NXP Semiconductors MCF52277CVM160
- Part No.:
- MCF52277CVM160
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LBGA
- Datasheet:
-
MCF52277CVM160.pdf
- Description:
- IC MCU 32BIT ROMLESS 196MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:559
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Product details
Overview
MCF52277CVM160 from NXP Semiconductors (formerly Freescale) is a ColdFire® Version 2 RISC microprocessor with integrated EMAC, delivering up to 159 Dhrystone 2.1 MIPS at 166.67 MHz. It features 128 Kbytes of on-chip SRAM, an 8 Kbyte configurable cache, and a 196-pin MAPBGA package (15 mm × 15 mm). It targets industrial HMI, portable medical devices, and embedded control systems requiring LCD display, USB OTG, and real-time CAN communication.
For engineers reviewing the MCF52277CVM160 datasheet, MCF52277CVM160 pinout, MCF52277CVM160 application, or MCF52277CVM160 equivalent, key selection criteria include its 166.67 MHz core clock, 196 MAPBGA footprint, FlexCAN 2.0B support, 18-bit LCD controller (up to 800×600), and dual voltage domains (IVDD = 1.5 V, EVDD = 3.3 V).
Technical Context
The MCF52277CVM160 implements a ColdFire V2 core with hardware-enhanced multiply-accumulate (EMAC) and crossbar switch (XBS) architecture enabling concurrent access to peripherals and memory by multiple bus masters. Its memory subsystem includes a 16-bit SDR/DDR controller and 128 Kbytes of tightly coupled SRAM.
Peripherals are organized via a peripheral bridge with dedicated modules: USB 2.0 On-The-Go controller, FlexCAN 2.0B module, 3 UARTs, I²C, DSPI, SSI, 4 DMA timers, RTC, and an integrated ADC/touchscreen controller. All I/O pins are multiplexed across GPIO, peripheral, and debug functions, with configurable pull-up/down and voltage-domain isolation (EVDD, SDVDD, IVDD).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire Version 2 with EMAC - enables deterministic real-time control and signal processing in motor drives and industrial automation. |
| Max Core Frequency | 166.67 MHz - supports high-throughput data handling for USB file transfer and LCD refresh at 800×600@60 Hz. |
| On-chip Memory | 128 Kbytes SRAM + 8 Kbytes configurable cache - eliminates need for external RAM in many HMI and portable applications. |
| Display Support | 18-bit LCD controller (800×600) - directly drives color TFT panels without external timing logic or frame buffer. |
| USB Interface | USB 2.0 On-The-Go - allows device-role switching between host and peripheral modes for field service and firmware updates. |
| Real-time Peripherals | FlexCAN 2.0B + 4 DMA timers + RTC - meets deterministic latency requirements for automotive diagnostics and industrial networking. |
| Package | 196-pin MAPBGA, 15 mm × 15 mm - provides compact layout for space-constrained portable equipment with thermal resistance θJA = 38°C/W (4-layer board). |
Pinout & Package
Package: 196-ball MAPBGA (15 mm × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_A[23:0] | FlexBus Address Bus | 24-bit address output for external memory mapping; supports booting from SPI flash or parallel NOR/NAND via FlexBus interface. |
| FB_D[31:0] | FlexBus Data Bus | 32-bit bidirectional data path; enables high-speed interfacing to FPGA co-processors or legacy peripherals. |
| SD_A[10:0], SD_DQM[3:0], SD_CS0 | SDRAM Controller Signals | Direct connection to 16-bit SDR/DDR SDRAM; no external glue logic required for memory expansion. |
| USB_DP / USB_DM | USB 2.0 Differential Pair | Full-speed (12 Mbps) USB OTG interface; requires only series 27 Ω resistors and 15 kΩ pull-down on DM for device mode. |
| LCD_D[17:0], LCD_LSCLK, LCD_FLM/VSYNC | LCD Timing & Data Outputs | 18-bit RGB interface with programmable pixel clock and sync signals - supports direct drive of passive/active matrix displays. |
| IVDD, EVDD, SDVDD | Power Supply Domains | Three independent supplies: IVDD (1.5 V core), EVDD (3.3 V I/O), SDVDD (1.8 V memory) - require separate filtering per datasheet Section 3.1–3.3. |
Key Features
| Feature | Design Value |
|---|---|
| Crossbar Switch (XBS) | Enables simultaneous access to SRAM, peripherals, and external memory by CPU, DMA, and USB controllers - eliminates bus arbitration bottlenecks in multi-threaded applications. |
| Configurable Cache | 8 Kbytes split as instruction/data or unified - improves code execution efficiency without external cache controller or complex software optimization. |
| Serial Boot Facility (SBF) | Supports booting from SPI-compatible flash, EEPROM, or FRAM - simplifies field firmware recovery and eliminates need for external boot ROM. |
| ADC & Touchscreen Controller | 8-channel 10-bit ADC with dedicated touchscreen interface - enables direct integration of resistive touch panels in medical handhelds and industrial terminals. |
| Low-Power Modes | STOP3 mode draws only 0.5 mA (IVDD) - extends battery life in portable devices while retaining RTC and wake-on-interrupt capability. |
Applications
| Industrial HMI Terminal | Portable Medical Monitor |
|---|---|
Use Scenario: A wall-mounted factory operator interface with 7-inch TFT display, pushbutton inputs, and CAN-connected PLC. IC Role / Device Role / Timing Role: Central processor executing Linux-based GUI, driving LCD at 800×480@60 Hz, managing CAN diagnostics, and logging data to SPI flash. Use Value: Integrated LCD controller and FlexCAN eliminate external ASICs; 128 Kbytes SRAM hosts framebuffer and application stack without external RAM. | Use Scenario: Battery-powered vital signs monitor with ECG waveform display, touch UI, and USB mass storage for report export. IC Role / Device Role / Timing Role: Real-time acquisition controller running RTOS, sampling analog sensors via ADC, rendering waveforms on LCD, and acting as USB device for PC data transfer. Use Value: USB OTG enables plug-and-play report download; STOP3 mode extends runtime to >12 hours on single Li-ion cell. |
| Automotive Diagnostic Tool | Smart Energy Meter Gateway |
Use Scenario: Handheld OBD-II scanner with Bluetooth bridge, CAN bus analyzer, and firmware update capability. IC Role / Device Role / Timing Role: CAN protocol handler and USB host for firmware loading; executes diagnostic stack and manages dual CAN channels (ISO 11898-1/2). Use Value: FlexCAN 2.0B supports both standard and extended frames; USB OTG permits field updates without PC dependency. | Use Scenario: DIN-rail mounted meter gateway aggregating Modbus RTU data from submeters and reporting via Ethernet or cellular. IC Role / Device Role / Timing Role: Protocol translation engine running embedded Linux, managing UART-to-Ethernet bridging, and storing logs in internal SRAM. Use Value: 166.67 MHz core handles concurrent serial parsing, TCP/IP stack, and secure OTA updates; 196 MAPBGA ensures robust thermal performance in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF52259CAG80 | Same ColdFire V2 core, but 80 MHz max frequency, 128 LQFP package, no USB OTG, 12-bit LCD controller. | Limited to lower-resolution displays and non-OTG USB designs; lacks SDR/DDR controller. | Select when cost-sensitive, lower-performance HMI is acceptable and USB host functionality is unnecessary. |
| i.MX283 (MCIMX283CVM4B) | ARM926EJ-S core @ 454 MHz, integrated PMIC, Ethernet MAC, and security crypto block - no native ColdFire compatibility. | Requires full software rework; suited for higher-bandwidth applications needing Ethernet or secure boot. | Choose for new designs requiring ARM ecosystem, Linux scalability, or hardware crypto - not a drop-in replacement. |
Compared with MCF52277CVM160, the MCF52259CAG80 offers reduced performance and peripheral set at lower cost, while the i.MX283 delivers significantly higher throughput and modern interfaces at the expense of ColdFire toolchain continuity and real-time determinism.
Availability
MCF52277CVM160 is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, and automotive diagnostic tools requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MCF52277CVM160 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MCF52277 belongs to the ColdFire® microprocessor family, designed specifically for cost-sensitive, real-time embedded applications demanding integrated peripherals, low power, and deterministic performance - especially where LCD, USB OTG, and CAN coexist in a single chip.
FAQ
What is the maximum operating frequency of the MCF52277CVM160?
The MCF52277CVM160 operates at a maximum core frequency of 166.67 MHz, as specified in the Freescale MCF5227x datasheet Rev. 8. This frequency is achieved using the on-chip PLL with external crystal (XTAL) or oscillator input. The peripheral and external bus clocks run at half-core speed (83.33 MHz), ensuring timing compliance for FlexBus, SDRAM, and USB interfaces. The MCF52277CVM160 maintains this rating across the full industrial temperature range (–40°C to +85°C).
Does the MCF52277CVM160 support USB device and host modes?
Yes, the MCF52277CVM160 integrates a USB 2.0 On-The-Go (OTG) controller that supports both device and host roles. In device mode, it enumerates as a CDC ACM or mass storage class device; in host mode, it can control USB peripherals like flash drives or HID devices. The MCF52277CVM160 requires external VBUS sensing and current limiting per USB specification, and mode switching is controlled via software configuration of the USB OTG registers.
What are the power supply requirements for the MCF52277CVM160?
The MCF52277CVM160 requires three independent supply rails: IVDD = 1.5 V ± 3% (core), EVDD = 3.3 V ± 5% (I/O and peripherals), and SDVDD = 1.8 V ± 5% (SDRAM interface). Each rail has specific filtering requirements - e.g., PLLVDD needs a 10 Ω resistor + 10 µF capacitor filter per Figure 2 of the datasheet. The MCF52277CVM160 also defines separate RTC, USB, and ADC supply domains (VDD_RTC, VDD_USB, VDD_ADC) with distinct decoupling rules.
Can the MCF52277CVM160 boot directly from SPI flash?
Yes, the MCF52277CVM160 supports serial boot from SPI-compatible flash devices via its Serial Boot Facility (SBF). During reset, if BOOTMOD[1:0] pins are configured for SPI boot mode, the processor initializes the DSPI interface and loads the first 1 Kbyte of code from the SPI flash into internal SRAM for execution. This capability is confirmed in Section 2 of the MCF5227x datasheet and enables field firmware recovery without JTAG programming. The MCF52277CVM160 does not require external boot ROM or FPGA glue logic.
What LCD resolution and interface does the MCF52277CVM160 support?
The MCF52277CVM160 features an integrated 18-bit LCD controller supporting resolutions up to 800×600 pixels with programmable pixel clock, HSYNC, VSYNC, and data enable signals. It outputs RGB-666 format (18-bit color depth) and supports both passive and active matrix panels. Unlike the MCF52274, the MCF52277CVM160's 196 MAPBGA package provides all 18 data lines (LCD_D[17:0]), enabling full 18-bit color fidelity - critical for medical imaging and industrial visualization applications.
MCF52277CVM160 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LBGA
- Series:
- MCF5227x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 166.67MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals:
- DMA, LCD, PWM, WDT
- Number of I/O:
- 55
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 1.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF52277CVM160 FAQ
1.How can I place an order for MCF52277CVM160 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF52277CVM160 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF52277CVM160 reliable?
The price and inventory of MCF52277CVM160 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF52277CVM160 is usually 5 days.
3.What payment methods are accepted for MCF52277CVM160?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF52277CVM160 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF52277CVM160?
MCF52277CVM160 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF52277CVM160 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF52277CVM160?
For technical support, including MCF52277CVM160 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF52277CVM160 requirements.
6.How does Aetrix verify that MCF52277CVM160 is sourced from the original manufacturer or authorized distributors?
All MCF52277CVM160 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF52277CVM160 meets industry standards.
7.What is the process for return or replacement of MCF52277CVM160?
All MCF52277CVM160 units undergo pre-shipment inspection (PSI). If there is an issue with MCF52277CVM160, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF52277CVM160 part is unused and in its original packaging.
Return procedure for MCF52277CVM160:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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