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NXP Semiconductors MC9S12XET256MAA

Part No.:
MC9S12XET256MAA
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
80-QFP
Datasheet:
AetrixMC9S12XET256MAA.pdf
Description:
IC MCU 16BIT 256KB FLASH 80QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:420

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Product details

Overview

MC9S12XET256MAA from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12X microcontroller with 256 KB on-chip flash, 14 KB RAM, and integrated XGATE coprocessor for real-time offload. It operates at up to 50 MHz, supports CAN 2.0B and LIN 2.1 interfaces, and targets automotive body control modules requiring deterministic interrupt response and functional safety support.

For engineers reviewing the MC9S12XET256MAA datasheet, MC9S12XET256MAA pinout, MC9S12XET256MAA application, or MC9S12XET256MAA equivalent, key selection criteria include its 112-pin LQFP package, dual CAN controller with time-triggered capability, 12-bit ADC with 16 channels, and hardware-based memory protection unit (MPU) for ASIL-B–capable designs.

Technical Context

The MC9S12XET256MAA implements the S12X CPU core with enhanced instruction set and pipeline, paired with an autonomous XGATE RISC coprocessor that handles time-critical I/O tasks-including CAN message filtering, PWM synchronization, and ADC post-processing-without CPU intervention. Its clock system includes PLL, internal voltage regulator (VREG), and multiple oscillator options (crystal, RC, external).

It integrates a full-featured Memory Protection Unit (MPU) with eight configurable regions, a 256 KB flash module supporting EEPROM emulation and secure boot, and dual MSCAN controllers with flexible message buffering and error handling. The device supports background debug mode (BDM) and S12XDBG for non-intrusive development.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreS12X 16-bit CISC core with 5-stage pipeline, 50 MHz max frequency
Flash Memory256 KB on-chip flash with 2K block erase, 100K write/erase cycles, EEPROM emulation support
RAM14 KB on-chip SRAM with MPU-protected access
CAN InterfacesDual independent MSCAN modules compliant with ISO 11898-1, supporting CAN 2.0B and time-triggered communication
ADC12-bit successive approximation ADC with 16 input channels, 8 µs conversion time, and hardware trigger support
XGATE Coprocessor16-bit RISC engine with 2 KB local RAM, executes up to 100 MIPs independently of CPU for deterministic I/O offload
Package112-pin LQFP (16 × 16 mm, 0.4 mm pitch), RoHS-compliant, industrial temperature range (−40°C to +105°C)

Pinout & Package

MC9S12XET256MAA is housed in a 112-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, optimized for automotive PCB layouts requiring thermal reliability and EMI robustness. Pin assignments follow S12XE family conventions with dedicated power/ground pairs, differential CAN transceiver pins, and multiplexed I/O grouped by port (Ports A–H, J, K, L, M, P, R, S, T).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDX, VDDPLLPower supply inputsSeparate analog/digital/PLL domains enable noise isolation and stable clock generation
VSS, VSSX, VSSPLLGround returnsDedicated ground planes per domain reduce coupling and improve ADC SNR
CAN0TX / CAN0RXCAN0 differential transmitter/receiverDirect connection to external CAN transceiver; supports high-speed (1 Mbps) operation
CAN1TX / CAN1RXCAN1 differential transmitter/receiverIndependent second CAN bus for gateway or redundancy applications
AD0[0–15]Analog input channels16 single-ended or 8 differential inputs routed to ADC0; compatible with on-chip temperature sensor
PT0–PT7Port T general-purpose I/O8-bit port with programmable pull-up, polarity, and interrupt-on-change capability
RESETActive-low reset inputAsynchronous reset with internal pull-up; supports external watchdog or BDM assertion
BKGDBackground debug pinSingle-wire BDM interface for programming and real-time debugging without halting CPU

Key Features

FeatureDesign Value
XGATE coprocessorOffloads CAN message handling, PWM updates, and ADC data pre-processing to free main CPU for application logic
Memory Protection Unit (MPU)Eight configurable protection regions enforce access rights for flash, RAM, and peripherals-critical for ASIL-B software partitioning
Dual MSCAN controllersEach supports 64-message buffers, hardware ID filtering, and error counters for fault-tolerant network management
On-chip voltage regulator (VREG)Generates stable 2.5 V core supply from 5 V rail, eliminating need for external LDO in most automotive systems
Enhanced Capture Timer (ECT)16-bit timer with 8 input capture/compare channels, quadrature decoder, and PWM output for motor control

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized management of lighting, window lifts, mirrors, and locks in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing vehicle state machine, coordinating LIN slaves, and processing CAN messages from gateway.

Use Value: Dual CAN enables simultaneous communication with powertrain and infotainment networks; XGATE handles door actuator timing without jitter.

Use Scenario: Local control of power windows, side mirrors, and anti-pinch detection in driver/passenger doors.

IC Role / Device Role / Timing Role: Real-time motor control MCU with integrated ADC for current sensing and PWM for H-bridge drive.

Use Value: On-chip ECT and 12-bit ADC provide precise position feedback and current monitoring; VREG simplifies power design.

Roof Module ControllerSeat Control Unit

Use Scenario: Control of sunroof, panoramic roof, and ambient lighting with gesture or switch inputs.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating inputs from Hall sensors, potentiometers, and capacitive touch.

Use Value: 16-channel ADC supports multi-sensor acquisition; MPU isolates safety-critical roof stop logic from UI firmware.

Use Scenario: Motorized seat adjustment with memory positions, heating, and lumbar support.

IC Role / Device Role / Timing Role: Safety-aware controller managing dual DC motors, thermal sensors, and LIN-connected switches.

Use Value: Dual CAN allows diagnostics via vehicle network; XGATE manages heater PWM duty cycle independently of seat position algorithm.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S12XEP100J1MALSame S12XE family, 100 KB flash, 8 KB RAM, identical pinout and peripheral set except reduced memorySuitable for cost-sensitive BCM variants with fewer features or smaller code footprintSelect when application fits within 100 KB flash and does not require XGATE-intensive CAN filtering
MC9S12XDP512MAL512 KB flash, 32 KB RAM, same CPU/XGATE/MPU architecture but larger package (144-pin LQFP)Targeted at high-end gateway or ADAS domain controllers needing larger code space and more I/OChoose when scaling beyond 256 KB flash or requiring additional CAN/LIN channels

Compared with S9S12XEP100J1MAL and MC9S12XDP512MAL, the MC9S12XET256MAA delivers optimal balance of memory, real-time offload capability, and footprint for mid-tier automotive body electronics-enabling feature-rich BCMs without over-provisioning or layout redesign.

Availability

MC9S12XET256MAA is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof modules, and seat control units requiring stable component supply across extended product lifecycles.

Supply support for MC9S12XET256MAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.

The MC9S12XET256MAA belongs to the S12XE microcontroller family, engineered specifically for automotive body electronics where functional safety, real-time determinism, and long-term supply stability are mandatory.

FAQ

What is the maximum operating frequency of the MC9S12XET256MAA?

The MC9S12XET256MAA operates at a maximum CPU frequency of 50 MHz, achieved via its internal PLL which accepts input clocks from crystal oscillators (4–32 MHz), RC oscillators, or external sources. This frequency enables deterministic execution of automotive control loops with sub-microsecond interrupt latency, and is validated across the full industrial temperature range (−40°C to +105°C). The MC9S12XET256MAA maintains timing compliance under all specified voltage and thermal conditions.

Does the MC9S12XET256MAA support CAN FD?

No, the MC9S12XET256MAA does not support CAN FD. It integrates two legacy MSCAN modules compliant only with ISO 11898-1 (Classical CAN 2.0B), supporting bit rates up to 1 Mbps. CAN FD capability requires newer architectures such as S32K or MPC57xx families. For designs requiring CAN FD, migration to those platforms is necessary; the MC9S12XET256MAA remains appropriate for established Classical CAN networks in body electronics.

How is the XGATE coprocessor used in the MC9S12XET256MAA?

The XGATE coprocessor in the MC9S12XET256MAA is a 16-bit RISC engine with 2 KB dedicated RAM, programmed independently of the main S12X CPU. It autonomously handles time-critical tasks including CAN message filtering, ADC data preprocessing, PWM waveform generation, and serial protocol framing-freeing the CPU for higher-layer application logic. The MC9S12XET256MAA uses XGATE interrupts and mailbox registers for synchronized CPU–coprocessor communication without shared memory contention.

What debug interface does the MC9S12XET256MAA support?

The MC9S12XET256MAA supports the Background Debug Mode (BDM) interface via the BKGD pin, enabling single-wire in-circuit debugging, flash programming, and real-time register inspection without halting the CPU. It also supports S12XDBG for advanced trace and profiling. No JTAG interface is present. Debug tools include P&E Micro's Multilink and SEGGER J-Link with BDM firmware; the MC9S12XET256MAA requires no external debug header beyond the BKGD and VDD/VSS connections.

Is the MC9S12XET256MAA qualified for automotive use?

Yes, the MC9S12XET256MAA is AEC-Q100 Grade 2 qualified (−40°C to +105°C), manufactured in IATF 16949-certified facilities, and designed to meet ISO 26262 requirements for ASIL-B systems. Its integrated Memory Protection Unit (MPU), lock-step peripherals, and hardware CRC engines support functional safety mechanisms. The MC9S12XET256MAA has been deployed in production automotive body control modules since 2010 and maintains full lifecycle support through NXP's long-term supply program.

MC9S12XET256MAA Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
80-QFP
Series:
HCS12X
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12XET256MAA FAQ

1.How can I place an order for MC9S12XET256MAA through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12XET256MAA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12XET256MAA reliable?

The price and inventory of MC9S12XET256MAA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XET256MAA is usually 5 days.

3.What payment methods are accepted for MC9S12XET256MAA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XET256MAA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12XET256MAA?

MC9S12XET256MAA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12XET256MAA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12XET256MAA?

For technical support, including MC9S12XET256MAA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XET256MAA requirements.

6.How does Aetrix verify that MC9S12XET256MAA is sourced from the original manufacturer or authorized distributors?

All MC9S12XET256MAA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XET256MAA meets industry standards.

7.What is the process for return or replacement of MC9S12XET256MAA?

All MC9S12XET256MAA units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XET256MAA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12XET256MAA part is unused and in its original packaging.

Return procedure for MC9S12XET256MAA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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