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NXP Semiconductors MCF5235CVM150J

Part No.:
MCF5235CVM150J
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
256-LBGA
Datasheet:
AetrixMCF5235CVM150J.pdf
Description:
IC MCU 32BIT ROMLESS 256MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,475

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Product details

Overview

MCF5235CVM150J from Freescale Semiconductor is a 32-bit ColdFire V2 microcontroller with 150 MHz core frequency, 64 KB on-chip SRAM, dual FlexCAN 2.0B modules, and integrated Fast Ethernet Controller (FEC) supporting MII/7-wire serial PHY interfaces - deployed in industrial motor control systems requiring deterministic real-time I/O and networked diagnostics.

For engineers reviewing the MCF5235CVM150J datasheet, MCF5235CVM150J pinout, MCF5235CVM150J application, or MCF5235CVM150J equivalent, this page delivers verified electrical specs, validated 256-pin MAPBGA package mapping, confirmed eTPU/FlexCAN/FEC signal routing, and direct alternative part comparisons for migration from MC68332 or legacy ColdFire designs.

Technical Context

The MCF5235CVM150J implements the ColdFire V2 RISC architecture with hardware multiply-accumulate (EMAC), 32-channel enhanced Time Processor Unit (eTPU) with 6 KB local memory, and dual independent CAN controllers compliant with ISO 11898-1. Its FEC supports full-duplex 10/100 Mbps Ethernet via MII or reduced-pin serial mode.

It integrates a 2-bank SDRAM controller with synchronous DRAM timing support (SD_SRAS/SD_SCAS/SD_CKE), four 32-bit DMA timers with dedicated channels, and a 4-channel DMA controller. The device operates at 1.5 V core (VDD), 3.3 V I/O (OVDD), and 2.5 V PLL supply (VDDPLL), with strict power sequencing requirements to prevent ESD diode conduction.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ColdFire V2 32-bit RISC with EMAC unit - enables high-speed motor control math and real-time loop execution.
Max Core Frequency 150 MHz - delivers up to 144 Dhrystone 2.1 MIPS for deterministic task scheduling in PLCs.
On-Chip Memory 64 KB SRAM (8Kx16)x4 - sufficient for dual CAN buffers, FEC packet queues, and eTPU code/data without external RAM.
Communication Peripherals 2× FlexCAN 2.0B, 3× UART, QSPI, I²C, FEC - supports CAN bus diagnostics, serial HMI, and Ethernet-based firmware updates.
eTPU Channels 32-channel with 6 KB local memory - handles complex PWM generation, encoder capture, and sensor timing offload from CPU.
Package & Pin Count 256-ball MAPBGA (Case No. 1128A-01), 1.0 mm pitch - requires 4-layer PCB with dedicated VDD/OVDD/GND planes per layout guidelines.
Supply Voltages VDD = 1.5 V ±0.1 V, OVDD = 3.3 V ±0.3 V, VDDPLL = 2.5 V ±0.2 V - strict sequencing required to avoid >0.4 V differential during ramp-up/down.

Pinout & Package

256-ball Mold Array Process Ball Grid Array (MAPBGA), 15 mm × 15 mm body, 1.0 mm ball pitch, Case No. 1128A-01. Thermal pad not present; solder mask defined pads per JEDEC MO-277.

Pin/Terminal Circuit Role Design Meaning
A1 VSS Ground reference for analog/digital I/O banks - must connect to solid ground plane with low-inductance path.
K14 TEA External address strobe input - used by External Interface Module (EIM) for asynchronous peripheral access timing.
L13 SD_WE SDRAM write enable output - controls write cycles to synchronous DRAM bank; active-low, synchronized to SD_CLK.
P15 VDDPLL 2.5 V PLL core supply - powers clock generation circuitry; requires separate 33 μF + 0.1 μF decoupling near pin.
T15 RESET Active-low reset input - initiates cold boot sequence; internal pull-up enabled; compatible with external RC or supervisor IC.
R11 TDO JTAG boundary scan data output - essential for BDM debugging and production programming via Freescale BDM interface.

Key Features

Feature Design Value
32-channel eTPU with 6 KB memory Offloads time-critical I/O (PWM, quadrature decode, pulse measurement) from CPU - reduces jitter in motion control loops.
Dual FlexCAN 2.0B modules Enables redundant CAN networks or mixed-rate buses (e.g., 500 kbps control + 125 kbps diagnostics) without software arbitration.
FEC with MII/7-wire serial modes Supports standard 18-pin MII PHYs or cost-optimized 7-wire AMD-mode transceivers - simplifies Ethernet integration in space-constrained designs.
2-bank SDRAM controller Manages up to 128 MB external memory with configurable burst length, CAS latency, and refresh timing - suitable for HMI frame buffers.
4-channel DMA with timer coupling Enables zero-CPU-overhead data transfers between peripherals (e.g., UART → SRAM, FEC → SDRAM) triggered by timer or event sources.

Applications

Industrial PLC Controller Automated Test Equipment (ATE)

Use Scenario: Real-time logic execution, analog I/O scanning, and CAN-based fieldbus communication in modular rack-mounted PLCs.

IC Role / Device Role / Timing Role: Central processing unit with deterministic interrupt latency (<1 µs), eTPU-managed I/O timing, and dual CAN for I/O module daisy-chaining.

Use Value: Eliminates need for external FPGA glue logic; 64 KB SRAM stores ladder logic runtime stack and CAN message buffers.

Use Scenario: High-precision signal generation, acquisition, and protocol analysis across multiple DUT interfaces (CAN, UART, Ethernet).

IC Role / Device Role / Timing Role: Synchronized waveform generator using eTPU PWM outputs and timestamped capture via DTIM/IRQ inputs.

Use Value: On-chip FEC enables remote test configuration and results streaming; dual CAN supports concurrent DUT control and diagnostics.

Networked Motor Drive Building Automation Gateway

Use Scenario: Closed-loop servo control with field-oriented control (FOC) algorithms, CANopen motion profiles, and Ethernet-based commissioning.

IC Role / Device Role / Timing Role: Real-time FOC computation engine with EMAC acceleration, eTPU-driven PWM dead-time insertion, and FEC for web-based HMI.

Use Value: Integrated eTPU eliminates external gate driver timing ICs; 150 MHz core sustains 20 kHz PWM carrier with <500 ns jitter.

Use Scenario: Protocol translation between BACnet MS/TP (RS-485), KNX TP1, and IP-based management systems in HVAC controllers.

IC Role / Device Role / Timing Role: Multi-protocol bridge processor with UARTs for serial fieldbus, FlexCAN for lighting control, and FEC for cloud connectivity.

Use Value: Single-chip solution replaces discrete MCU + Ethernet MAC + CAN transceiver - reduces BOM cost and board area by 35%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCF52259CAG80 80 MHz ColdFire V2 core, no FEC, single CAN, 64 KB SRAM, 128-pin LQFP - lower performance, no Ethernet, smaller footprint. Suitable for CAN-only edge nodes without IP connectivity; lacks eTPU channel count and SDRAM controller. Select when Ethernet is unnecessary and cost-sensitive LQFP assembly is preferred over MAPBGA reflow.
MCF54455CVM133 133 MHz ColdFire V4 core, dual CAN, FEC, 128 KB SRAM, 256-ball MAPBGA - higher performance, larger memory, newer architecture. Supports richer HMI (graphics buffer), faster EtherNet/IP stacks, and deeper eTPU code storage; requires updated toolchain. Choose for new designs needing extended lifecycle, higher throughput, or future-proofing beyond ColdFire V2 roadmap.

Compared with MCF52259CAG80, the MCF5235CVM150J adds Ethernet, second CAN, and 32-channel eTPU for distributed automation; versus MCF54455CVM133, it trades 133→150 MHz core speed and 128→64 KB SRAM for proven V2 toolchain stability and lower power at equivalent loads.

Availability

MCF5235CVM150J is available at Aetrix Electronics and suitable for industrial PLCs, networked motor drives, automated test equipment, and building automation gateways requiring stable component supply across multi-year production programs.

Supply support for MCF5235CVM150J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5235CVM150J belongs to the ColdFire V2 microcontroller family designed specifically for deterministic real-time industrial control - emphasizing eTPU offload, dual CAN redundancy, and integrated Ethernet for factory-floor connectivity.

FAQ

What is the maximum operating frequency of the MCF5235CVM150J?

The MCF5235CVM150J operates at a maximum core frequency of 150 MHz and a maximum bus frequency of 75 MHz, as specified in the Freescale MCF5235EC datasheet Rev. 4. This frequency is achieved using the on-chip PLL with external crystal (XTAL) or oscillator (EXTAL) input, and requires strict adherence to VDD/VDDPLL/OVDD sequencing to maintain stability. The MCF5235CVM150J delivers up to 144 Dhrystone 2.1 MIPS at this speed.

Does the MCF5235CVM150J include an Ethernet controller?

Yes, the MCF5235CVM150J integrates a Fast Ethernet Controller (FEC) supporting both MII (18-signal) and 7-wire serial (AMD-mode) PHY interfaces. It complies with IEEE 802.3 for 10/100 Mbps operation and includes dedicated DMA channels, packet buffering, and CRC generation/checking. The MCF5235CVM150J FEC does not include a physical layer (PHY); an external transceiver is required.

How many CAN interfaces does the MCF5235CVM150J support?

The MCF5235CVM150J supports two independent FlexCAN 2.0B modules, each compliant with ISO 11898-1. Both controllers feature full mailbox support, programmable bit timing, error confinement, and loopback/self-test modes. They share no resources - enabling simultaneous operation on separate CAN buses, such as one for motion control and another for diagnostics - a capability confirmed in Table 1 of the MCF5235EC datasheet.

What package type and pin count does the MCF5235CVM150J use?

The MCF5235CVM150J uses a 256-ball Mold Array Process Ball Grid Array (MAPBGA) package, 15 mm × 15 mm body size, 1.0 mm ball pitch, per Case No. 1128A-01. Pin assignments are fully documented in Figure 6 of the MCF5235EC datasheet Rev. 4. This package requires controlled-depth solder paste deposition and nitrogen reflow profile due to fine-pitch thermal mass characteristics.

Is the MCF5235CVM150J pin-compatible with other MCF523x family members?

No - the MCF5235CVM150J shares the same 256-ball MAPBGA footprint with MCF5233CVMxxx and MCF5234CVMxxx variants, but signal assignments differ significantly due to functional supersets (e.g., FEC, cryptography modules, additional eTPU pins). For example, pins TPUCH17–TPUCH21 on MCF5235CVM150J map to ETXD/ERXD signals not present on MCF5233/MCF5234. Direct PCB reuse is not supported without schematic and layout revision.

MCF5235CVM150J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-LBGA
Series:
MCF523x
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
97
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5235CVM150J FAQ

1.How can I place an order for MCF5235CVM150J through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5235CVM150J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5235CVM150J reliable?

The price and inventory of MCF5235CVM150J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5235CVM150J is usually 5 days.

3.What payment methods are accepted for MCF5235CVM150J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5235CVM150J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5235CVM150J?

MCF5235CVM150J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5235CVM150J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5235CVM150J?

For technical support, including MCF5235CVM150J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5235CVM150J requirements.

6.How does Aetrix verify that MCF5235CVM150J is sourced from the original manufacturer or authorized distributors?

All MCF5235CVM150J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5235CVM150J meets industry standards.

7.What is the process for return or replacement of MCF5235CVM150J?

All MCF5235CVM150J units undergo pre-shipment inspection (PSI). If there is an issue with MCF5235CVM150J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5235CVM150J part is unused and in its original packaging.

Return procedure for MCF5235CVM150J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCF5235CVM150J Tags

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