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NXP Semiconductors MC9S12XEP768CAL
- Part No.:
- MC9S12XEP768CAL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12XEP768CAL.pdf
- Description:
- IC MCU 16BIT 768KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,577
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Product details
Overview
MC9S12XEP768CAL from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 768 KB on-chip Flash with ECC, 48 KB RAM, and integrated Memory Protection Unit (MPU). It delivers full CAN 2.0A/B support via five MSCAN modules, operates at up to 50 MHz bus frequency, and targets body control units requiring high system integrity in -40°C to 125°C environments.
For engineers reviewing the MC9S12XEP768CAL datasheet, MC9S12XEP768CAL pinout, MC9S12XEP768CAL application, or MC9S12XEP768CAL equivalent, key selection criteria include MPU-enabled safety partitioning, XGATE co-processor offloading of CAN/LIN protocol stacks, ECC-protected Flash for ASIL-B readiness, and 208-pin MAPBGA packaging with non-multiplexed external bus capability.
Technical Context
The MC9S12XEP768CAL implements a dual-bus architecture: the 16-bit CPU12X core runs at up to 50 MHz while the programmable XGATE co-processor executes at 100 MHz, handling time-critical peripheral tasks-including full CAN mailbox management and LIN frame generation-without CPU intervention. Its memory subsystem includes ECC-protected Flash (1-bit correction / 2-bit detection), emulated EEPROM (4 KB), and D-Flash (32 KB) with automated program/erase algorithms.
System integrity is enforced through hardware-level features: an 8-region MPU with 8-byte granularity, supervisor/user mode separation, windowed COP watchdog, clock monitor, and low-voltage detection with configurable reset/interrupt behavior. The IPLL oscillator supports spread-spectrum modulation to reduce EMC emissions, and the CRG enables fast wake-up from STOP mode using self-clocking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core, instruction-set compatible with S12D/X except five removed fuzzy instructions; enables legacy code reuse with enhanced addressing. |
| Flash Memory | 768 KB with 64+8-bit ECC per word; provides single-bit error correction and double-bit fault detection for functional safety compliance. |
| RAM | 48 KB on-chip SRAM; supports fast data buffering and XGATE/CPU shared access without wait states. |
| Operating Voltage | 3.3 V ±5% to 5.0 V +10%; separate VREG and I/O supplies enable optimized EMC filtering and robust operation across automotive battery transients. |
| Temperature Range | -40°C to +125°C; qualified for under-hood and powertrain-adjacent automotive applications requiring extended thermal reliability. |
| Bus Frequency | 50 MHz maximum CPU bus frequency; ensures deterministic real-time response for body control timing-critical functions. |
| XGATE Performance | 100 MHz RISC co-processor; handles full CAN protocol stack, LIN master/slave, SPI/SCI transfers, and ATD triggering independently of main CPU. |
| CAN Modules | 5 independent MSCAN modules; supports multi-bus gateway architectures with full CAN 2.0A/B compatibility and 1 Mbps bit rate. |
Pinout & Package
MC9S12XEP768CAL is packaged in a 208-pin MAPBGA (17 mm × 17 mm, case no. 1159A-01 issue B) with non-multiplexed external bus interface, supporting glue-less connection to external memories. Pin assignments are defined in the MC9S12XEP768 Data Sheet, Section "Port Availability by Package Option".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDIO | Power supply inputs | Dual-supply architecture separates core logic (VDD) and I/O drivers (VDDIO) for independent voltage scaling and EMC optimization. |
| RESET | Active-low reset input | Asynchronous reset with internal POR and LVD supervision; initiates safe state recovery on power anomaly or voltage sag. |
| XTAL, EXTAL | Crystal oscillator terminals | Supports 4–16 MHz Pierce crystal; internal transconductance tuning ensures reliable startup across temperature and aging. |
| CS0–CS3 | Chip select outputs | Four configurable chip selects enable direct interface to multiple external peripherals or memory devices without address decoding logic. |
| PORTH[7:0] | General-purpose I/O port | 8-bit bidirectional port with hysteresis, configurable pull-up/down, and edge-sensitive interrupt capability for wake-up from STOP/WAIT. |
| MSCAN0_TX, MSCAN0_RX | CAN0 differential signal pair | Dedicated CAN physical layer interface compliant with ISO 11898-2; supports high-speed (up to 1 Mbps) differential signaling. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 configurable address regions with 8-byte granularity; enforces no-write/no-execute policies and triggers non-maskable interrupt on violation-critical for ASIL-B software partitioning. |
| XGATE Co-processor | Programmable in C; offloads CAN/LIN protocol processing, SPI/SCI framing, and ATD result handling-reducing CPU load by >60% in gateway use cases. |
| ECC-Protected Flash | 64 data bits + 8 syndrome bits per word; corrects single-bit errors and detects double-bit faults during read/write-meeting ISO 26262 SEooC requirements for memory safety. |
| Enhanced ATD Converter | Two independent 10-bit ADCs with 3 µs conversion time, 16-channel multiplexer, and analog comparator wake-up-enabling precise sensor monitoring in body control systems. |
| Full-CAN with XGATE | Five MSCAN modules each supporting 5 receive buffers + 3 transmit buffers with FIFO and prioritization; XGATE manages mailbox arbitration and message filtering autonomously. |
| Spread-Spectrum IPLL | Configurable frequency modulation reduces peak EMI emissions by up to 10 dB; eliminates need for external spread-spectrum clock generators in EMC-sensitive designs. |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, HVAC actuators, and interior sensors in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing body domain firmware, managing PWM-driven power outputs, reading ATD-based sensor inputs, and coordinating LIN slave nodes via integrated SCI modules. Use Value: MPU-enforced isolation prevents infotainment-initiated faults from compromising safety-critical lighting or door lock functions; ECC Flash ensures firmware integrity over 15-year vehicle lifetime. |
Use Scenario: Protocol translation and message routing between high-speed CAN (powertrain), low-speed CAN (body), and LIN (door modules, seats) networks. IC Role / Device Role / Timing Role: Multi-CAN hub with XGATE-managed mailbox arbitration, real-time message filtering, and priority-based forwarding between heterogeneous buses. Use Value: Five independent MSCAN modules eliminate external CAN controllers; XGATE offloads >95% of CAN protocol overhead, freeing CPU for application-layer routing logic. |
| Roof Module Controller | Smart Junction Box |
|
Use Scenario: Integrated control of sunroof, panoramic roof, ambient lighting, and rain/light sensors mounted in vehicle roof assemblies. IC Role / Device Role / Timing Role: Real-time sensor fusion node using ATD channels for analog light/rain detection, PWM for motor control, and SPI for RGB LED driver communication. Use Value: 152 I/O pins support dense sensor/actuator interfacing; API timer provides ±10% accurate 1–13 s timeouts for anti-pinch motor sequencing without external components. |
Use Scenario: Power distribution and load switching unit consolidating fuse boxes, relay drivers, and diagnostic monitoring in engine bay or chassis locations. IC Role / Device Role / Timing Role: High-reliability power manager using enhanced ECT/PWM for current-limited load control, ATD for voltage/current sensing, and COP watchdog for fail-safe shutdown. Use Value: On-chip voltage regulator (VREG) with LVD/LVR ensures stable operation during cold-crank (4.5 V min); MPU prevents unauthorized firmware updates from compromising power safety logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XEP100J2 | 1 MB Flash, 64 KB RAM, identical 208-pin MAPBGA package and peripheral set; higher memory density but same CPU/XGATE architecture. | Targeted at next-gen BCMs requiring larger OTA update partitions or complex diagnostics stacks beyond 768 KB capacity. | Select when firmware growth projections exceed 700 KB or when future-proofing for ASIL-D toolchain qualification is required. |
| MC9S12XEQ512MAL | 512 KB Flash, 32 KB RAM, 144-pin LQFP; lacks non-multiplexed external bus and has only four CAN modules. | Suitable for cost-sensitive body nodes with lower I/O count and no external memory expansion needs. | Choose for space-constrained modules where 208-pin BGA is impractical and CAN count ≤4 suffices for LIN/CAN hybrid networks. |
Compared with MC9S12XEP768CAL, S912XEP100J2 offers headroom for larger safety-certified firmware images, while MC9S12XEQ512MAL trades memory and CAN count for smaller footprint and lower BOM cost-neither is pin-compatible, but both share identical XGATE programming model and S12X toolchain support.
Availability
MC9S12XEP768CAL is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, roof electronics, and smart junction boxes requiring stable component supply across extended product lifecycles.
Supply support for MC9S12XEP768CAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive MCUs dating back to Motorola and Freescale.
The MC9S12XEP768CAL belongs to the S12XE family-designed specifically for automotive body electronics demanding enhanced system integrity, including MPU, ECC Flash, and XGATE-accelerated communication stacks for CAN/LIN gateways and distributed controllers.
FAQ
What is the maximum operating temperature range supported by the MC9S12XEP768CAL?
The MC9S12XEP768CAL is qualified for operation from -40°C to +125°C, making it suitable for under-hood and powertrain-adjacent automotive applications where thermal stress exceeds standard industrial ranges. This rating is validated per AEC-Q100 Grade 1 requirements and applies to all functional blocks including CPU, XGATE, Flash, and analog peripherals.
Does the MC9S12XEP768CAL support CAN FD or only classical CAN 2.0?
The MC9S12XEP768CAL supports only classical CAN 2.0A/B protocols-not CAN FD-as confirmed by its MSCAN module specification, which lists maximum bit rates of 1 Mbps, standard/extended identifier support, and 0–8 byte payload lengths. CAN FD features such as flexible data-rate switching and larger payloads are absent from the hardware design.
How does the XGATE co-processor in the MC9S12XEP768CAL improve CAN performance?
The XGATE co-processor in the MC9S12XEP768CAL executes CAN protocol tasks-including mailbox management, message filtering, CRC calculation, and TX/RX buffer handling-at 100 MHz, enabling FULL-CAN operation with five independent MSCAN modules. This relieves the CPU12X core from interrupt latency and frees >60% of CPU bandwidth for application logic in gateway implementations.
Is the MC9S12XEP768CAL pin-compatible with earlier S12XD family members?
Yes, the MC9S12XEP768CAL maintains high-level pin compatibility with the S12XD family in matching packages (e.g., 208-pin MAPBGA), allowing migration with minimal PCB changes. However, differences in XGATE interrupt vectors, MPU register layout, and IPLL configuration require firmware adaptation-even though physical pin functions and electrical characteristics remain consistent.
What debugging interfaces are supported by the MC9S12XEP768CAL?
The MC9S12XEP768CAL supports Background Debug Mode (BDM) via a single-wire interface for non-intrusive memory access, flash programming, and real-time breakpoint control. It also integrates xDBG with four hardware comparators and a 64-entry trace buffer, enabling advanced debug scenarios like bus monitoring, flow analysis, and conditional breakpoints on CPU or XGATE activity.
MC9S12XEP768CAL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12XEP768CAL FAQ
1.How can I place an order for MC9S12XEP768CAL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12XEP768CAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12XEP768CAL reliable?
The price and inventory of MC9S12XEP768CAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XEP768CAL is usually 5 days.
3.What payment methods are accepted for MC9S12XEP768CAL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XEP768CAL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12XEP768CAL?
MC9S12XEP768CAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12XEP768CAL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12XEP768CAL?
For technical support, including MC9S12XEP768CAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XEP768CAL requirements.
6.How does Aetrix verify that MC9S12XEP768CAL is sourced from the original manufacturer or authorized distributors?
All MC9S12XEP768CAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XEP768CAL meets industry standards.
7.What is the process for return or replacement of MC9S12XEP768CAL?
All MC9S12XEP768CAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XEP768CAL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12XEP768CAL part is unused and in its original packaging.
Return procedure for MC9S12XEP768CAL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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