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NXP Semiconductors MC9S12XEP768CAG
- Part No.:
- MC9S12XEP768CAG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MC9S12XEP768CAG.pdf
- Description:
- IC MCU 16BIT 768KB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,198
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Product details
Overview
MC9S12XEP768CAG from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring CPU12X core, 768 KB on-chip Flash with ECC, 48 KB RAM, and Memory Protection Unit (MPU). It delivers full CAN 2.0A/B support via five MSCAN modules, operates at up to 50 MHz bus frequency, and targets body control units requiring ASIL-B–capable system integrity in -40°C to 125°C ambient.
For engineers reviewing the MC9S12XEP768CAG datasheet, MC9S12XEP768CAG pinout, MC9S12XEP768CAG application, or MC9S12XEP768CAG equivalent, key selection criteria include MPU-configurable memory regions, XGATE co-processor offloading of CAN/LIN messaging, ECC-enabled Flash reliability, and 208-pin MAPBGA package compatibility with external memory interfaces.
Technical Context
The MC9S12XEP768CAG implements a dual-bus architecture: the 16-bit CPU12X core runs at up to 50 MHz bus frequency, while the programmable XGATE RISC co-processor executes at 100 MHz and handles time-critical peripheral servicing-including full mailbox-based CAN message handling-without CPU intervention. Its IPLL supports spread-spectrum clocking for EMC reduction.
System integrity is enforced via hardware-level features: an 8-region MPU with 8-byte granularity, Flash ECC providing 1-bit correction/2-bit detection, and supervisor/user mode separation with peripheral access control. The device supports wake-up from STOP/WAIT modes via 25 configurable I/O pins and includes a trimmable API timer accurate to ±10% over 0.2 ms–13 s range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core, instruction-set compatible with S12D/X except five removed fuzzy instructions; enables legacy code reuse with enhanced addressing. |
| Flash Memory | 768 KB with ECC (64 data + 8 syndrome bits), enabling single-bit fault correction and double-bit fault detection during read/write operations. |
| RAM | 48 KB on-chip RAM, accessible without wait states; supports fast XGATE/CPU data movement and real-time buffer management. |
| Operating Voltage | 3.3 V ±5% / 5.0 V +10%, with separate VREG and I/O supplies to optimize EMC filtering and reduce noise coupling. |
| Temperature Range | -40°C to +125°C ambient, qualified for under-hood automotive applications including body control modules and gateways. |
| Peripheral Count | 5 MSCAN modules, 8 SCI, 3 SPI, 2 IIC, 2 ATD (8/10/12-bit, 16-channel mux), 8 ECT/TIM channels, 8 PIT timers - enabling multi-bus vehicle networking. |
| XGATE Performance | 100 MIPS RISC co-processor, programmable in C, servicing all peripherals independently; enables FULL-CAN and LIN master/slave offload. |
Pinout & Package
MC9S12XEP768CAG is housed in a 208-pin MAPBGA package (17 mm × 17 mm, case no 1159A-01 issueB), supporting non-multiplexed external bus interface for glue-less connection to asynchronous SRAM/Flash. Pin functions are validated per MC9S12XEP768 datasheet Rev. 7 and Freescale Application Note AN3781.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDX | Core & I/O power supply | Dual-supply design allows independent filtering of analog/digital domains; VDDX powers internal regulator and PLL for stable clock generation. |
| RESET | Active-low reset input | Accepts external reset signal; internally synchronized to avoid metastability; triggers POR, COP timeout, or illegal address events. |
| XTAL, EXTAL | Crystal oscillator inputs | Supports 4–16 MHz Pierce crystal; internal transconductance optimized for reliable startup across temperature and voltage extremes. |
| CAN0_TX, CAN0_RX | CAN controller channel 0 differential I/O | Direct interface to CAN physical transceiver; supports bit rates up to 1 Mbps; integrated low-pass filter enables wake-up from STOP mode. |
| SCI0_TX, SCI0_RX | Asynchronous serial interface channel 0 | NRZ or IrDA RZI format; supports LIN 2.0 master/slave when paired with XGATE; wake-up on active edge for low-power operation. |
| PORTH[7:0] | General-purpose I/O port | 8-bit bidirectional port with configurable pull-up/down, hysteresis, and drive strength; supports interrupt-on-change for wake-up from STOP/WAIT. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 user-definable address regions with 8-byte granularity; enforces no-write/no-execute attributes and triggers non-maskable interrupt on violation. |
| ECC-Protected Flash | 64-bit data + 8-bit syndrome per word enables real-time 1-bit correction and 2-bit detection-critical for ASIL-B functional safety compliance. |
| XGATE Co-processor | 100 MIPS RISC engine executing C code; services CAN, LIN, SPI, and ADC interrupts autonomously, freeing CPU for application logic. |
| Full-CAN Capability | Five MSCAN modules with 5 receive buffers + FIFO, 3 prioritized transmit buffers, and 16-bit timestamping-enables concurrent multi-network gateway operation. |
| API Timer | Trimmable ±10% accuracy, 0.2 ms–13 s range, available in Full Stop mode-supports precise cyclic wake-up for battery-powered body electronics. |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU managing PWM-driven power outputs, ATD-sensed cabin sensors, and LIN-connected slave nodes; coordinates CAN messaging via XGATE. Use Value: MPU and ECC ensure firmware integrity during EMI-heavy switching events; 152 I/O pins enable direct driver interfacing without external expanders. |
Use Scenario: Protocol translation and message routing between high-speed CAN-FD backbone and low-speed LIN/SPI subnetworks. IC Role / Device Role / Timing Role: Dual-role processor: XGATE handles CAN/LIN frame assembly/disassembly while CPU manages routing tables and diagnostics. Use Value: Five independent MSCAN modules allow simultaneous monitoring of chassis, powertrain, and infotainment CAN buses; API timer enables scheduled diagnostics without waking main CPU. |
| Smart Junction Box | Roof Module Controller |
|
Use Scenario: Power distribution and load monitoring unit integrating fuse emulation, current sensing, and thermal protection. IC Role / Device Role / Timing Role: Real-time current sampling via ATD, PWM-controlled MOSFET drivers, and CAN-based fault reporting with 16-bit timestamps. Use Value: ECC Flash prevents corruption of safety-critical fuse maps; 125°C rating supports under-dash mounting near HVAC ducts. |
Use Scenario: Integrated sunroof, panoramic roof, and interior lighting control with gesture sensing and ambient light adaptation. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating ATD (light/temperature), PWM (motor control), and SPI (gesture sensor) data; communicates status via CAN. Use Value: 48 KB RAM accommodates multiple sensor buffers and LIN protocol stacks; XGATE offloads SPI polling to maintain deterministic response to touch events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XEP768J2 | Same core, Flash, RAM, and peripheral set; differs in qualification grade (AEC-Q100 Grade 2 vs. Grade 1) and temperature range (-40°C to 105°C). | Targeted at less thermally demanding cabin modules rather than under-hood or junction box deployments. | Select S912XEP768J2 only if ambient operating temperature remains ≤105°C and Grade 1 qualification is not required. |
| MC9S12XDP512 | Lower Flash (512 KB), no MPU, no ECC, reduced CAN count (3 modules), same XGATE and CPU12X core; pin-compatible in 144-LQFP but not 208-MAPBGA. | Suitable for cost-sensitive entry-level BCMs without functional safety requirements or external memory expansion needs. | Choose MC9S12XDP512 only when ECC, MPU, and 768 KB Flash are unnecessary-and external bus interface is not required. |
Compared with S912XEP768J2, MC9S12XEP768CAG provides extended temperature capability and AEC-Q100 Grade 1 qualification essential for under-hood use; versus MC9S12XDP512, it adds critical safety features (MPU/ECC) and higher peripheral density needed for full-featured gateways.
Availability
MC9S12XEP768CAG is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, smart junction boxes, and roof module controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S12XEP768CAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and highly integrated solutions.
The MC9S12XEP768CAG belongs to the S12XE family-designed specifically for automotive body electronics requiring enhanced system integrity, real-time performance, and functional safety support through hardware-enforced MPU and ECC.
FAQ
What is the maximum bus frequency supported by the MC9S12XEP768CAG?
The MC9S12XEP768CAG supports a maximum CPU bus frequency of 50 MHz and an XGATE bus frequency of 100 MHz. This is achieved using the internal IPLL with frequency multiplication and optional spread-spectrum modulation to reduce electromagnetic emissions. The bus speed is maintained across the full -40°C to 125°C operating range when powered within the specified 3.3 V ±5% or 5.0 V +10% supply range.
Does the MC9S12XEP768CAG include hardware memory protection?
Yes, the MC9S12XEP768CAG integrates a Memory Protection Unit (MPU) supporting eight definable address regions with granularity down to 8 bytes. Each region can be configured with no-write or no-execute attributes, and violations trigger a non-maskable interrupt. This feature is essential for ASIL-B–compliant software partitioning and runtime integrity enforcement in automotive body control applications.
How many CAN modules does the MC9S12XEP768CAG support, and what protocols are implemented?
The MC9S12XEP768CAG supports five independent MSCAN modules compliant with CAN 2.0A and 2.0B protocols. Each module supports standard and extended identifiers, data lengths from 0 to 8 bytes, programmable bit rates up to 1 Mbps, and hardware timestamping. When used with the XGATE co-processor, the device achieves FULL-CAN functionality with unlimited mailbox handling and autonomous message filtering.
What package type and pin count does the MC9S12XEP768CAG use?
The MC9S12XEP768CAG is supplied exclusively in a 208-pin MAPBGA package (17 mm × 17 mm, case number 1159A-01 issueB). This package supports the non-multiplexed external bus interface, enabling direct connection to external SRAM and Flash without glue logic. Pin assignments and thermal/mechanical data are documented in the MC9S12XEP768 datasheet Rev. 7 and Freescale packaging specification 1159A.
Is the MC9S12XEP768CAG qualified for automotive use, and what is its temperature rating?
Yes, the MC9S12XEP768CAG is AEC-Q100 qualified (Grade 1) and rated for continuous operation from -40°C to +125°C ambient temperature. This qualification covers thermal cycling, humidity testing, and ESD robustness per automotive standards. The device is intended for under-hood and junction box applications where sustained high-temperature reliability is mandatory.
MC9S12XEP768CAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 119
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12XEP768CAG FAQ
1.How can I place an order for MC9S12XEP768CAG through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12XEP768CAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12XEP768CAG reliable?
The price and inventory of MC9S12XEP768CAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XEP768CAG is usually 5 days.
3.What payment methods are accepted for MC9S12XEP768CAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XEP768CAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12XEP768CAG?
MC9S12XEP768CAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12XEP768CAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12XEP768CAG?
For technical support, including MC9S12XEP768CAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XEP768CAG requirements.
6.How does Aetrix verify that MC9S12XEP768CAG is sourced from the original manufacturer or authorized distributors?
All MC9S12XEP768CAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XEP768CAG meets industry standards.
7.What is the process for return or replacement of MC9S12XEP768CAG?
All MC9S12XEP768CAG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XEP768CAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12XEP768CAG part is unused and in its original packaging.
Return procedure for MC9S12XEP768CAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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