NXP Semiconductors MC9S12XEP100MAL
- Part No.:
- MC9S12XEP100MAL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12XEP100MAL.pdf
- Description:
- IC MCU 16BIT 1MB FLASH 112LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:300
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Product details
Overview
MC9S12XEP100MAL from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller with CPU12X core, 1 MB Flash, 64 KB RAM, and Memory Protection Unit (MPU) for system integrity. It features five MSCAN modules, dual ATD converters (8/10/12-bit, 16-channel), XGATE co-processor running at 100 MHz, and operates from -40°C to 125°C - deployed in body control modules and gateway ECUs.
For engineers reviewing the MC9S12XEP100MAL datasheet, MC9S12XEP100MAL pinout, MC9S12XEP100MAL application, or MC9S12XEP100MAL equivalent, key selection criteria include CAN mailbox scalability via XGATE, ECC-protected Flash with 1-bit correction/2-bit detection, non-multiplexed external bus support (208-pin MAPBGA), and full LIN master/slave capability using integrated SCI modules.
Technical Context
The MC9S12XEP100MAL implements a 16-bit CPU12X core with enhanced indexed addressing and large data segment access independent of PPAGE, executing instructions at up to 50 MHz bus frequency. Its XGATE co-processor runs at 100 MHz, handles peripheral interrupts autonomously, and enables FULL-CAN performance by managing unlimited mailboxes without CPU intervention.
System integrity is enforced via an 8-region Memory Protection Unit (MPU) with 8-byte granularity, supporting no-write/no-execute attributes and non-maskable violation interrupts. Flash memory includes 64+8-bit ECC (1-bit correction, 2-bit detection), while D-Flash provides 32 KB with automated program/erase and burst-word programming capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core compatible with S12 instruction set (excluding five fuzzy instructions); enables legacy code reuse with enhanced addressing. |
| Flash Memory | 1 MB with ECC (64 data + 8 syndrome bits); supports single-bit fault correction and double-bit fault detection during read operations. |
| RAM | 64 KB on-chip RAM; used for XGATE code/data, CPU stack, and real-time buffers without external dependency. |
| Operating Voltage | 3.3 V ±5% / +10% to 5.0 V +10%; separate I/O and regulator supplies enable optimized EMC filtering and robust operation in noisy automotive environments. |
| Temperature Range | -40°C to +125°C; qualified for under-hood and powertrain-adjacent automotive applications requiring extended thermal reliability. |
| Peripheral Integration | 5 × MSCAN (CAN 2.0A/B), 8 × SCI, 3 × SPI, 2 × IIC, 2 × ATD (16-channel, 3 µs 10-bit conversion), 8 × PWM channels - reduces external component count in body/gateway nodes. |
| XGATE Co-processor | Programmable in C; executes at 100 MHz; offloads CAN/LIN communication, sensor polling, and PWM timing - freeing CPU for higher-layer tasks. |
Pinout & Package
MC9S12XEP100MAL is packaged in a 208-pin MAPBGA (17 mm × 17 mm, case no. 1159A-01 issue B) with non-multiplexed external bus interface, supporting glue-less connection to external RAM/Flash. Pin functions are defined per port (e.g., PORTA–PORTP) and module-specific signals (e.g., CAN0_TX, ATD0_IN0, XGATE_IRQ).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDX | Core & I/O supply inputs | Dual-supply architecture isolates noise-sensitive analog/digital domains; enables independent EMC filter design per rail. |
| RESET | Active-low reset input | Accepts external reset assertion; synchronizes internal POR, COP watchdog timeout, and illegal address recovery sequences. |
| XTAL, EXTAL | Crystal oscillator terminals | Supports 4–16 MHz Pierce crystal; internal transconductance optimized for reliable startup across temperature and aging. |
| CAN0_TX / CAN0_RX | CAN differential signal pair | Direct interface to ISO 11898-compliant physical layer; supports bit rates up to 1 Mbps with programmable timing quanta. |
| ATD0_IN0–ATD0_IN15 | Analog input channels | 16 dedicated pins routed to first ATD converter; support multiplexed sampling with internal oscillator for Stop-mode wake-up. |
| PT0–PT7 | General-purpose I/O port | 8-bit port with configurable pull-up/pull-down, hysteresis, and drive strength; usable as digital I/O or peripheral function multiplex. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 configurable address regions with 8-byte granularity; enforces supervisor/user mode separation and prevents unauthorized peripheral access. |
| ECC-Protected Flash | 64+8-bit ECC per word enables real-time 1-bit correction and 2-bit detection - critical for ASIL-B software integrity in automotive ECUs. |
| XGATE Co-processor | Offloads time-critical CAN/LIN frame handling, ATD scanning, and PWM updates; eliminates CPU polling and interrupt latency bottlenecks. |
| Non-Multiplexed External Bus | Available only on 208-pin MAPBGA package; supports asynchronous SRAM/Flash with programmable wait states and EWAIT deassertion handshake. |
| Enhanced Debug Architecture | xDBG with four hardware comparators and 64-entry trace buffer captures CPU/XGATE bus activity for deterministic timing analysis and fault root-cause isolation. |
Applications
| Body Control Module (BCM) | Vehicle Gateway ECU |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU managing PWM-driven power outputs, ATD-monitored sensor inputs (e.g., ambient temp, rain sensors), and LIN-connected slave nodes. Use Value: MPU and ECC ensure firmware integrity during over-the-air updates; XGATE handles LIN scheduling independently, guaranteeing deterministic response to key-fob RF commands. |
Use Scenario: Protocol translation between high-speed CAN-FD backbone and low-speed LIN subnets in distributed vehicle networks. IC Role / Device Role / Timing Role: Dual-CAN/LIN interface controller with XGATE-managed mailbox arbitration and message filtering. Use Value: Five MSCAN modules allow concurrent routing of chassis, powertrain, and infotainment traffic; non-multiplexed bus supports external diagnostic flash storage for bootloader updates. |
| Engine Bay Junction Box | Advanced Lighting Control Unit |
|
Use Scenario: High-temperature junction box consolidating power distribution, fuse monitoring, and CAN diagnostics near engine compartment. IC Role / Device Role / Timing Role: Robust MCU operating at 125°C ambient, monitoring current-sense ADC inputs and driving high-side switches via PWM outputs. Use Value: Extended temperature rating (-40°C to +125°C) and LVD/POR circuitry ensure fail-safe shutdown during voltage transients; ECC Flash prevents corruption during cranking events. |
Use Scenario: Adaptive front-lighting system (AFS) controlling LED matrix positioning, thermal feedback, and CAN-based beam pattern updates. IC Role / Device Role / Timing Role: Real-time controller coordinating ATD temperature sensing, PWM dimming, and CAN command parsing with sub-millisecond latency. Use Value: Dual ATD converters enable simultaneous sampling of multiple thermal zones; XGATE manages CAN receive FIFOs while CPU computes beam angle corrections. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XEP768MAL | 768 KB Flash, 48 KB RAM, identical pinout and peripheral set except reduced Flash/RAM capacity. | Suitable for cost-optimized BCMs with smaller firmware footprint and fewer calibration tables. | Select when application firmware size remains below 700 KB and EEPROM emulation requirements are ≤2 KB. |
| S9S12XEP100MLH | NXP rebranded version with identical electrical specs, same 208-pin MAPBGA package, and updated qualification per AEC-Q100 Rev G. | Drop-in replacement with enhanced long-term supply assurance and updated automotive qualification documentation. | Prefer for new designs requiring latest NXP lifecycle support and AEC-Q100 Rev G compliance evidence. |
Compared with MC9S12XEP100MAL, MC9S12XEP768MAL trades Flash/RAM headroom for lower unit cost in constrained firmware applications, while S9S12XEP100MLH offers identical functionality with updated automotive qualification and extended manufacturer support - making it the recommended path for production continuity.
Availability
MC9S12XEP100MAL is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateway ECUs, and engine bay junction boxes requiring stable component supply, long-lifecycle availability, and AEC-Q100-compliant sourcing.
Supply support for MC9S12XEP100MAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating to Motorola and Freescale.
The MC9S12XEP100MAL belongs to the S12XE family - engineered specifically for automotive body electronics and gateway systems requiring enhanced functional safety, memory protection, and multi-protocol communication scalability.
FAQ
What is the maximum bus frequency supported by the MC9S12XEP100MAL CPU core?
The MC9S12XEP100MAL CPU12X core operates at a maximum bus frequency of 50 MHz. This enables deterministic real-time execution for automotive control loops while maintaining compatibility with legacy S12 codebases. The XGATE co-processor runs at 100 MHz - twice the bus speed - to handle time-critical I/O tasks independently of the main CPU. Both frequencies are sustained across the full -40°C to +125°C operating range.
Does the MC9S12XEP100MAL support CAN FD or only classical CAN 2.0?
The MC9S12XEP100MAL supports only classical CAN 2.0A/B protocol - not CAN FD. Its five MSCAN modules implement CAN 2.0A/B software compatibility, standard/extended frames, and bit rates up to 1 Mbps. CAN FD capability requires newer architectures such as S32K or MagniV families. For MC9S12XEP100MAL, FULL-CAN performance is achieved via XGATE-managed mailbox handling, but frame payload and data rate remain limited to CAN 2.0 specifications.
What package type and pin count does the MC9S12XEP100MAL use?
The MC9S12XEP100MAL uses a 208-pin MAPBGA package (17 mm × 17 mm, case number 1159A-01 issue B). This package includes a non-multiplexed external bus interface, enabling direct connection to external memory without address/data bus demultiplexing logic. It is the only package option for the EP100 variant that supports full peripheral integration including all five CAN modules and dual ATD converters.
How does the Memory Protection Unit (MPU) in the MC9S12XEP100MAL enhance system safety?
The MC9S12XEP100MAL MPU defines eight configurable address regions with granularity down to 8 bytes, enforcing no-write and no-execute attributes per region. On access violation, it triggers a non-maskable interrupt - enabling immediate fault containment and safe state transition. This capability supports ASIL-B software partitioning requirements by preventing unintended code execution or peripheral register writes, especially critical during OTA updates or multi-tasking runtime environments.
Is the MC9S12XEP100MAL pin-compatible with earlier S12XD family devices?
Yes, the MC9S12XEP100MAL is pin-compatible with corresponding S12XD derivatives in the same package (e.g., 208-pin MAPBGA), preserving PCB layout across generations. However, functional enhancements - including MPU, ECC Flash, enhanced XGATE, and IPLL - require firmware updates and configuration changes. Pin compatibility applies strictly to mechanical and basic signal mapping; unused pins in S12XD may be repurposed for new features in S12XE, so schematic review is mandatory before drop-in replacement.
MC9S12XEP100MAL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12XEP100MAL FAQ
1.How can I place an order for MC9S12XEP100MAL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12XEP100MAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12XEP100MAL reliable?
The price and inventory of MC9S12XEP100MAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XEP100MAL is usually 5 days.
3.What payment methods are accepted for MC9S12XEP100MAL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XEP100MAL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12XEP100MAL?
MC9S12XEP100MAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12XEP100MAL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12XEP100MAL?
For technical support, including MC9S12XEP100MAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XEP100MAL requirements.
6.How does Aetrix verify that MC9S12XEP100MAL is sourced from the original manufacturer or authorized distributors?
All MC9S12XEP100MAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XEP100MAL meets industry standards.
7.What is the process for return or replacement of MC9S12XEP100MAL?
All MC9S12XEP100MAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XEP100MAL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12XEP100MAL part is unused and in its original packaging.
Return procedure for MC9S12XEP100MAL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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