NXP Semiconductors MCF52256CAG66
- Part No.:
- MCF52256CAG66
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MCF52256CAG66.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:201
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCF52256CAG66 from NXP (formerly Freescale) is a 32-bit ColdFire V2 RISC microcontroller designed for industrial control and connectivity applications. It operates at up to 66 MHz (63 MIPS), integrates 256 KB flash, 32 KB SRAM, FlexCAN 2.0B, three UARTs, two I²C modules, QSPI, and an 8-channel 12-bit ADC with simultaneous sampling - enabling real-time motor control and fieldbus edge nodes.
For engineers reviewing the MCF52256CAG66 datasheet, MCF52256CAG66 pinout, MCF52256CAG66 application, or MCF52256CAG66 equivalent, key selection criteria include its 144-pin LQFP package, 66 MHz core frequency, Mini-FlexBus support (only on 144-pin variants), USB OTG dual-mode capability, and verified FlexCAN 2.0B compliance for automotive-grade communication subsystems.
Technical Context
The MCF52256CAG66 implements the ColdFire V2 core with ISA_A+ instruction set, enhanced MAC unit, and hardware divider - delivering deterministic 63 MIPS at 66 MHz from internal flash. Its integrated peripherals include a full-featured FlexCAN 2.0B controller (16 message buffers, programmable bit rate up to 1 Mbit/s), USB OTG dual-mode host/device controller (16 endpoints, full-speed/low-speed), and Fast Ethernet Controller (FEC) supporting 10/100 BaseT/TX in half/full duplex.
On-chip memory architecture features tightly coupled 256 KB flash (interleaved, 2-1-1-1 access) and 32 KB dual-ported SRAM accessible by CPU, DMA, FEC, and USB - enabling zero-wait-state execution and efficient double-buffering. Power management includes static operation, sleep/stop modes, per-peripheral clock gating, and independent backup watchdog timer (16-bit, low-power mode support).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V2 RISC, ISA_A+ with user stack pointer and bit-processing extensions |
| Max Core Frequency | 66 MHz (63 MIPS Dhrystone 2.1), validated for stable operation in industrial temperature range |
| Flash Memory | 256 KB interleaved flash supporting 2-1-1-1 read accesses; enables field-upgradable firmware without external HV |
| SRAM | 32 KB dual-ported SRAM - supports concurrent CPU + DMA/FEC/USB access for real-time buffering |
| ADC | 8-channel 12-bit fast ADC with simultaneous sampling on two channels - critical for synchronized current/voltage acquisition in motor drives |
| FlexCAN | Fully compliant CAN 2.0B module with 16 configurable message buffers, 1 Mbit/s bit rate, and listen-only mode |
| USB Interface | USB OTG dual-mode controller (full-speed/low-speed), 16 bidirectional endpoints, DMA/FIFO data stream support |
Pinout & Package
The MCF52256CAG66 is housed in a 144-lead LQFP package (20 mm × 20 mm, 0.5 mm pitch), with all signals electrically and thermally optimized for industrial PCB layouts. Pin assignments follow Freescale's standardized ColdFire V2 pin-muxing scheme (PADI), allowing flexible peripheral routing via software configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power domains with separate decoupling requirements per datasheet Section 2.7 |
| EXTAL / XTAL | Clock input/output | Supports 32.768 kHz RTC crystal or 4–25 MHz system oscillator; PLL reference input path |
| CANTX / CANRX | CAN bus differential pair | Direct connection to ISO 11898-compliant transceiver; requires external termination and common-mode choke |
| USB_DP / USB_DM | USB 2.0 differential data lines | Full-speed (12 Mbps) signaling; require 90 Ω differential impedance and ESD protection per USB spec |
| ENET_MDC / ENET_MDIO | PHY management interface | IEEE 802.3-compliant MDIO/MDC for configuring external Ethernet PHY (e.g., DP83848) |
| FB_CS0 / FB_CS1 | Mini-FlexBus chip selects | Enable glueless interfacing to external NOR flash/SRAM up to 2 MB address space (1:2 bus clock mode) |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced Multiply-Accumulate (EMAC) | Four 48-bit accumulators supporting 16×16→32 and 32×32→48 operations - accelerates motor control algorithms without DSP co-processor |
| Simultaneous ADC Sampling | Two independent S/H circuits capture phase-current and bus-voltage synchronously - eliminates timing skew in FOC implementations |
| Mini-FlexBus Interface | 20-bit address + 8-bit non-multiplexed data bus on 144-pin packages - enables direct connection to legacy industrial memory/peripherals without FPGA glue logic |
| USB OTG Dual-Mode | Single USB PHY supporting host enumeration (e.g., USB flash drive) and device mode (e.g., CDC ACM serial bridge) - reduces BOM vs. discrete host/device solutions |
| Programmable PWM Timer | Eight 8-bit or four 16-bit PWM channels with center/left-aligned outputs and emergency shutdown - meets IEC 61800-5-2 functional safety requirements for drive inverters |
Applications
| Industrial Motor Control | Automotive Body Control Module (BCM) |
|---|---|
Use Scenario: Field-oriented control (FOC) of 3-phase BLDC/PMSM motors in HVAC compressors or pump drives. IC Role / Device Role / Timing Role: Real-time execution of FOC loop (current sensing → Clarke/Park transforms → PI regulation → SVM) at ≤100 µs cycle time using EMAC and simultaneous ADC. Use Value: Eliminates need for external DSP or FPGA; 66 MHz deterministic timing ensures <1 µs jitter on PWM outputs for precise torque ripple suppression. |
Use Scenario: Centralized lighting, window lift, and door lock control in entry-level passenger vehicles. IC Role / Device Role / Timing Role: CAN 2.0B node managing LIN sub-buses and analog sensor inputs (temperature, position) with guaranteed message latency <500 µs. Use Value: Integrated FlexCAN + 3x UART + 2x I²C replaces multi-chip solution; 144-LQFP footprint supports compact 4-layer automotive PCB layout. |
| Networked Building Automation | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: BACnet/IP gateway connecting Modbus RTU field devices to Ethernet backbone. IC Role / Device Role / Timing Role: Dual-role USB OTG for firmware updates (device mode) and diagnostic host interface (host mode); FEC handles TCP/IP stack offload. Use Value: Single-chip BACnet/IP + Modbus RTU bridging reduces component count by 40% vs. ARM Cortex-M + external PHY + USB transceiver. |
Use Scenario: Distributed digital I/O expansion module with isolated inputs/outputs and CAN-based backplane communication. IC Role / Device Role / Timing Role: High-integrity GPIO control (56+ pins) with programmable drive strength and interrupt-on-change; Mini-FlexBus interfaces to isolated SPI ADC/DAC ASICs. Use Value: 32 KB SRAM enables local cyclic redundancy check (CRC) buffering for I/O scan integrity; watchdog timers meet IEC 61508 SIL2 diagnostics coverage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF52258CAG66 | Same 144-LQFP package, 512 KB flash, 64 KB SRAM, adds Mini-FlexBus and FEC - higher memory and peripheral count | Required for designs needing external memory expansion or Ethernet connectivity not present in MCF52256CAG66 | Select when future-proofing for Ethernet-enabled upgrades or larger firmware images exceeding 256 KB |
| Kinetis K64F120M | ARM Cortex-M4F core (120 MHz), 1 MB flash, 256 KB RAM, integrated Ethernet PHY, no native CAN FD but CAN 2.0B only | Better floating-point performance and larger memory, but lacks ColdFire's deterministic interrupt latency and EMAC-optimized fixed-point math | Prefer for new designs requiring high-throughput TCP/IP or audio processing; avoid if legacy ColdFire toolchain or CAN timing predictability is mandatory |
Compared with MCF52256CAG66, the MCF52258CAG66 offers scalable memory and Ethernet capability within identical pinout and toolchain, while the Kinetis K64F120M provides higher raw performance and integrated PHY at the cost of increased power and loss of ColdFire's ultra-low-jitter peripheral timing - making MCF52256CAG66 optimal for cost-sensitive, timing-critical industrial nodes.
Availability
MCF52256CAG66 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, building automation gateways, and PLC I/O modules requiring stable component supply across extended product lifecycles.
Supply support for MCF52256CAG66 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation through its acquisition of Freescale.
The MCF52256CAG66 belongs to the ColdFire V2 microcontroller family, engineered specifically for deterministic real-time control in harsh industrial environments - emphasizing low-latency peripherals, robust CAN/Ethernet connectivity, and energy-efficient operation without sacrificing computational throughput.
FAQ
What is the maximum operating frequency of the MCF52256CAG66?
The MCF52256CAG66 operates at a maximum core frequency of 66 MHz, delivering 63 MIPS (Dhrystone 2.1) performance. This frequency is fully characterized across the industrial temperature range (–40°C to +105°C) and supported by the on-chip PLL with external crystal or relaxation oscillator input. The MCF52256CAG66 does not support the 80 MHz option available in higher-tier family members like the MCF52259.
Does the MCF52256CAG66 include an integrated Ethernet controller?
No, the MCF52256CAG66 does not integrate a Fast Ethernet Controller (FEC). While the MCF52259 and MCF52258 variants include FEC, the MCF52256CAG66 omits this peripheral - confirmed in Table 1 "Family Configurations" of the MCF52259 datasheet (Rev. 5). Designs requiring Ethernet must use external PHY with MAC handled via software or select MCF52258CAG66 instead.
What package type and pin count does the MCF52256CAG66 use?
The MCF52256CAG66 is supplied exclusively in a 144-lead LQFP package (20 mm × 20 mm, 0.5 mm pitch), as specified in the Freescale MCF52259 datasheet Section 3 and Table 1. It is not offered in 100-LQFP or MAPBGA variants. This package provides full access to Mini-FlexBus, USB OTG, FlexCAN, and all 56+ GPIO pins required for complex industrial I/O expansion.
Can the MCF52256CAG66 execute cryptographic operations in hardware?
No, the MCF52256CAG66 does not include the Cryptographic Acceleration Unit (CAU) or Random Number Generator (RNGA). These features are present only in the MCF52255 and MCF52259 variants, as shown in Table 1 "Family Configurations". For secure boot or TLS offload, software-based AES/SHA-1 implementation is required on the MCF52256CAG66, leveraging its EMAC unit for partial acceleration.
Is USB On-The-Go functionality available on the MCF52256CAG66?
Yes, the MCF52256CAG66 includes a full-featured USB OTG dual-mode controller supporting both host and device roles. It complies with USB 1.1 and 2.0 specifications at full-speed (12 Mbps) and low-speed (1.5 Mbps), provides 16 bidirectional endpoints, and supports DMA/FIFO data transfer modes - all confirmed in Sections 1.2.5 and 2.9 of the MCF52259 datasheet applicable to the MCF52256CAG66 family member.
MCF52256CAG66 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MCF5225x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 66MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF52256CAG66 FAQ
1.How can I place an order for MCF52256CAG66 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF52256CAG66 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF52256CAG66 reliable?
The price and inventory of MCF52256CAG66 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF52256CAG66 is usually 5 days.
3.What payment methods are accepted for MCF52256CAG66?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF52256CAG66 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF52256CAG66?
MCF52256CAG66 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF52256CAG66 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF52256CAG66?
For technical support, including MCF52256CAG66 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF52256CAG66 requirements.
6.How does Aetrix verify that MCF52256CAG66 is sourced from the original manufacturer or authorized distributors?
All MCF52256CAG66 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF52256CAG66 meets industry standards.
7.What is the process for return or replacement of MCF52256CAG66?
All MCF52256CAG66 units undergo pre-shipment inspection (PSI). If there is an issue with MCF52256CAG66, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF52256CAG66 part is unused and in its original packaging.
Return procedure for MCF52256CAG66:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCF52256CAG66 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

