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NXP Semiconductors MC9S12XHZ256CAL

Part No.:
MC9S12XHZ256CAL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
112-LQFP
Datasheet:
AetrixMC9S12XHZ256CAL.pdf
Description:
IC MCU 16BIT 256KB FLASH 112LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,628

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Product details

Overview

MC9S12XHZ256CAL from NXP (formerly Freescale) is a 16-bit HCS12X-family microcontroller featuring 256 KB on-chip Flash, 12 KB RAM, and an integrated XGATE co-processor for real-time interrupt offloading. It supports CAN 2.0B, SPI, SCI, I²C, PWM, and 10-bit ADC with 16 channels - deployed in automotive body control modules and industrial motor controllers requiring deterministic timing and functional safety support.

For engineers reviewing the MC9S12XHZ256CAL datasheet, MC9S12XHZ256CAL pinout, MC9S12XHZ256CAL application, or MC9S12XHZ256CAL equivalent, key selection criteria include its 50 MHz S12X CPU core speed, dual-voltage operation (5 V I/O / 3.3 V core), 112-pin LQFP package, and hardware security features including flash protection and backdoor key access.

Technical Context

The MC9S12XHZ256CAL implements the S12X CPU12XV2 core with 5-stage pipeline and enhanced addressing modes, paired with the XGATE V2 RISC co-processor capable of handling up to 16 concurrent threads. Its clock system integrates a PLL with programmable multiplication factor and supports multiple low-power modes including Stop, Wait, and Freeze.

Peripheral integration includes the S12XHZPIMV1 port module with configurable slew rates and pull-up/polarity control, S12XFTX512K4V3 Flash (256 KB), S12XEETX4KV2 EEPROM (4 KB), ATD10B16CV4 10-bit ADC (16-channel, 8 µs conversion), and MSCANV3 controller area network interface compliant with ISO 11898-1.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreS12X 16-bit, 50 MHz max frequency - enables deterministic real-time execution for safety-critical automotive tasks.
Flash Memory256 KB on-chip Flash with 4 KB sector erase - supports field firmware updates without external memory.
RAM12 KB on-chip RAM - sufficient for real-time task stacks, CAN message buffers, and PID control variables.
ADC10-bit, 16-channel ATD10B16CV4 with 8 µs conversion time - suitable for analog sensor monitoring in engine control units.
CAN InterfaceMSCANV3 module supporting CAN 2.0B protocol with 32-message object buffers - meets automotive network requirements.
XGATE Co-processorV2 RISC engine with 1 KB RAM and 16-thread scheduler - offloads time-critical ISR processing from main CPU.
Operating Voltage5.0 V ±10% I/O supply, 3.3 V core - allows direct interfacing with legacy 5 V sensors and actuators.
Package112-pin LQFP (16 × 16 mm, 0.4 mm pitch) - compatible with standard surface-mount assembly processes.

Pinout & Package

MC9S12XHZ256CAL is housed in a 112-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, rated for -40°C to +125°C ambient operation. Pin assignments follow the S12XHZ family pinout defined in Section 1.2.1 of the MC9S12XHZ512 Data Sheet Rev. 1.06, covering dedicated CANH/CANL, ADC inputs (AN0–AN15), PWM outputs (PWM0–PWM7), and multiplexed I/O ports A–W.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual-supply domains: VDD (5 V) for I/O, VDDPLL/VSSPLL (3.3 V) for PLL and core logic.
RESETActive-low reset inputAsynchronous reset with internal pull-up; initiates full chip initialization sequence per S12CRGV6 spec.
CANH, CANLCAN bus differential pairDirect connection to ISO 11898-compliant transceiver; supports 1 Mbit/s data rate with built-in filtering.
XTAL, EXTALCrytal oscillator terminalsSupports 4–8 MHz fundamental-mode crystals for precise clock generation via Pierce oscillator (S12XOSCLCPV1).
AD0–AD15Analog input channels16 single-ended or 8 differential inputs mapped to ATD10B16CV4; share pins with Port AD and Port T.
PWM0–PWM7Enhanced PWM outputsEight independent 8-bit PWM channels with center-aligned mode and dead-time insertion - used for motor gate drive control.

Key Features

FeatureDesign Value
XGATE co-processorOffloads up to 16 prioritized ISRs (e.g., CAN RX/TX, ADC triggers) from main CPU - reduces latency and improves determinism.
Hardware securityFlash protection via security byte and backdoor key access - prevents unauthorized read-out or reprogramming in production units.
Flexible clockingConfigurable PLL with 1–32× multiplication and selectable reference sources (crystal, internal RC, external clock) - enables dynamic frequency scaling.
Motor control peripheralsIntegrated PWM8B8CV1, ECT16B8CV3, and MC10B12CV2 modules - support brushless DC commutation and stepper stall detection.
Robust I/OProgrammable slew rate, pull-up/pull-down, and polarity inversion per port pin - simplifies EMI mitigation and signal conditioning.
Background debugS12XBDMV2 and S12XDBGV3 modules enable non-intrusive debugging via single-wire BDM interface - no code footprint required.

Applications

Body Control Module (BCM)Industrial Motor Drive

Use Scenario: Centralized vehicle subsystem managing lighting, door locks, wipers, and HVAC via LIN/CAN networks.

IC Role / Device Role / Timing Role: Main controller executing real-time state machines, CAN message arbitration, and PWM-based dimming control.

Use Value: Integrated CAN, 16-channel ADC, and 8 PWM outputs eliminate need for external interface ICs - reducing BOM count and PCB area.

Use Scenario: Closed-loop speed/torque control of 3-phase BLDC motors in factory automation equipment.

IC Role / Device Role / Timing Role: Real-time executor of FOC algorithms using ADC sampling, PWM generation, and encoder quadrature decoding.

Use Value: XGATE co-processor handles high-frequency encoder interrupts and PWM updates independently - freeing main CPU for PID computation.

Automotive Instrument ClusterSmart Power Distribution Unit

Use Scenario: Digital dashboard rendering gauges, warning indicators, and CAN-sourced vehicle data (RPM, speed, fuel level).

IC Role / Device Role / Timing Role: Display controller interfacing with CAN bus, driving segmented LCD via LCD32F4BV1 module, and managing backlight PWM.

Use Value: On-chip LCD driver supports up to 32×4 segments - eliminates external display controller and reduces interconnect complexity.

Use Scenario: Replacing electromechanical relays with solid-state switching for battery-fed loads (e.g., pumps, fans, solenoids) in EV charging stations.

IC Role / Device Role / Timing Role: Fault-tolerant load manager monitoring current sense (via ADC), detecting overcurrent/short-circuit, and controlling MOSFET gate drivers.

Use Value: Hardware CRC engine and flash ECC support ensure integrity of critical safety firmware - meeting ASIL-B readiness requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XDP512MAL512 KB Flash, 32 KB RAM, identical pinout and peripheral set - higher memory capacity but same 112-LQFP package.Preferred for designs requiring larger bootloaders or dual-application partitioning (e.g., OTA update + active firmware).Select when future firmware growth or secure bootloader space exceeds 256 KB limit.
S912XEQ512J2MAGNXP's later-generation S12XE family part with 512 KB Flash, 32 KB RAM, and enhanced CAN FD support - not pin-compatible; requires PCB redesign.Enables CAN FD communication (5 Mbit/s) and improved power efficiency - suited for next-gen vehicle architectures.Choose only for new designs targeting CAN FD migration; not a drop-in replacement.

Compared with MC9S12XHZ256CAL, MC9S12XDP512MAL offers double Flash/RAM in identical packaging for seamless scalability, while S912XEQ512J2MAG provides modern CAN FD capability at the cost of layout changes and toolchain updates.

Availability

MC9S12XHZ256CAL is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and smart power distribution systems requiring stable component supply across extended product lifecycles.

Supply support for MC9S12XHZ256CAL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S12XHZ256CAL belongs to the HCS12X microcontroller family designed specifically for cost-sensitive, high-reliability automotive applications demanding real-time performance, functional safety features, and long-term supply stability.

FAQ

What is the maximum operating frequency of the MC9S12XHZ256CAL?

The MC9S12XHZ256CAL supports a maximum CPU bus frequency of 50 MHz when using the internal PLL with an external crystal reference. This frequency is achieved with a 4–8 MHz crystal and appropriate PLL multiplication factor (e.g., 12× for 48 MHz). The actual achievable speed depends on voltage supply and temperature conditions specified in the electrical characteristics appendix.

Does the MC9S12XHZ256CAL support CAN FD?

No, the MC9S12XHZ256CAL implements the MSCANV3 module compliant with CAN 2.0A/B only, supporting data rates up to 1 Mbit/s. It does not support CAN FD features such as flexible data-rate switching or extended payload length. For CAN FD capability, consider newer NXP families like S32K or S12XE derivatives.

How much EEPROM is integrated into the MC9S12XHZ256CAL?

The MC9S12XHZ256CAL includes 4 KB of on-chip EEPROM implemented as the S12XEETX4KV2 module. This EEPROM supports byte-level writes, 100,000 write/erase cycles, and data retention exceeding 10 years at 85°C - suitable for storing calibration data, configuration parameters, and fault logs.

What debug interface does the MC9S12XHZ256CAL use?

The MC9S12XHZ256CAL uses the Background Debug Mode (BDM) interface defined by the S12XBDMV2 and S12XDBGV3 modules. It operates over a single-wire physical connection, enabling non-intrusive program download, breakpoint setting, register inspection, and real-time variable monitoring without requiring dedicated JTAG pins or additional debug hardware.

Is the MC9S12XHZ256CAL qualified for automotive applications?

Yes, the MC9S12XHZ256CAL is AEC-Q100 qualified for Grade 2 (-40°C to +105°C) operation and supports functional safety development per ISO 26262 ASIL-B requirements. Its hardware features - including flash ECC, memory protection unit, clock monitor, and COP watchdog - provide foundational safety mechanisms required for automotive body control and powertrain auxiliary functions.

MC9S12XHZ256CAL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
112-LQFP
Series:
HCS12X
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
LCD, Motor control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12XHZ256CAL FAQ

1.How can I place an order for MC9S12XHZ256CAL through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12XHZ256CAL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12XHZ256CAL reliable?

The price and inventory of MC9S12XHZ256CAL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XHZ256CAL is usually 5 days.

3.What payment methods are accepted for MC9S12XHZ256CAL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XHZ256CAL transactions.

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4.How is shipping managed for MC9S12XHZ256CAL?

MC9S12XHZ256CAL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12XHZ256CAL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12XHZ256CAL?

For technical support, including MC9S12XHZ256CAL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XHZ256CAL requirements.

6.How does Aetrix verify that MC9S12XHZ256CAL is sourced from the original manufacturer or authorized distributors?

All MC9S12XHZ256CAL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XHZ256CAL meets industry standards.

7.What is the process for return or replacement of MC9S12XHZ256CAL?

All MC9S12XHZ256CAL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XHZ256CAL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12XHZ256CAL part is unused and in its original packaging.

Return procedure for MC9S12XHZ256CAL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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