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NXP Semiconductors MC9S12XEP768MAL
- Part No.:
- MC9S12XEP768MAL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
MC9S12XEP768MAL.pdf
- Description:
- IC MCU 16BIT 768KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,090
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Product details
Overview
MC9S12XEP768MAL from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 768 KB on-chip Flash with ECC, 48 KB RAM, and Memory Protection Unit (MPU) for system integrity. It integrates five MSCAN modules, dual ATD converters (8/10/12-bit, 16-channel), XGATE co-processor (100 MIPS), and operates from -40°C to 125°C - deployed in body control modules and gateway ECUs.
For engineers reviewing the MC9S12XEP768MAL datasheet, MC9S12XEP768MAL pinout, MC9S12XEP768MAL application, or MC9S12XEP768MAL equivalent, key selection criteria include CAN mailbox scalability via XGATE, ECC-enabled Flash reliability, MPU-configurable memory regions, and support for full-stop mode API timing (0.2 ms–13 s).
Technical Context
The MC9S12XEP768MAL implements a dual-bus architecture: the 50 MHz CPU12X core accesses peripherals and memory without wait states, while the independent 100 MHz XGATE co-processor handles time-critical I/O tasks-including FULL-CAN mailbox management and LIN protocol offload-freeing the CPU for higher-layer logic. Its IPLL clock generator supports spread-spectrum modulation to reduce EMC emissions.
System integrity is enforced at silicon level via an 8-region MPU with 8-byte granularity, ECC (1-bit correction / 2-bit detection) across Flash and D-Flash, and supervisor/user mode separation with peripheral access control. The device supports non-multiplexed external bus interface only in 208-pin MAPBGA and 144-pin LQFP packages - not applicable to the MAL suffix variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core, instruction-set compatible with S12 family (excluding 5 fuzzy instructions), enabling legacy code reuse. |
| Flash Memory | 768 KB Flash with 64+8-bit ECC per word: enables single-bit fault correction and double-bit fault detection during execution. |
| RAM | 48 KB on-chip RAM, accessible at full bus speed without wait states for deterministic real-time response. |
| Operating Temp | -40°C to 125°C ambient range: qualified for under-hood automotive applications requiring extended thermal robustness. |
| CAN Interfaces | 5 independent MSCAN modules (CAN0–CAN4), each compliant with CAN 2.0A/B, supporting up to 1 Mbps bit rate and hardware FIFOs. |
| XGATE Co-processor | Programmable RISC engine running at 100 MIPS; services all peripherals independently, enabling FULL-CAN with unlimited mailboxes. |
| Analog Input | Dual ATD modules, 16-channel multiplexer, 3 µs 10-bit conversion time, internal oscillator support for wake-up from STOP mode. |
| Supply Voltage | 3.3 V ±5% / +10% to 5.0 V +10% single supply; separate VREG and I/O supplies allow optimized EMC filtering. |
Pinout & Package
MC9S12XEP768MAL is housed in a 112-pin LQFP package (20 mm × 20 mm, 0.65 mm pitch, case no 987), with 91 total I/O pins including 25 interrupt-capable digital I/Os for wake-up from STOP/WAIT modes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDX | Core & I/O Power Supply | Dual-supply inputs enable independent EMC filtering; VDD powers core/logic, VDDX powers I/O buffers. |
| VSS, VSSX | Core & I/O Ground | Separate ground returns minimize noise coupling between analog/digital and I/O domains. |
| RESET | Active-Low Reset Input | Asynchronous reset with internal pull-up; asserts on power-on, low-voltage detect, COP timeout, or illegal address access. |
| MODA, MODB | Mode Selection Inputs | Configure boot mode (Normal, Special Bootstrap, Background Debug); sampled at reset to select vector table location. |
| XTAL, EXTAL | Crystal Oscillator Interface | Supports 4–16 MHz Pierce crystal; internal transconductance optimized for reliable start-up across temperature and voltage. |
| PORTH[7:0] | General-Purpose I/O Port | 8-bit bidirectional port with configurable pull-up/down, hysteresis, and drive strength; supports edge-sensitive interrupts. |
| CAN0_TX, CAN0_RX | CAN0 Transceiver Interface | Differential signal pair for CAN0 bus communication; electrically isolated from other CAN ports for fault containment. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 programmable address regions with 8-byte granularity; enforces no-write/no-execute attributes and triggers NMI on violation. |
| ECC-Protected Flash & D-Flash | 64+8-bit ECC per word ensures runtime correction of single-bit errors and detection of double-bit faults in both program and data flash. |
| XGATE Co-Processor | Offloads CAN/LIN/ATD/PWM handling from CPU; eliminates software polling and reduces latency for time-critical I/O events. |
| Enhanced ATD Converter | Two independent 8/10/12-bit ADCs with 16-channel mux, 3 µs conversion time, and internal oscillator support for wake-up from STOP. |
| Full-Stop Mode API Timer | Asynchronous periodic interrupt available in Full Stop mode, trimmable to ±10%, with resolution down to 0.2 ms for precise low-power scheduling. |
| MSCAN with XGATE Integration | Enables FULL-CAN operation: XGATE manages message buffering, filtering, and transmission scheduling, freeing CPU for application logic. |
Applications
| Body Control Module (BCM) | Vehicle Gateway ECU |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing body control firmware, managing PWM-driven power drivers, reading analog sensor inputs (e.g., ambient light, temperature), and communicating over CAN/LIN. Use Value: MPU and ECC ensure functional safety compliance; dual ATD and 5 CAN interfaces support concurrent subsystem monitoring and multi-bus routing without CPU overload. |
Use Scenario: Protocol translation and message routing between high-speed CAN-FD backbone and low-speed LIN subnetworks (e.g., mirror, seat, climate nodes). IC Role / Device Role / Timing Role: Gateway controller performing CAN-to-LIN bridging, message filtering, and diagnostic request forwarding using dedicated MSCAN and SCI modules. Use Value: XGATE co-processor handles real-time CAN mailbox arbitration and LIN frame generation, enabling deterministic latency <100 µs and zero CPU intervention for protocol layers. |
| Roof Module Controller | Smart Junction Box |
|
Use Scenario: Integrated roof console managing sunroof, panoramic roof, interior lighting, and rain/light sensors in premium vehicle trims. IC Role / Device Role / Timing Role: Real-time sensor fusion hub with analog input conditioning (ATD), PWM-controlled motor drivers, and CAN-based status reporting to BCM. Use Value: 125°C rating and ECC Flash ensure reliability in thermally stressed cabin environments; API timer enables precise 100-ms wake-up intervals for periodic sensor sampling. |
Use Scenario: Distributed power distribution unit replacing fuses and relays with solid-state switches, monitoring load current and temperature. IC Role / Device Role / Timing Role: High-integrity power manager using EEE for persistent fault logging, PWM for soft-switching control, and CAN for diagnostics and configuration updates. Use Value: Emulated EEPROM (4 KB) provides wear-levelled non-volatile storage for event logs; MPU prevents unauthorized write access to critical configuration registers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XEP100MAL | 1 MB Flash, 64 KB RAM, same 112-pin LQFP package and peripheral set; higher memory density but identical pinout and electrical specs. | Targeted at future-proofed designs requiring larger firmware images or expanded data logging capacity. | Select when firmware growth headroom or D-Flash expansion beyond 32 KB is required; drop-in replacement with no layout change. |
| S9S12XEP768MLL | NXP rebranded version post-acquisition; identical silicon, same 112-pin LQFP, -40°C to 125°C rating, and feature set - differs only in part numbering and packaging marking. | No functional difference; used interchangeably in production where NXP branding is mandated. | Choose for new designs aligned with NXP's current product nomenclature and long-term supply assurance. |
Compared with MC9S12XEP768MAL, MC9S12XEP100MAL offers 232 KB more Flash and 16 KB more RAM within identical footprint and thermal envelope, while S9S12XEP768MLL provides identical functionality under NXP's updated part numbering - both preserve full software and hardware compatibility.
Availability
MC9S12XEP768MAL is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, smart junction boxes, and roof module controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S12XEP768MAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating back to Motorola and Freescale.
The MC9S12XEP768MAL belongs to the S12XE family - engineered specifically for automotive body electronics demanding enhanced system integrity, CAN/LIN protocol offload, and ASIL-B–capable memory protection features.
FAQ
What is the operating temperature range of the MC9S12XEP768MAL?
The MC9S12XEP768MAL is rated for operation from -40°C to +125°C ambient temperature, making it suitable for under-hood and cabin-mounted automotive applications where thermal stress is significant. This rating is validated per AEC-Q100 Grade 1 requirements and applies across its full voltage and frequency operating range.
Does the MC9S12XEP768MAL support CAN FD?
No, the MC9S12XEP768MAL integrates five legacy MSCAN modules compliant only with ISO 11898-1:2003 (CAN 2.0A/B), supporting standard and extended frames up to 1 Mbps. It does not implement CAN FD physical layer or protocol enhancements such as flexible data-rate or CRC extension.
How many CAN modules does the MC9S12XEP768MAL include?
The MC9S12XEP768MAL includes five fully independent MSCAN modules (CAN0 through CAN4), each supporting CAN 2.0A/B, programmable bit rates up to 1 Mbps, hardware acceptance filtering, and FIFO-based message buffering - all concurrently operable without CPU overhead when managed by XGATE.
What is the role of the XGATE co-processor in the MC9S12XEP768MAL?
The XGATE co-processor in the MC9S12XEP768MAL is a programmable 100 MIPS RISC engine that handles time-critical I/O tasks - including CAN mailbox management, LIN frame generation, ATD triggering, and PWM synchronization - independently of the main CPU12X core, reducing latency and improving deterministic real-time performance.
Is the MC9S12XEP768MAL pin-compatible with other S12XE family members?
Yes, the MC9S12XEP768MAL in the 112-pin LQFP package shares identical pinout and electrical characteristics with other 112-pin S12XE derivatives (e.g., MC9S12XEQ512, MC9S12XET256), enabling hardware reuse across memory and peripheral variants - provided external circuitry aligns with enabled modules.
MC9S12XEP768MAL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S12XEP768MAL FAQ
1.How can I place an order for MC9S12XEP768MAL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S12XEP768MAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S12XEP768MAL reliable?
The price and inventory of MC9S12XEP768MAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XEP768MAL is usually 5 days.
3.What payment methods are accepted for MC9S12XEP768MAL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XEP768MAL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S12XEP768MAL?
MC9S12XEP768MAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S12XEP768MAL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S12XEP768MAL?
For technical support, including MC9S12XEP768MAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XEP768MAL requirements.
6.How does Aetrix verify that MC9S12XEP768MAL is sourced from the original manufacturer or authorized distributors?
All MC9S12XEP768MAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XEP768MAL meets industry standards.
7.What is the process for return or replacement of MC9S12XEP768MAL?
All MC9S12XEP768MAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XEP768MAL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S12XEP768MAL part is unused and in its original packaging.
Return procedure for MC9S12XEP768MAL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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