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NXP Semiconductors MCF51AC256BVFUE

Part No.:
MCF51AC256BVFUE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-QFP
Datasheet:
AetrixMCF51AC256BVFUE.pdf
Description:
IC MCU 32BIT 256KB FLASH 64QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,992

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Product details

Overview

MCF51AC256BVFUE from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire V1 microcontroller without CAN interface, housed in a 64-pin QFP package (14 mm × 14 mm), operating up to 50.33 MHz at 2.7–5.5 V supply, featuring 256 KB flash, 32 KB SRAM, 24-channel 12-bit ADC, and dual flexible timer modules - deployed in industrial motor control and sensor fusion edge nodes.

For engineers reviewing the MCF51AC256BVFUE datasheet, MCF51AC256BVFUE pinout, MCF51AC256BVFUE application, or MCF51AC256BVFUE equivalent, key selection considerations include its CAN-free configuration, 64-pin QFP mechanical footprint, V1 ColdFire ISA_C instruction set compliance, and support for real-time debug via single-wire BDM - critical for legacy ColdFire migration and cost-optimized embedded control.

Technical Context

The MCF51AC256BVFUE implements the ColdFire V1 core with instruction set revision C (ISA_C), delivering 0.76 DMIPS/MHz when executing from flash and 0.94 DMIPS/MHz from SRAM. Its multipurpose clock generator (MCG) supports FLL/PLL operation with trimmable internal reference (0.2% resolution), crystal oscillator (1–16 MHz), and independent LPO for COP/RTI.

It integrates two flexible timer modules (FTM1 and FTM2) supporting input capture, output compare, edge-aligned and center-aligned PWM, deadtime insertion, and hardware-triggered ADC conversions. The 24-channel 12-bit ADC operates asynchronously for low-noise acquisition and includes on-chip temperature sensing and automatic threshold comparison with interrupt generation.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureColdFire V1 32-bit RISC CPU, ISA_C compliant, no CAN peripheral
Max Core Frequency50.33 MHz - enables deterministic real-time control loops at sub-20 ns instruction timing
Flash / SRAM256 KB flash / 32 KB SRAM - sufficient for complex firmware with secure boot and field-upgrade capability
ADC Resolution & Channels12-bit, 24-channel - supports simultaneous sampling across multiple analog sensors in motor feedback systems
Timer ModulesFTM1 (6-channel) + FTM2 (2-channel) - provides synchronized PWM generation with deadtime for 3-phase inverter gate drives
Package64-pin QFP, 14 mm × 14 mm - compatible with standard wave-solder reflow profiles and industrial PCB layouts
Operating Temp–40°C to +105°C - qualified for under-hood automotive and industrial ambient environments
I/O Count69 GPIOs including 16 Rapid GPIO pins - enables direct high-speed bit manipulation for protocol emulation or LED matrix control

Pinout & Package

Package: 64-pin QFP, 14 mm × 14 mm, 0.8 mm pitch, RoHS-compliant (Pb-free).

Pin/TerminalCircuit RoleDesign Meaning
PTF0 / RGPIO8 / FTM1CH2Flexible Timer Channel 2 outputConfigurable as PWM output or input capture - used for motor phase timing or encoder pulse counting
PTF1 / RGPIO9 / FTM1CH3Flexible Timer Channel 3 outputPaired with FTM1CH2 for complementary PWM with programmable deadtime in inverter applications
PTF2 / RGPIO10 / FTM1CH4Flexible Timer Channel 4 outputSupports center-aligned PWM mode - reduces EMI in variable-frequency drive outputs
PTF3 / RGPIO11 / FTM1CH5Flexible Timer Channel 5 outputHardware-triggered ADC start - enables precise synchronization between PWM edge and analog sampling
PTF4 / RGPIO12 / FTM2CH0Flexible Timer 2 Channel 0Dedicated timer channel for auxiliary timing tasks (e.g., watchdog timeout or communication framing)
PTF5 / RGPIO13 / FTM2CH1Flexible Timer 2 Channel 1Independent of FTM1 - allows concurrent high-resolution timing for safety monitoring or diagnostics
PTE0 / RGPIO0 / TxD1SCI1 Transmit DataFull-duplex UART interface - supports LIN bus physical layer or RS-232 debugging without external level shifters
PTE1 / RGPIO1 / RxD1SCI1 Receive DataDouble-buffered receiver with idle-line wakeup - enables low-power listening in battery-operated sensor nodes
PTD0 / AD1P8 / ACMP1+Analog Comparator 1 positive inputRail-to-rail input - accepts direct connection to thermistor or current-sense amplifier outputs
PTD1 / AD1P9 / ACMP1−Analog Comparator 1 negative inputSupports internal bandgap reference (1.2 V) - enables overvoltage or undervoltage detection without external components
PTA0 / TxCANCAN Transmit (not available)Pin is unconnected - confirmed by device comparison table and part number suffix 'B' indicating CAN-disabled variant
PTA1 / RxCANCAN Receive (not available)No internal connection - eliminates need for external pull-up or termination on these pins in PCB layout
BKGD / MSBackground Debug / Master SelectSingle-wire debug interface - enables full JTAG-equivalent debug with minimal PCB routing overhead
RESETActive-low reset inputDebounced internally - supports manual reset button or power-on reset circuitry with RC network
VDD / VSSPower supply / GroundMultiple dedicated VDD/VSS pairs - ensures stable core and I/O rail decoupling for noise-sensitive analog operation

Key Features

FeatureDesign Value
Single-wire BDM debugEnables real-time trace, 6 hardware breakpoints, and on-chip trace buffer - reduces debug probe cost and board space vs. multi-pin JTAG
16-bit Rapid GPIODirect access to processor local bus - achieves sub-cycle I/O toggle (≤20 ns) for bit-banged protocols like 1-Wire or custom sensor interfaces
Hardware CRC generator16-bit CRC-CCITT (x¹⁶+x¹²+x⁵+1) acceleration - offloads checksum computation from CPU during firmware OTA updates or CAN message validation
Low-power stop modesThree stop modes with selective peripheral clock gating - extends battery life in wireless sensor nodes while retaining RAM and RTC state
On-chip temperature sensorCalibrated ±3°C accuracy - enables thermal derating of motor drivers or fan speed control without external ICs
Programmable slew rateConfigurable drive strength per pin - minimizes EMI in high-speed digital interfaces and prevents signal integrity issues on long traces

Applications

Industrial Motor ControlSmart Sensor Node

Use Scenario: Closed-loop control of BLDC motors in HVAC blowers and pump drives using six-step commutation.

IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms, generating synchronized 3-phase PWM via FTM1/FTM2, and sampling current/voltage via 24-channel ADC.

Use Value: Eliminates external PWM generator and ADC ICs; 50.33 MHz core enables <10 µs loop execution time for responsive torque control.

Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and CO₂ with local data preprocessing.

IC Role / Device Role / Timing Role: System-on-chip host managing sensor I²C/SPI interfaces, performing ADC conversions, and transmitting compressed data via SCI to gateway.

Use Value: Integrated 32 KB SRAM stores sensor history; low-power stop modes extend 10-year battery life; on-chip temperature sensor calibrates other sensors.

Automotive Body ElectronicsIndustrial PLC I/O Module

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with LIN bus communication.

IC Role / Device Role / Timing Role: LIN master node using SCI1 with automatic wakeup, driving relays and LEDs via Rapid GPIO, and monitoring switches via KBI.

Use Value: Single-wire BDM simplifies production programming; 69 GPIOs consolidate discrete logic; –40°C to +105°C rating meets OEM under-dash requirements.

Use Scenario: DIN-rail mounted digital I/O expansion unit interfacing with 24 V industrial sensors and actuators.

IC Role / Device Role / Timing Role: Real-time I/O aggregator with configurable debounce, hardware PWM for valve control, and CRC-protected Modbus RTU over SCI2.

Use Value: FTM deadtime insertion prevents shoot-through in solenoid drivers; integrated LVD detects brown-out before PLC fault shutdown.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCF51AC256AVFUEIdentical package, flash, SRAM, and core - includes CAN 2.0B controller and TxCAN/RxCAN pinsRequired for networks requiring CAN bus integration (e.g., vehicle subsystems, distributed control)Select when CAN communication is mandatory; otherwise MCF51AC256BVFUE reduces BOM cost and simplifies layout by omitting CAN termination and filtering
Kinetis K22FN512VLH12ARM Cortex-M4F core, 120 MHz, 512 KB flash, 128 KB SRAM, no ColdFire ISA compatibilityTargets new designs needing higher performance, DSP extensions, or modern toolchain support (MCUXpresso)Choose for greenfield projects prioritizing ecosystem longevity; avoid for ColdFire codebase porting due to architectural incompatibility

Compared with MCF51AC256AVFUE, the MCF51AC256BVFUE removes CAN hardware to reduce cost and die size while retaining identical timing, memory, and peripheral capabilities for standalone control. Against Kinetis K22FN512VLH12, it offers proven ColdFire toolchain continuity and lower power at 50 MHz but lacks floating-point and modern security features.

Availability

MCF51AC256BVFUE is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, automotive body electronics, and PLC I/O modules requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MCF51AC256BVFUE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, formed from the spin-off of Freescale Semiconductor in 2015.

The MCF51AC256 series belongs to NXP's legacy ColdFire microcontroller portfolio, designed specifically for cost-sensitive, high-reliability embedded control applications requiring deterministic real-time performance and long-term supply stability.

FAQ

What is the maximum operating frequency of the MCF51AC256BVFUE?

The MCF51AC256BVFUE operates at a maximum core frequency of 50.33 MHz across its full voltage range (2.7 V to 5.5 V). This speed is achievable with the internal FLL or PLL enabled using an external crystal (1–16 MHz) or internal reference. Performance is verified per Freescale Document Number MCF51AC256 Rev.7, Section 1.3.1, and supports 0.76 DMIPS/MHz when executing from flash memory. The MCF51AC256BVFUE maintains timing compliance under all specified temperature conditions (–40°C to +105°C).

Does the MCF51AC256BVFUE include a CAN interface?

No, the MCF51AC256BVFUE does not include a CAN interface. The 'B' in the part number explicitly denotes the CAN-disabled variant, confirmed in Table 1 (Device Comparison) and Section 1.4 (Part Numbers) of the MCF51AC256 datasheet Rev.7. Pins PTA0 (TxCAN) and PTA1 (RxCAN) are unconnected in this version, eliminating the need for CAN transceivers, termination resistors, or filtering components in the design. For CAN-enabled operation, use MCF51AC256AVFUE instead.

What package type and dimensions does the MCF51AC256BVFUE use?

The MCF51AC256BVFUE uses a 64-pin QFP package measuring 14 mm × 14 mm with 0.8 mm lead pitch, as documented in Figure 3 and Table 22 (Package Information) of the MCF51AC256 Rev.7 datasheet. It is RoHS-compliant and Pb-free. This package is mechanically identical to the 64-pin LQFP variant (MCF51AC256BVPUE) but differs in lead finish and moisture sensitivity level - both share identical pinout and thermal characteristics.

How much flash and SRAM memory does the MCF51AC256BVFUE provide?

The MCF51AC256BVFUE integrates 256 KB of on-chip flash memory and 32 KB of static RAM (SRAM), as specified in Table 1 (Device Comparison) and Section 1.3.1 of the MCF51AC256 Rev.7 datasheet. Flash supports read/program/erase over full operating voltage and temperature ranges, with block protection for secure firmware storage. SRAM retains full functionality in all low-power stop modes, enabling fast context switching and real-time data buffering without external memory.

What debug interface does the MCF51AC256BVFUE support?

The MCF51AC256BVFUE supports a single-wire background debug mode (BDM) interface via the BKGD/MS pin, providing full real-time debug capability including 6 hardware breakpoints (4 PC, 1 address pair, 1 data), on-chip trace buffer, and debug visibility bus (VBUS) for program trace. This interface is part of the ColdFire V1 core architecture and requires only one PCB trace - no JTAG header or multi-pin connector needed. Debug tools include P&E Multilink and CodeWarrior IDE.

MCF51AC256BVFUE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-QFP
Series:
MCF51AC
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF51AC256BVFUE FAQ

1.How can I place an order for MCF51AC256BVFUE through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF51AC256BVFUE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF51AC256BVFUE reliable?

The price and inventory of MCF51AC256BVFUE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF51AC256BVFUE is usually 5 days.

3.What payment methods are accepted for MCF51AC256BVFUE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF51AC256BVFUE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF51AC256BVFUE?

MCF51AC256BVFUE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF51AC256BVFUE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF51AC256BVFUE?

For technical support, including MCF51AC256BVFUE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF51AC256BVFUE requirements.

6.How does Aetrix verify that MCF51AC256BVFUE is sourced from the original manufacturer or authorized distributors?

All MCF51AC256BVFUE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF51AC256BVFUE meets industry standards.

7.What is the process for return or replacement of MCF51AC256BVFUE?

All MCF51AC256BVFUE units undergo pre-shipment inspection (PSI). If there is an issue with MCF51AC256BVFUE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF51AC256BVFUE part is unused and in its original packaging.

Return procedure for MCF51AC256BVFUE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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