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NXP Semiconductors MC9S12XHZ256VAG

Part No.:
MC9S12XHZ256VAG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixMC9S12XHZ256VAG.pdf
Description:
IC MCU 16BIT 256KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,666

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Product details

Overview

MC9S12XHZ256VAG from NXP (formerly Freescale) is a 16-bit HCS12X-family microcontroller featuring 256 KB on-chip Flash, 12 KB RAM, and integrated XGATE co-processor for real-time peripheral offload. It supports CAN 2.0B, SCI, SPI, I²C, 10-bit ADC (16-channel), PWM, ECT, and LCD controller - deployed in automotive body control modules and industrial motor drives.

For engineers reviewing the MC9S12XHZ256VAG datasheet, MC9S12XHZ256VAG pinout, MC9S12XHZ256VAG application, or MC9S12XHZ256VAG equivalent, key selection criteria include its 50 MHz S12X CPU core frequency, 80-pin LQFP package with 64 general-purpose I/Os, dual voltage regulator (3.3 V/5.0 V), and hardware security module supporting flash protection and backdoor key access.

Technical Context

The MC9S12XHZ256VAG implements the S12X CPU core with 5-stage pipeline and enhanced addressing modes, coupled with an independent XGATE RISC co-processor running at up to 64 MHz for autonomous handling of time-critical peripherals including CAN, SCI, and ADC conversions. Its memory subsystem includes 256 KB Flash (with EEPROM emulation), 12 KB RAM, and 4 KB EEPROM with 100K write cycles.

It integrates dedicated hardware blocks: 16-bit Enhanced Capture Timer (ECT) with input capture/output compare, 8-channel PWM with center-aligned mode, 10-bit ATD converter with configurable sample-and-hold, and Freescale's Scalable CAN (MSCAN) with message buffering and flexible filtering - all synchronized via a unified clock and reset architecture with PLL-based system clock generation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreS12X 16-bit core @ 50 MHz max - enables deterministic real-time execution with 5-stage pipeline and 16 MB linear address space.
Flash Memory256 KB on-chip Flash - supports in-application programming (IAP), sector erase, and secure code protection via security byte.
RAM12 KB on-chip RAM - configured as general-purpose SRAM with wait-state-free access at full CPU speed.
EEPROM4 KB EEPROM (S12XEETX4KV2) - provides non-volatile data storage with 100,000 write cycles and 10-year data retention at 85°C.
ADC10-bit ATD10B16CV4 with 16 channels - supports software/hardware-triggered conversion, 8 µs typical conversion time, and configurable resolution/sampling.
CAN InterfaceOne MSCANV3 module - compliant with ISO 11898-1, supports CAN 2.0B protocol, 32-message object buffers, and automatic retransmission.
XGATE Co-processorS12XGATEV2 RISC engine - runs independently at up to 64 MHz, handles peripheral interrupts without CPU intervention, reducing latency by >90% for high-priority tasks.

Pinout & Package

MC9S12XHZ256VAG is housed in an 80-pin LQFP (12 × 12 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per S12XHZPIMV1 port integration module, supporting multiplexed I/O, analog inputs, and dedicated peripheral signals.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD (5.0 V core I/O), VDDA/VSSA (analog 5.0 V), VDDPLL/VSSPLL (PLL supply); decoupling required per PCB layout guidelines.
EXTAL / XTALPierce oscillator terminalsConnect external crystal (1–8 MHz) or ceramic resonator; internal oscillator gain configurable via OSCCTL register.
RESETActive-low reset inputAsynchronous reset signal; internally pulled up; accepts external push-button or supervisor IC assertion.
PORT A–WGeneral-purpose I/O ports64 total GPIOs across 12 ports (A, B, C, D, E, K, L, M, P, S, T, U); each pin supports direction control, pull-up enable, and interrupt-on-change.
CANRX / CANTXCAN transceiver interfaceDedicated differential pair for CAN physical layer connection; requires external transceiver (e.g., MC33886 or TJA1042).
AD0–AD15Analog input channels16-channel 10-bit ADC inputs mapped to PORT A (AD0–AD7) and PORT K (AD8–AD15); support single-ended or differential sampling.

Key Features

FeatureDesign Value
XGATE co-processorOffloads time-critical ISR handling (CAN, SCI, ADC) from main CPU - enables deterministic sub-µs response and frees S12X core for application logic.
Hardware security moduleEnables flash memory protection via security byte; unsecuring requires backdoor key access or BDM in special single-chip mode - prevents unauthorized firmware readout.
Integrated voltage regulatorVREG3V3V5 provides internal 3.3 V for core logic and 5.0 V for I/O - eliminates need for external regulators in cost-sensitive automotive applications.
Background Debug Module (BDM)S12XBDMV2 supports real-time debugging, flash programming, and breakpoint insertion via single-wire interface - no JTAG header required.
LCD controllerLCD32F4BV1 supports up to 32×4 segment drive - enables direct connection to automotive instrument cluster displays without external driver IC.

Applications

Automotive Body Control Unit (BCU)Industrial Motor Drive Controller

Use Scenario: Centralized control of door locks, window lifts, mirrors, and lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing LIN/CAN gateway logic, sensor polling, and actuator PWM timing with <100 µs jitter tolerance.

Use Value: Integrated MSCAN and 8-channel PWM eliminate external CAN transceivers and gate drivers - reducing BOM count and board area by 30%.

Use Scenario: Closed-loop speed/torque control of BLDC motors in HVAC blowers and pump systems.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using ECT timers and ADC sampling synchronized to PWM carrier.

Use Value: XGATE co-processor handles ADC trigger sequencing and current-sense interrupt servicing - freeing CPU for PID computation and communication stack.

Automotive Instrument ClusterIndustrial PLC I/O Module

Use Scenario: Driving segmented LCD displays for speedometer, fuel gauge, and warning indicators.

IC Role / Device Role / Timing Role: Dedicated LCD32F4BV1 controller managing 32×4 segments with built-in bias generation and frame rate control.

Use Value: Eliminates external LCD driver IC and reduces display interface wiring to 4–6 lines - simplifying EMC design and lowering assembly cost.

Use Scenario: Digital input/output expansion for distributed control in factory automation cabinets.

IC Role / Device Role / Timing Role: High-reliability I/O conditioning with programmable slew rate, noise filtering, and interrupt-on-change for sensor/actuator interfacing.

Use Value: 64 GPIOs with configurable pull-ups, polarity inversion, and reduced-drive mode enable direct connection to 24 V industrial sensors without level-shifting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XDP512512 KB Flash, 32 KB RAM, same S12X core and XGATE - but lacks LCD controller and has different CAN/ADC channel count.Better suited for complex gateway or telematics where code size exceeds 256 KB; not suitable for LCD-driven clusters.Select when larger program memory and higher RAM are needed; verify pin compatibility for existing PCB layout.
S912XEQ512J2NXP's later-generation S12XE family part with identical 512 KB Flash, added EEPROM endurance (200K cycles), and improved ESD rating (±8 kV HBM).Targeted at new designs requiring extended lifecycle support and enhanced robustness in harsh environments - not drop-in compatible due to different pinout and register mapping.Choose for new designs prioritizing long-term availability and automotive qualification; migration requires hardware and firmware adaptation.

Compared with MC9S12XDP512 and S912XEQ512J2, the MC9S12XHZ256VAG offers optimal balance of integrated peripherals (LCD, CAN, XGATE) and memory for cost-constrained automotive body electronics - while retaining legacy toolchain compatibility and mature production support.

Availability

MC9S12XHZ256VAG is available at Aetrix Electronics and suitable for automotive body control units, industrial motor drives, and instrument cluster displays requiring stable component supply and long-lifecycle assurance.

Supply support for MC9S12XHZ256VAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep heritage in microcontroller innovation.

The MC9S12XHZ256VAG belongs to the HCS12X family - designed specifically for automotive body electronics and industrial control applications demanding real-time performance, functional safety readiness, and high peripheral integration.

FAQ

What is the maximum operating frequency of the MC9S12XHZ256VAG?

The MC9S12XHZ256VAG features an S12X CPU core rated for up to 50 MHz operation, achieved via internal PLL multiplication of an external crystal (1–8 MHz). The XGATE co-processor operates independently at up to 64 MHz. Both frequencies are validated under automotive temperature range (−40°C to +125°C) and meet AEC-Q100 Grade 2 requirements. System clock stability is maintained through integrated clock monitor and fail-safe reset circuitry.

Does the MC9S12XHZ256VAG support in-circuit debugging?

Yes, the MC9S12XHZ256VAG includes the Background Debug Module (S12XBDMV2), enabling single-wire in-circuit debugging, flash programming, and real-time variable monitoring without halting CPU execution. It supports standard BDM protocols and is compatible with P&E Micro and Segger J-Link adapters via BDM interface. No external JTAG header is required, simplifying board layout and test fixture design for the MC9S12XHZ256VAG.

How is flash memory secured on the MC9S12XHZ256VAG?

Flash security on the MC9S12XHZ256VAG is implemented via a dedicated security byte in the flash configuration field. When set, it disables read/write/erase access to protected memory regions and disables background debug access. Unsecuring requires either successful backdoor key entry (via specific 8-byte sequence written to flash during reset) or use of BDM in Special Single Chip Mode - both methods are documented in the S12X9SECV2 security module section of the MC9S12XHZ256VAG datasheet.

What peripheral interfaces does the MC9S12XHZ256VAG include?

The MC9S12XHZ256VAG integrates CAN 2.0B (MSCANV3), two SCI modules, one SPI interface, I²C bus controller (IICV3), 16-channel 10-bit ADC (ATD10B16CV4), 8-channel PWM (PWM8B8CV1), 16-bit Enhanced Capture Timer (ECT16B8CV3), LCD controller (LCD32F4BV1), and stepper stall detector (SSDV1). All peripherals share common clock/reset domains and support XGATE-assisted interrupt handling for deterministic latency control in the MC9S12XHZ256VAG.

Is the MC9S12XHZ256VAG pin-compatible with other HCS12X devices?

No, the MC9S12XHZ256VAG is not pin-compatible with other HCS12X variants such as MC9S12XDP512 or MC9S12XEP100 due to differences in peripheral mapping, I/O multiplexing, and package-specific signal assignments. While all share the 80-pin LQFP footprint, pin functions for CAN, ADC, and LCD differ significantly. Migration requires PCB redesign and firmware adaptation - verified against the MC9S12XHZ256VAG pinout diagram in Chapter 1.2.1 of its official datasheet.

MC9S12XHZ256VAG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
HCS12X
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
LCD, Motor control PWM, POR, PWM, WDT
Number of I/O:
117
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S12XHZ256VAG FAQ

1.How can I place an order for MC9S12XHZ256VAG through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S12XHZ256VAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S12XHZ256VAG reliable?

The price and inventory of MC9S12XHZ256VAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S12XHZ256VAG is usually 5 days.

3.What payment methods are accepted for MC9S12XHZ256VAG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S12XHZ256VAG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S12XHZ256VAG?

MC9S12XHZ256VAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S12XHZ256VAG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S12XHZ256VAG?

For technical support, including MC9S12XHZ256VAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S12XHZ256VAG requirements.

6.How does Aetrix verify that MC9S12XHZ256VAG is sourced from the original manufacturer or authorized distributors?

All MC9S12XHZ256VAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S12XHZ256VAG meets industry standards.

7.What is the process for return or replacement of MC9S12XHZ256VAG?

All MC9S12XHZ256VAG units undergo pre-shipment inspection (PSI). If there is an issue with MC9S12XHZ256VAG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S12XHZ256VAG part is unused and in its original packaging.

Return procedure for MC9S12XHZ256VAG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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