NXP Semiconductors MCF5270CVM150
- Part No.:
- MCF5270CVM150
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LBGA
- Datasheet:
-
MCF5270CVM150.pdf
- Description:
- IC MCU 32BIT ROMLESS 196MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCF5270CVM150 from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire V2 RISC microprocessor with integrated Ethernet MAC, 64 KB on-chip SRAM, 8 KB instruction/data cache, and SDR SDRAM controller. It operates at 150 MHz (144 Dhrystone 2.1 MIPS), supports -40°C to +85°C industrial temperature range, and is packaged in 196-ball MAPBGA for embedded networking and industrial control applications.
For engineers reviewing the MCF5270CVM150 datasheet, MCF5270CVM150 pinout, MCF5270CVM150 application, or MCF5270CVM150 equivalent, key selection criteria include its 150 MHz ColdFire V2 core performance, integrated FEC with MII/serial PHY interface, SDRAM controller timing compliance, and dual-voltage I/O (OVDD/VDD) sequencing requirements.
Technical Context
The MCF5270CVM150 implements the ColdFire V2 core with enhanced multiply-accumulate (eMAC) unit and hardware divide, enabling deterministic real-time signal processing. Its memory subsystem includes a 32-bit SDR SDRAM controller supporting synchronous burst mode, configurable CS[3:0] banks, and SD_CKE-controlled power-down/self-refresh.
Peripheral integration includes three UARTs (with RTS/CTS flow control), I²C master/slave, QSPI, four 32-bit DMA timers, dual INTCs, and edge-port GPIO with interrupt capability. The FEC supports both IEEE 802.3-compliant MII (18-signal) and reduced-pin AMD-style 7-wire serial interfaces for 10/100 Mbps Ethernet connectivity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V2 RISC, 32-bit, with eMAC and hardware divide - enables deterministic DSP-like operations without external coprocessor. |
| Max Clock Frequency | 150 MHz - delivers 144 Dhrystone 2.1 MIPS for cost-sensitive high-throughput embedded control. |
| On-Chip Memory | 64 KB SRAM + 8 KB configurable cache - eliminates need for external fast RAM in many boot-and-run applications. |
| SDRAM Interface | 32-bit SDR SDRAM controller with SD_CS[1:0], SD_WE/SCAS/SRAS, SD_CKE - supports JEDEC-standard 16M×16 or 32M×16 configurations. |
| Ethernet MAC | Fast Ethernet Controller (FEC) with MII and 7-wire serial PHY interface - enables flexible PHY selection and board-level EMI reduction. |
| Package & Temp Range | 196-ball MAPBGA (15 mm × 15 mm), -40°C to +85°C - suitable for industrial automation and extended-temperature networking equipment. |
| I/O Voltage Support | OVDD = 3.3 V, VDD = 1.5 V, VDDPLL = 2.5 V - requires strict supply sequencing (VDD must not exceed OVDD/VDDPLL by >0.4 V). |
Pinout & Package
Package: 196-ball Mold Array Plastic Ball Grid Array (MAPBGA), case number 1128A-01, 15.0 mm × 15.0 mm footprint, 1.0 mm ball pitch, 1.25–1.60 mm height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator input/output | Accepts 150 MHz crystal or external clock; XTAL must be tied to ground when using external oscillator. |
| ETXCLK / ERXCLK | Ethernet transmit/receive clock | Provide timing reference for MII-mode PHY; require matched trace lengths and dedicated ground return. |
| ETXD[3:0] / ERXD[3:0] | Ethernet data bus | 4-bit parallel MII data path; support full-duplex 100 Mbps operation with precise setup/hold timing. |
| SD_SRAS / SD_SCAS / SD_WE | SDRAM command strobes | Directly drive SDRAM row/column address strobe and write enable; must comply with JEDEC tRCD/tRP/tWR timing. |
| CS[3:0] / SD_CS[1:0] | Chip select outputs | CS[3:0] control external peripherals; SD_CS[1:0] select SDRAM banks - independent decode logic prevents bus contention. |
| VDD / OVDD / VDDPLL | Power supply inputs | VDD (1.5 V core), OVDD (3.3 V I/O), VDDPLL (2.5 V PLL) - require separate decoupling and controlled ramp sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Fast Ethernet Controller (FEC) | Reduces BOM count by eliminating external MAC; supports both MII and 7-wire serial PHY interfaces for layout flexibility. |
| 32-bit SDR SDRAM Controller | Enables direct connection to low-cost, high-density SDRAM; supports auto-refresh, self-refresh, and power-down modes via SD_CKE. |
| Dual Interrupt Controllers (INTC0/INTC1) | Allows prioritized, nested interrupt handling across multiple peripherals - critical for real-time response in industrial PLCs. |
| Four 32-bit DMA Timers (DTIM0–DTIM3) | Provide precise timebase for PWM generation, encoder counting, or periodic ADC sampling without CPU overhead. |
| QSPI with configurable pin muxing | Supports daisy-chained flash or sensor interfaces; pins shared with I²C_SDA/SCL allow reuse in space-constrained designs. |
Applications
| Industrial Ethernet Gateway | Networked Human-Machine Interface (HMI) |
|---|---|
|
Use Scenario: Protocol translation between Modbus RTU fieldbus and TCP/IP Ethernet in factory-floor gateways. IC Role / Device Role / Timing Role: Primary application processor executing real-time protocol stack with FEC-driven Ethernet packet handling and UART-based serial bridging. Use Value: Integrated FEC and 150 MHz V2 core eliminate external MAC and reduce latency vs. software-only stacks on lower-MIPS MCUs. |
Use Scenario: Touchscreen HMI with local graphics rendering, remote diagnostics, and firmware updates over Ethernet. IC Role / Device Role / Timing Role: Main controller managing display refresh, button polling, secure OTA update via HTTPS, and Ethernet link management. Use Value: 64 KB SRAM enables double-buffered framebuffer storage; SDRAM controller supports external video memory expansion. |
| Programmable Logic Controller (PLC) CPU Module | Building Automation Controller (BACnet/IP) |
|
Use Scenario: Compact DIN-rail PLC executing ladder logic, motion control, and I/O scanning in HVAC or packaging machinery. IC Role / Device Role / Timing Role: Deterministic real-time execution host with eMAC-accelerated math, dual INTCs for I/O interrupt prioritization, and DMA timers for encoder capture. Use Value: ColdFire V2 eMAC provides cycle-predictable multiply-accumulate for PID loop computation without jitter. |
Use Scenario: BACnet/IP-enabled HVAC controller communicating with building management systems over standard Ethernet infrastructure. IC Role / Device Role / Timing Role: Network-aware application processor running BACnet stack, managing RS-485 MSTP subnetworks via UARTs, and monitoring environmental sensors. Use Value: Three UARTs with hardware flow control support concurrent MSTP, Modbus, and debug interfaces; FEC ensures deterministic IP packet scheduling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5271CVM150 | Includes hardware encryption engine (SKHA/RNGA/MDHA); identical pinout and core specs. | Required for TLS/SSL offload or secure boot in connected devices. | Select MCF5271CVM150 only if cryptographic acceleration is needed; otherwise MCF5270CVM150 reduces cost and power. |
| MCF5282CAG80 | Higher-performance ColdFire V3 core (266 MHz), larger 128 KB SRAM, but 160-pin QFP package and no integrated FEC. | Suitable for compute-intensive control where Ethernet is handled externally or via USB/Ethernet bridge IC. | Choose MCF5282CAG80 for higher MIPS density and larger on-chip memory; avoid if FEC integration or MAPBGA footprint is required. |
Compared with MCF5271CVM150, the MCF5270CVM150 omits hardware crypto blocks but retains identical Ethernet, memory, and peripheral capabilities - making it optimal for cost-sensitive industrial controllers where security is implemented in software or external ICs. Versus MCF5282CAG80, it trades raw CPU speed for integrated networking and smaller footprint.
Availability
MCF5270CVM150 is available at Aetrix Electronics and suitable for industrial automation, networked HMI, and building control applications requiring stable component supply, long lifecycle support, and qualified sourcing for production programs.
Supply support for MCF5270CVM150 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full support for the ColdFire portfolio, including documentation, tools, and long-term supply commitments for industrial-grade microprocessors.
The MCF5270 belongs to the ColdFire V2 microprocessor family, designed specifically for cost-sensitive, high-integration embedded applications requiring Ethernet connectivity, deterministic real-time performance, and industrial temperature operation without external co-processors.
FAQ
What is the maximum operating frequency of the MCF5270CVM150?
The MCF5270CVM150 operates at a maximum frequency of 150 MHz, delivering 144 Dhrystone 2.1 MIPS performance. This rating is validated across the full industrial temperature range (-40°C to +85°C) and requires proper power supply decoupling, thermal management, and clock signal integrity per Freescale's AN1259 layout guidelines. The MCF5270CVM150 achieves this speed using the ColdFire V2 core with eMAC and hardware divide units.
Does the MCF5270CVM150 include an integrated Ethernet MAC?
Yes, the MCF5270CVM150 integrates a Fast Ethernet Controller (FEC) supporting both IEEE 802.3-compliant MII (18-signal) and reduced-pin 7-wire serial PHY interfaces. It does not include a physical layer transceiver - an external PHY (e.g., DP83848) must be used. The FEC handles MAC-layer functions including frame transmission, reception, CRC calculation, and flow control, reducing host CPU overhead in MCF5270CVM150-based designs.
What package type and pin count does the MCF5270CVM150 use?
The MCF5270CVM150 uses a 196-ball Mold Array Plastic Ball Grid Array (MAPBGA) package, case number 1128A-01, with 15.0 mm × 15.0 mm body size and 1.0 mm ball pitch. Pin assignments match the MCF5271CVM150, enabling PCB design reuse. The package supports industrial temperature operation (-40°C to +85°C) and requires four-layer board construction with dedicated power/ground planes per Freescale's layout recommendations for the MCF5270CVM150.
What are the power supply requirements for the MCF5270CVM150?
The MCF5270CVM150 requires three independent supplies: VDD = 1.5 V (core), OVDD = 3.3 V (I/O), and VDDPLL = 2.5 V (PLL). Critical sequencing rules apply: VDD must not exceed OVDD or VDDPLL by more than 0.4 V during power-up/down ramps, and all supplies must ramp at ≤1 ms rise time to prevent ESD clamp activation. Decoupling requires 33 μF bulk + 0.1 μF + 0.01 μF per supply pair near each VDD/OVDD/VDDPLL pin on the MCF5270CVM150.
Is the MCF5270CVM150 pin-compatible with any other ColdFire processors?
The MCF5270CVM150 shares identical pinout, package dimensions, and signal mapping with the MCF5271CVM150 in the 196-ball MAPBGA variant - enabling drop-in replacement where hardware encryption is not required. It is not pin-compatible with QFP-packaged variants (e.g., MCF5270CAB100) or later ColdFire generations (e.g., MCF5282) due to differing ball/pin counts, power domains, and peripheral mappings. Always verify signal routing against the MCF5270CVM150-specific pin table before substitution.
MCF5270CVM150 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LBGA
- Series:
- MCF527x
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Peripherals:
- DMA, WDT
- Number of I/O:
- 97
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 1.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5270CVM150 FAQ
1.How can I place an order for MCF5270CVM150 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5270CVM150 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5270CVM150 reliable?
The price and inventory of MCF5270CVM150 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5270CVM150 is usually 5 days.
3.What payment methods are accepted for MCF5270CVM150?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5270CVM150 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5270CVM150?
MCF5270CVM150 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5270CVM150 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5270CVM150?
For technical support, including MCF5270CVM150 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5270CVM150 requirements.
6.How does Aetrix verify that MCF5270CVM150 is sourced from the original manufacturer or authorized distributors?
All MCF5270CVM150 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5270CVM150 meets industry standards.
7.What is the process for return or replacement of MCF5270CVM150?
All MCF5270CVM150 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5270CVM150, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5270CVM150 part is unused and in its original packaging.
Return procedure for MCF5270CVM150:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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