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NXP Semiconductors MCF5251CVM140R2
- Part No.:
- MCF5251CVM140R2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 225-LFBGA
- Datasheet:
-
MCF5251CVM140R2.pdf
- Description:
- IC MCU 32BIT ROMLESS 225MAPBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MCF5251CVM140R2 from Freescale Semiconductor is a 32-bit ColdFire V2 microprocessor designed as a system controller/decoder for compressed audio playback systems, operating at 140 MHz with 125 Dhrystone 2.1 MIPS performance. It integrates a 128 KB on-chip SRAM (64 KB ×2 banks), eMAC unit for signal processing, and supports MP3 decode in <20 MHz CPU bandwidth. Its primary application domain includes portable and automotive CD/HDD/USB-based music players.
For engineers reviewing the MCF5251CVM140R2 datasheet, MCF5251CVM140R2 pinout, MCF5251CVM140R2 application, or MCF5251CVM140R2 equivalent, key selection considerations include its MAPBGA-225 package, -40°C to +85°C industrial temperature range, 1.2 V core supply with integrated linear regulator, dual FlexCAN 2.0B controllers, USB 2.0 OTG, and SDRAM/IDE/SD/MemoryStick interface support.
Technical Context
The MCF5251CVM140R2 implements the ColdFire Version 2 (CF2) core with decoupled instruction fetch and operand execution pipelines, enabling high code density and efficient control + signal processing co-execution. Its architecture includes an integrated 1.2 V linear regulator (LINOUT), programmable PLL supporting 5–33.86 MHz crystal input, and dual independent I²C modules compliant with Philips I²C standard.
Peripheral integration centers on audio-centric connectivity: AIM and AB modules handle IEC958 (S/PDIF), I²S/EIAJ serial audio, and subcode clock/sync/data interfaces; the ATA and IDE controllers provide glueless IDE device interfacing; and the USB 2.0 OTG controller supports host/peripheral mode with integrated PHY and 24 MHz oscillator support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ColdFire V2 (CF2) 32-bit RISC core with dual-pipeline architecture for concurrent instruction fetch and operand execution |
| Max Clock Frequency | 140 MHz - delivers 125 Dhrystone 2.1 MIPS; enables real-time MP3 decode from on-chip SRAM without external memory latency |
| On-Chip Memory | 128 KB SRAM (64 KB SRAM0 + 64 KB SRAM1) - single-cycle access for core and DMA; eliminates need for external SRAM in many audio control designs |
| Core Supply Voltage | 1.08 V to 1.32 V (typ. 1.2 V) - supplied by integrated linear regulator (LININ → LINOUT), reducing external component count |
| I/O Supply Voltage | 3.0 V to 3.6 V (typ. 3.3 V) - compatible with standard LVTTL logic families and peripheral interfaces including USB, ATA, and SD |
| Operating Temperature | -40°C to +85°C - qualified for automotive infotainment and industrial embedded audio systems |
| Package | MAPBGA-225 - 15×15 mm body, 0.8 mm pitch; supports high-density PCB layouts required for multimedia system-on-module designs |
Pinout & Package
Package: 225-ball MAPBGA (15×15 mm, 0.8 mm pitch), RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BCLK/GPIO40 | SDRAM Clock Output | Drives external SDRAM clock line; synchronous timing reference for 16-bit SDRAM interface up to 32 MB capacity |
| SDRAS/GPIO59 | SDRAM Row Address Strobe | Active-low strobe controlling row address latching in external SDRAM; critical for page-mode and burst-page operation |
| SDCAS/GPIO39 | SDRAM Column Address Strobe | Active-low strobe controlling column address latching; works with SDRAS to enable full SDRAM addressing |
| SDWE/GPIO38 | SDRAM Write Enable | Active-low signal enabling write cycles to external SDRAM; determines data direction on D[31:16] bus |
| CS0/CS4 | Chip Select 0 / Boot ROM Select | Primary chip select; asserts during boot to enable internal ROM bootloader for UART/I²C/SPI/IDE firmware loading |
| CAN0_TX / CAN0_RX | FlexCAN 0 Transmit / Receive | Dedicated differential pair for CAN 2.0B protocol; supports automotive diagnostics and networked audio subsystems |
| USBDM / USBDP | USB 2.0 Differential Data Lines | Full-speed USB 2.0 OTG physical layer interface; enables direct connection to PCs or flash storage devices without external transceiver |
| CRIN / CROUT | System Oscillator Input / Output | Connects to external 5–33.86 MHz crystal; feeds programmable PLL to generate 140 MHz core clock and multiple peripheral clocks |
Key Features
| Feature | Design Value |
|---|---|
| eMAC Unit | Enhanced Multiply-Accumulate hardware accelerates FIR/IIR filtering and MP3 decoding; reduces CPU load below 20 MHz for full-rate audio decode |
| Integrated Linear Regulator | 1.2 V core regulator (LININ → LINOUT) eliminates external DC-DC converter; accepts 3.0–3.6 V input and delivers up to 150 mA output current |
| Dual FlexCAN Controllers | Two independent CAN 2.0B modules support simultaneous vehicle bus communication and in-cabin audio network control |
| Audio Interface Suite | AIM + AB modules provide native IEC958 (S/PDIF), I²S, EIAJ, and subcode (RCK/SFSY/SUBR) support - enables direct digital audio path to DACs and receivers |
| Multi-Standard Flash Media Support | Native MMC/SD, Memory Stick®, and SmartMedia® interfaces reduce BOM cost and PCB area vs. discrete bridge ICs in portable media players |
Applications
| Automotive Infotainment Head Unit | Portable HDD-Based Music Player |
|---|---|
Use Scenario: Central audio controller in dashboard-mounted head unit managing CD ripping, HDD storage, Bluetooth streaming, and CAN-based steering wheel controls. IC Role / Device Role / Timing Role: System controller executing real-time OS, coordinating ATA HDD access, USB OTG file transfer, and dual FlexCAN message routing. Use Value: Integrated 128 KB SRAM and eMAC eliminate external DSP, while -40°C to +85°C rating ensures reliability across vehicle thermal zones. |
Use Scenario: Main processor in battery-powered portable player supporting MP3/WMA decode from 2.5″ HDD, USB mass storage mode, and OLED UI rendering. IC Role / Device Role / Timing Role: Audio decoder and file system manager; executes MP3 decode from on-chip SRAM to minimize power-hungry DRAM accesses. Use Value: 1.2 V core + flexible PLL power-down modes extend battery life; integrated LIN regulator simplifies power tree design. |
| USB-Connected Audio Docking Station | Industrial Audio Distribution System |
Use Scenario: Desktop dock synchronizing audio libraries between PC and portable player via USB 2.0 OTG, with local S/PDIF output to home theater receiver. IC Role / Device Role / Timing Role: USB host controller and IEC958 transmitter; manages bulk transfers and formats digital audio streams for real-time output. Use Value: Native USB OTG + AIM module enables zero-latency S/PDIF transmission without external serializer or FIFO buffers. |
Use Scenario: Rack-mounted audio server distributing compressed audio files over CAN or Ethernet (via external PHY) to distributed speakers in commercial venues. IC Role / Device Role / Timing Role: File server and network gateway; handles ATA HDD read, TCP/IP stack (external MAC), and CAN message bridging. Use Value: Dual FlexCAN + ATA + USB interfaces allow concurrent legacy bus integration and modern connectivity without FPGA glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar audio system controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5251VM140 | Identical silicon; differs only in temperature grade (-20°C to +70°C vs. -40°C to +85°C) | Restricted to commercial-grade portable consumer devices; not suitable for under-hood or industrial environments | Select MCF5251VM140 only if ambient operating temperature remains above -20°C and cost sensitivity outweighs thermal margin requirements. |
| MCF5249CVM120 | Same ColdFire V2 core but lower max frequency (120 MHz); 96 KB on-chip SRAM; no USB OTG or second FlexCAN | Lacks USB 2.0 OTG and one CAN channel; insufficient for dual-bus automotive gateways or PC-docking functionality | Choose MCF5249CVM120 only for cost-constrained, single-interface audio controllers where 120 MHz performance and 96 KB SRAM meet functional requirements. |
Compared with MCF5251CVM140R2, MCF5251VM140 offers identical functionality at lower thermal qualification, while MCF5249CVM120 reduces capability in clock speed, memory, USB, and CAN to achieve cost savings - neither is pin-compatible nor drop-in replaceable due to package and peripheral signal mapping differences.
Availability
MCF5251CVM140R2 is available at Aetrix Electronics and suitable for automotive infotainment, portable media players, USB audio docks, and industrial audio distribution systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCF5251CVM140R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and consumer markets.
The MCF5251 belongs to Freescale's ColdFire microprocessor family, designed specifically for cost-sensitive, high-performance embedded audio and multimedia control applications requiring integrated peripherals and low-power operation.
FAQ
What is the maximum operating junction temperature for the MCF5251CVM140R2?
The MCF5251CVM140R2 guarantees full electrical operation when junction temperature does not exceed 125°C. Its -40°C to +85°C ambient rating assumes proper PCB thermal design and airflow; derating is required above 85°C ambient to maintain safe junction temperature. The integrated linear regulator contributes to thermal load, so thermal vias and copper pour under the MAPBGA-225 package are recommended in layout.
Does the MCF5251CVM140R2 support booting from USB mass storage devices?
No, the MCF5251CVM140R2 does not support direct USB mass storage boot. Its ROM bootloader (BROM) supports booting only from UART, I²C, SPI, or IDE devices. USB 2.0 OTG functionality is available for runtime data transfer after boot, but the USB interface cannot be used as a boot source. External USB-to-IDE bridge or host-controlled firmware download is required for USB-initiated updates.
Can the on-chip 128 KB SRAM be used as cache memory for external SDRAM access?
No, the 128 KB SRAM in the MCF5251CVM140R2 is configured as two fixed banks (SRAM0 and SRAM1) accessible as general-purpose memory - it is not configurable as a cache for external SDRAM. The processor includes a separate 8 KB instruction cache (INC) for code fetch acceleration, but data caching relies on software-managed SRAM allocation or external cache controllers.
What is the purpose of the LINOUT and LININ pins on the MCF5251CVM140R2?
LININ is the 3.0–3.6 V input to the integrated linear regulator; LINOUT is its 1.2 V regulated output supplying the ColdFire core and PLL. This eliminates the need for an external 1.2 V regulator. A 10 µF tantalum capacitor (ESR ≤5 Ω) must be placed directly at LINOUT to stabilize regulation - omitting this capacitor causes core voltage instability and system failure.
Is the MCF5251CVM140R2 pin-compatible with other ColdFire processors like the MCF5223x series?
No, the MCF5251CVM140R2 is not pin-compatible with MCF5223x or other ColdFire families. Its MAPBGA-225 package, signal multiplexing (e.g., SDWE/GPIO38, SDRAS/GPIO59), and peripheral set (dual FlexCAN, USB OTG, ATA) differ significantly from smaller ColdFire MCUs. Migration requires full PCB redesign and firmware adaptation due to architectural and pinout discontinuity.
MCF5251CVM140R2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 225-LFBGA
- Series:
- MCF525x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 140MHz
- Connectivity:
- ATA, Audio, CANbus, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG
- Peripherals:
- DMA
- Number of I/O:
- -
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 3.6V
- Data Converters:
- A/D 6x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5251CVM140R2 FAQ
1.How can I place an order for MCF5251CVM140R2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5251CVM140R2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5251CVM140R2 reliable?
The price and inventory of MCF5251CVM140R2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5251CVM140R2 is usually 5 days.
3.What payment methods are accepted for MCF5251CVM140R2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5251CVM140R2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5251CVM140R2?
MCF5251CVM140R2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5251CVM140R2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5251CVM140R2?
For technical support, including MCF5251CVM140R2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5251CVM140R2 requirements.
6.How does Aetrix verify that MCF5251CVM140R2 is sourced from the original manufacturer or authorized distributors?
All MCF5251CVM140R2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5251CVM140R2 meets industry standards.
7.What is the process for return or replacement of MCF5251CVM140R2?
All MCF5251CVM140R2 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5251CVM140R2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5251CVM140R2 part is unused and in its original packaging.
Return procedure for MCF5251CVM140R2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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