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NXP Semiconductors MC9S12XHZ256CAG

Part No.:
MC9S12XHZ256CAG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixMC9S12XHZ256CAG.pdf
Description:
IC MCU 16BIT 256KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,926

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Product details

Overview

MC9S12XHZ256CAG from NXP (formerly Freescale) is a 16-bit HCS12X-family microcontroller featuring a 50 MHz S12X CPU core, 256 KB on-chip Flash memory, 12 KB RAM, and integrated XGATE co-processor for offloading real-time I/O tasks. It includes dual CAN 2.0B controllers, 10-bit 16-channel ADC, PWM, ECT, SCI, SPI, I²C, and LCD controller - deployed in automotive body control modules and industrial motor drives.

For engineers reviewing the MC9S12XHZ256CAG datasheet, MC9S12XHZ256CAG pinout, MC9S12XHZ256CAG application, or MC9S12XHZ256CAG equivalent, key selection criteria include its 80-pin LQFP package, 5V-tolerant I/O, hardware security module, and dual-CAN support for distributed vehicle networks requiring deterministic timing and flash reprogramming in-circuit.

Technical Context

The MC9S12XHZ256CAG implements a pipelined S12X CPU core with 50 MHz maximum bus speed and supports both single-chip and expanded multiplexed bus modes. Its XGATE RISC co-processor operates at full bus speed, handles up to 128 interrupt-driven threads, and manages time-critical peripherals including CAN, SCI, and PWM without CPU intervention.

It integrates a programmable PLL clock generator with external crystal (4–32 MHz) or ceramic resonator input, supports multiple low-power stop/wait modes, and features a dedicated background debug module (BDM) interface compliant with IEEE 1149.1 JTAG for in-system programming and real-time trace.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreS12X 16-bit pipelined core, 50 MHz max bus speed - enables deterministic real-time control with 1–2 cycle instruction execution.
Flash Memory256 KB on-chip Flash (S12XFTX512K4V3 derivative), 1K block erase, 256-byte page write - supports field firmware updates and secure boot partitioning.
RAM12 KB on-chip RAM (8 KB general + 4 KB XGATE local) - sufficient for real-time buffer handling and co-processor task stacks.
Analog-to-Digital10-bit, 16-channel ATD10B16CV4 with 8 µs conversion time and external trigger support - suitable for motor current sensing and battery voltage monitoring.
CommunicationDual MSCANV3 modules (CAN 2.0B), 3×SCI, 2×SPI, I²C, and LIN-capable SCI - enables multi-node vehicle network architecture with redundancy.
Package80-pin LQFP (12 × 12 mm, 0.5 mm pitch), RoHS-compliant - compatible with standard surface-mount assembly and automotive PCB thermal profiles.
Operating Voltage4.5 V to 5.5 V supply range with internal 3.3 V regulator (VREG3V3V5) - ensures robust operation across automotive battery transients.

Pinout & Package

MC9S12XHZ256CAG is housed in an 80-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, optimized for thermal dissipation in automotive under-hood environments. Pin functions are defined per S12XHZPIMV1 port integration module, supporting configurable pull-up/down, slew rate control, and interrupt-capable inputs.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundSeparate analog/digital power domains with decoupling requirements per Appendix B - critical for ADC noise immunity and CAN signal integrity.
EXTAL / XTALClock oscillator input/outputConnects to 4–32 MHz crystal or resonator; enables PLL-based system clock generation with ±0.5% stability over temperature.
CAN0_TX / CAN0_RXCAN 2.0B differential channel 0Direct connection to ISO 11898-compliant transceiver; supports bit rates up to 1 Mbps with programmable sample point.
PORTA[7:0]General-purpose I/O bank8-bit port with individual direction control, interrupt-on-change, and optional pull devices - used for discrete sensor inputs or LED status indicators.
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external watchdog or power monitor assertion - ensures safe startup after brownout or ESD event.

Key Features

FeatureDesign Value
XGATE co-processorIndependent 16-bit RISC engine with 128 KB address space and hardware semaphore support - eliminates CPU polling overhead for CAN message handling and PWM synchronization.
Hardware Security ModuleFlash protection via security byte and backdoor key access (S12X9SECV2) - prevents unauthorized read-out of firmware and enables secure bootloader authentication.
Dual CAN ControllersTwo independent MSCANV3 modules with 64-message object buffers and time-triggered communication mode - supports gateway functionality between powertrain and body networks.
LCD ControllerIntegrated LCD32F4BV1 driver supporting up to 32×4 segments - reduces BOM count in instrument cluster and HVAC display designs.
Background DebugIEEE 1149.1-compliant BDM interface (S12XBDMV2) with real-time register visibility and flash programming - enables non-intrusive debugging during vehicle validation testing.

Applications

Automotive Body Control Unit (BCU)Industrial Motor Drive Interface

Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, PWM-controlled actuator drivers, and fault-safe diagnostics.

Use Value: Dual CAN interfaces enable simultaneous communication with powertrain and infotainment networks; 256 KB Flash accommodates OTA update partitions and diagnostic stack.

Use Scenario: Closed-loop control of BLDC motors in HVAC blowers, pumps, and conveyor systems.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using ADC-sampled current feedback and PWM-modulated gate drivers.

Use Value: XGATE co-processor handles high-frequency PWM updates and encoder capture independently, freeing S12X core for supervisory logic and communication.

Automotive Instrument ClusterOff-Highway Equipment Telematics

Use Scenario: Driving information display with analog gauges, warning lights, and digital trip data.

IC Role / Device Role / Timing Role: LCD controller driving segmented displays while managing CAN message parsing and EEPROM-stored calibration data.

Use Value: Integrated LCD32F4BV1 eliminates external display driver IC; 4 KB EEPROM (S12XEETX4KV2) stores odometer and service interval counters with wear leveling.

Use Scenario: Data acquisition and wireless transmission in agricultural tractors and construction machinery.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating J1939 CAN messages, analog pressure/temperature readings, and GPS timestamps.

Use Value: Robust 5V I/O tolerance and extended temperature rating (–40°C to +125°C) ensure reliability in harsh outdoor environments with wide voltage fluctuations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XDP512MAL512 KB Flash, 32 KB RAM, same 80-pin LQFP package and peripheral set - differs only in memory size and part marking.Targeted at higher-complexity applications requiring larger firmware image or more runtime variables.Select when future firmware growth or additional safety-certified code sections are anticipated.
S912XEQ512J2MAGNXP's later-generation S12XE family part with identical pinout, enhanced ESD performance (±8 kV HBM), and updated mask set - fully backward-compatible at hardware level.Preferred for new designs requiring extended product lifecycle support and improved manufacturing yield.Choose for long-term production programs where obsolescence risk and qualification continuity are critical.

Compared with MC9S12XHZ256CAG, MC9S12XDP512MAL offers double Flash/RAM for complex control stacks, while S912XEQ512J2MAG delivers identical functionality with improved robustness and active NXP support - making it the recommended migration path for new designs.

Availability

MC9S12XHZ256CAG is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and instrumentation applications requiring stable component supply, long-lifecycle assurance, and qualified automotive-grade sourcing.

Supply support for MC9S12XHZ256CAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller innovation dating to the Motorola 68HC11 era.

The MC9S12XHZ256CAG belongs to NXP's HCS12X automotive microcontroller family, designed specifically for cost-sensitive, safety-aware embedded control applications demanding real-time responsiveness, functional safety readiness (ASIL-B capable), and CAN-based network integration.

FAQ

What is the maximum operating frequency of the MC9S12XHZ256CAG?

The MC9S12XHZ256CAG features an S12X CPU core with a maximum bus frequency of 50 MHz. This is achieved using an internal PLL that multiplies an external crystal (4–32 MHz) input. The actual instruction throughput depends on pipeline efficiency and wait states, but most instructions execute in 1–2 bus cycles. The MC9S12XHZ256CAG datasheet specifies timing parameters for all peripheral modules at this maximum frequency.

Does the MC9S12XHZ256CAG support in-circuit debugging and programming?

Yes, the MC9S12XHZ256CAG includes a dedicated Background Debug Module (BDM) compliant with IEEE 1149.1 JTAG. It supports full-speed real-time debugging, flash programming, register inspection, and breakpoint setting via a 6-pin BDM interface. This capability is integral to the S12XBDMV2 module and is fully supported by NXP's CodeWarrior development tools - essential for validating MC9S12XHZ256CAG-based automotive firmware.

How does the XGATE co-processor in the MC9S12XHZ256CAG improve real-time performance?

The XGATE co-processor in the MC9S12XHZ256CAG is a separate 16-bit RISC engine that executes interrupt-driven tasks autonomously - such as CAN message buffering, SCI receive/transmit handling, and PWM period updates - without CPU intervention. It accesses shared memory via hardware semaphores and runs at full bus speed, reducing S12X core load by up to 40% in high-interrupt-rate applications. This architecture is documented in the S12XGATEV2 chapter of the MC9S12XHZ256CAG reference manual.

What security features does the MC9S12XHZ256CAG provide to protect firmware?

The MC9S12XHZ256CAG implements hardware-based security through its S12X9SECV2 module, including flash memory protection via a security byte, backdoor key access (128-bit key), and special single-chip mode unsecuring via BDM. Once secured, read-out of Flash contents is blocked, and debug access is disabled unless the correct key is presented. These mechanisms are detailed in Chapter 6 of the MC9S12XHZ256CAG datasheet and meet automotive OEM requirements for IP protection.

Is the MC9S12XHZ256CAG pin-compatible with other HCS12X family members?

The MC9S12XHZ256CAG shares the same 80-pin LQFP package and pinout with MC9S12XHZ384CAG and MC9S12XHZ512CAG, enabling direct substitution within the HZ-series. However, it is not pin-compatible with DP-series (e.g., MC9S12XDP512) or earlier HCS12 variants due to differences in peripheral mapping and power pin allocation. Always verify signal routing against the specific device's pin configuration summary in Section 1.2.1 of the MC9S12XHZ256CAG datasheet.

MC9S12XHZ256CAG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
HCS12X
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
LCD, Motor control PWM, POR, PWM, WDT
Number of I/O:
117
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12XHZ256CAG FAQ

1.How can I place an order for MC9S12XHZ256CAG through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12XHZ256CAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12XHZ256CAG reliable?

The price and inventory of MC9S12XHZ256CAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XHZ256CAG is usually 5 days.

3.What payment methods are accepted for MC9S12XHZ256CAG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XHZ256CAG transactions.

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4.How is shipping managed for MC9S12XHZ256CAG?

MC9S12XHZ256CAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12XHZ256CAG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12XHZ256CAG?

For technical support, including MC9S12XHZ256CAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XHZ256CAG requirements.

6.How does Aetrix verify that MC9S12XHZ256CAG is sourced from the original manufacturer or authorized distributors?

All MC9S12XHZ256CAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XHZ256CAG meets industry standards.

7.What is the process for return or replacement of MC9S12XHZ256CAG?

All MC9S12XHZ256CAG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XHZ256CAG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12XHZ256CAG part is unused and in its original packaging.

Return procedure for MC9S12XHZ256CAG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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