NXP Semiconductors MCF5207CVM166

Overview

MCF5207CVM166 from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire v2 RISC microprocessor in 144-ball MAPBGA packaging, operating at up to 166.67 MHz core clock with 16 KB on-chip SRAM, 8 KB configurable cache, and dual-bank SDR/DDR SDRAM controller - deployed in industrial connectivity gateways requiring deterministic real-time control and memory-mapped peripheral access.

For engineers reviewing the MCF5207CVM166 datasheet, MCF5207CVM166 pinout, MCF5207CVM166 application, or MCF5207CVM166 equivalent, key selection criteria include its 144 MAPBGA footprint, absence of integrated Fast Ethernet Controller (FEC), support for three UARTs and queued SPI, and compatibility with industrial temperature range (–40°C to +85°C) designs.

Technical Context

The MCF5207CVM166 implements the ColdFire v2 instruction set architecture with enhanced multiply-accumulate (EMAC) unit, enabling efficient signal processing in embedded control loops. Its memory subsystem integrates a 2-bank SDR/DDR SDRAM controller supporting both SDR and DDR modes via DRAMSEL pin configuration, and a 16-channel DMA engine for offloading data transfers from the CPU.

Peripheral integration includes three UARTs (with hardware flow control), I²C, QSPI, four 32-bit periodic interrupt timers (PIT), watchdog timer (WDT), edge port module (EPORT), and JTAG/IEEE 1149.1 debug interface - all accessible through multiplexed I/O pins managed by GPIO and alternate function registers.

Key Specifications

Pinout & Package

Package: 144-ball MAPBGA (12 × 12 mm, 0.8 mm pitch), RoHS-compliant, thermally enhanced with exposed thermal pad (not electrically connected).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5207CAG166, the MCF5207CVM166 delivers superior thermal performance and routing density in compact industrial modules; compared with MCF5208CVM166, it avoids FEC-related complexity and power overhead when Ethernet is handled externally.

Availability

MCF5207CVM166 is available at Aetrix Electronics and suitable for industrial PLC communication modules, smart energy gateways, and factory automation HMI controllers requiring stable component supply across extended product lifecycles.

Supply support for MCF5207CVM166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MCF5207 belongs to NXP's ColdFire microprocessor family, designed specifically for deterministic real-time control in resource-constrained industrial systems where code efficiency, peripheral integration, and long-term supply stability are critical.

FAQ

What is the maximum operating frequency of the MCF5207CVM166?

The MCF5207CVM166 operates at a maximum core clock frequency of 166.67 MHz, delivering up to 159 Dhrystone 2.1 MIPS. This frequency is achieved using an external crystal oscillator (XTAL) or clock source (EXTAL) feeding the on-chip PLL, which must be configured with appropriate multiplication and division ratios per the reference manual. The MCF5207CVM166 does not support dynamic frequency scaling - the core clock is fixed at power-on unless reconfigured via software.

Does the MCF5207CVM166 include an integrated Ethernet controller?

No, the MCF5207CVM166 does not include a Fast Ethernet Controller (FEC). Unlike the MCF5208 series, the MCF5207 variant omits the FEC module entirely. Ethernet connectivity must be implemented externally using a discrete PHY IC interfaced via the FlexBus or a serial interface. The MCF5207CVM166 pinout reserves no pins for FEC signals, and the reference manual confirms FEC is absent from its peripheral set.

What package type and dimensions does the MCF5207CVM166 use?

The MCF5207CVM166 uses a 144-ball MAPBGA package measuring 12 mm × 12 mm with 0.8 mm ball pitch. It features an exposed thermal pad on the underside (non-electrical) to enhance heat dissipation. This package is distinct from the 144-pin LQFP variant (MCF5207CAG166) and is optimized for high-density PCB layouts and improved thermal performance in industrial applications.

How much on-chip memory does the MCF5207CVM166 provide?

The MCF5207CVM166 integrates 16 KB of on-chip static RAM (SRAM) and an 8 KB configurable instruction/data cache. The SRAM is directly accessible by the CPU with zero wait states and is commonly used for stack, heap, and critical variables. The cache operates transparently to improve instruction fetch and data access efficiency - particularly beneficial for code executing from external SDRAM or flash memory.

What are the supported SDRAM types for the MCF5207CVM166 controller?

The MCF5207CVM166 SDRAM controller supports both single-data-rate (SDR) SDRAM and double-data-rate (DDR) SDRAM, selectable via the DRAMSEL pin. In SDR mode (DRAMSEL high), it drives standard PC100/PC133 SDRAM; in DDR mode (DRAMSEL low), it supports DDR-200/DDR-266 devices. The controller manages all timing parameters, refresh cycles, and bank activation automatically - no external SDRAM controller logic is required.