protocols-not CAN FD. Its five MSCAN modules implement bit rates up to 1 Mbps, standard/extended identifier frames, and hardware-based filtering, but lack the variable data rate, extended payload, and CRC enhancements defined in ISO 11898-1:2015 for CAN FD. For CAN FD applications, designers should consider NXP's S32K series instead.
How does the XGATE co-processor in the MC9S12XEP100CAL improve CAN performance?
The XGATE co-processor in the MC9S12XEP100CAL enables FULL-CAN functionality by autonomously managing all MSCAN module interrupts, mailbox servicing, and message buffering-freeing the main CPU for application logic. It supports virtually unlimited mailboxes through software-managed RAM queues and executes CAN protocol tasks at 100 MHz, reducing average interrupt latency by >70% compared to CPU-only handling.
Is the MC9S12XEP100CAL pin-compatible with earlier S12X devices like the MC9S12XDP512?
No, the MC9S12XEP100CAL is not pin-compatible with MC9S12XDP512. While both belong to the S12X architecture family and share functional similarities, the MC9S12XEP100CAL uses a 208-pin MAPBGA package with different ball mapping, additional power/ground pins for EMC robustness, and distinct mode configuration pins (e.g., MODB/MODA). Migration requires PCB redesign and signal routing validation.
What debug interfaces are supported by the MC9S12XEP100CAL?
The MC9S12XEP100CAL supports two debug interfaces: the single-wire Background Debug Mode (BDM) for basic flash programming and run-control, and the enhanced xDBG module with four hardware comparators and a 64-entry trace buffer for advanced profiling and breakpoint analysis. Both interfaces operate concurrently and support non-intrusive memory access without halting CPU execution during active debugging sessions.
MC9S12XEP100CAL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12XEP100CAL FAQ
1.How can I place an order for MC9S12XEP100CAL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12XEP100CAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12XEP100CAL reliable?
The price and inventory of MC9S12XEP100CAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XEP100CAL is usually 5 days.
3.What payment methods are accepted for MC9S12XEP100CAL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XEP100CAL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12XEP100CAL?
MC9S12XEP100CAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12XEP100CAL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12XEP100CAL?
For technical support, including MC9S12XEP100CAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XEP100CAL requirements.
6.How does Aetrix verify that MC9S12XEP100CAL is sourced from the original manufacturer or authorized distributors?
All MC9S12XEP100CAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XEP100CAL meets industry standards.
7.What is the process for return or replacement of MC9S12XEP100CAL?
All MC9S12XEP100CAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XEP100CAL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12XEP100CAL part is unused and in its original packaging.
Return procedure for MC9S12XEP100CAL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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