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NXP Semiconductors MCF5270CVM150R2
- Part No.:
- MCF5270CVM150R2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LBGA
- Datasheet:
-
MCF5270CVM150R2.pdf
- Description:
- IC MCU 32BIT ROMLESS 196MAPBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MCF5270CVM150R2 from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire V2 RISC microprocessor in 196-ball MAPBGA packaging, operating at 150 MHz with 144 Dhrystone 2.1 MIPS performance. It integrates 64 KB on-chip SRAM, 8 KB configurable instruction/data cache, a 32-bit SDR SDRAM controller, and a 10/100 Fast Ethernet MAC - deployed in industrial networking gateways requiring deterministic real-time control and embedded connectivity.
For engineers reviewing the MCF5270CVM150R2 datasheet, MCF5270CVM150R2 pinout, MCF5270CVM150R2 application, or MCF5270CVM150R2 equivalent, key selection criteria include ColdFire V2 core timing compatibility, 196 MAPBGA mechanical fit, Ethernet MAC interface configuration (MII or 7-wire serial), SDRAM controller signal mapping (SD_SRAS/SD_SCAS/SD_CKE), and voltage sequencing compliance (VDD/OVDD/VDDPLL ramp tracking).
Technical Context
The MCF5270CVM150R2 implements the ColdFire V2 core with enhanced multiply-accumulate (eMAC) unit and hardware divide logic, supporting full 32-bit address/data bus operation. Its memory subsystem includes dual-bank 64 KB SRAM, 8 KB unified cache, and a synchronous DRAM controller compliant with JEDEC-standard SDRAM timing modes.
Peripheral integration includes three UARTs (with RTS/CTS flow control), I²C master/slave, QSPI, four DMA timers, dual interrupt controllers (INTC0/INTC1), and a BDM/JTAG debug interface. The FEC supports both IEEE 802.3-compliant MII (18-signal) and simplified 7-wire serial PHY interfaces, with configurable R_CNTRL[MII_MODE] register bit.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V2 32-bit RISC CPU with eMAC and hardware divide unit - enables deterministic DSP-like math operations without external coprocessor. |
| Max Clock Frequency | 150 MHz - delivers 144 Dhrystone 2.1 MIPS; requires precise PLL clock generation and stable 1.5 V core supply. |
| On-Chip Memory | 64 KB SRAM + 8 KB configurable cache - eliminates need for external SRAM in many control applications; cache configurable as instruction-only, data-only, or unified. |
| SDRAM Interface | 32-bit SDR SDRAM controller with SD_SRAS/SD_SCAS/SD_CKE/SD_CS[1:0] signals - supports standard 64 MB–512 MB SDRAM modules with programmable timing registers. |
| Ethernet Interface | Fast Ethernet Controller (FEC) with MII or 7-wire serial PHY mode - enables direct connection to PHY transceivers like DP83848 without external MAC logic. |
| Package | 196-ball Mold Array Plastic Ball Grid Array (MAPBGA), 15 mm × 15 mm, 1.0 mm pitch - requires 4-layer PCB with dedicated power/ground planes and controlled-impedance routing. |
| Supply Voltages | VDD = 1.5 V (core), OVDD = 3.3 V (I/O), VDDPLL = 2.5 V (PLL) - strict sequencing required: all supplies must track to 0.9 V before separating; VDD must not exceed OVDD/VDDPLL by >0.4 V. |
Pinout & Package
196-ball MAPBGA package (Case No. 1128A-01), 15 mm × 15 mm body, 1.0 mm ball pitch, solder ball composition Pb-free (RoHS compliant). Mechanical drawings specify seating plane defined by spherical crowns of solder balls; maximum ball diameter 0.55 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL / XTAL | Oscillator input/output | Accepts 150 MHz crystal or external clock source; XTAL must be tied to ground when using external oscillator - critical for PLL lock stability. |
| SD_SRAS / SD_SCAS / SD_WE | SDRAM command strobes | Directly drive SDRAM row/column address strobe and write enable; no external logic needed - simplifies SDRAM interface design. |
| ETXCLK / ERXCLK / ETXD[3:0] / ERXD[3:0] | Ethernet MII interface | Full 4-bit parallel transmit/receive data paths with independent clocks - supports 100 Mbps full-duplex operation per IEEE 802.3u. |
| EMDC / EMDIO | MDIO management interface | Provides IEEE 802.3-compliant serial management channel to configure external PHY registers - eliminates need for GPIO-based bit-banging. |
| D[31:0] / A[23:0] | External memory bus | 32-bit multiplexed data and 24-bit address bus with BS[3:0] byte enables - supports NOR flash, SRAM, and peripheral memory-mapped devices. |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced MAC (eMAC) | Hardware-accelerated 32×32→64-bit multiply-accumulate with saturation - reduces cycle count for motor control PID loops and digital filter execution. |
| Dual INTC modules | Two independent interrupt controllers (INTC0/INTC1) with priority encoding and vector table support - enables nested interrupt handling for real-time I/O response. |
| QSPI peripheral | Four-wire serial interface with programmable clock polarity/phase and chip select outputs - directly drives SPI flash, EEPROM, or ADCs without GPIO bit-banging. |
| BDM/JTAG debug port | IEEE 1149.1-compliant boundary scan and background debug mode - supports non-intrusive real-time debugging, flash programming, and register inspection via standard tools. |
| Edge Port Module (EPORT) | Programmable GPIO with edge-triggered interrupt capability on up to 16 pins - enables hardware debounced switch inputs or pulse-width measurement without CPU polling. |
Applications
| Industrial Ethernet Gateway | Smart Energy Metering Hub |
|---|---|
Use Scenario: Aggregates Modbus RTU/ASCII data from field sensors over RS-485 and bridges to TCP/IP networks via integrated FEC. IC Role / Device Role / Timing Role: Primary protocol translation engine with deterministic task scheduling, Ethernet packet assembly, and real-time UART-to-TCP forwarding. Use Value: Eliminates external Ethernet controller and FPGA glue logic; 144 MIPS headroom supports concurrent TLS 1.2 encryption for secure cloud telemetry. | Use Scenario: Collects voltage/current harmonics from multi-phase metering ICs and logs waveform data to local SDRAM before uploading via cellular modem. IC Role / Device Role / Timing Role: Real-time waveform acquisition host with synchronized DMA transfers from SPI metering ICs into 64 KB SRAM buffer. Use Value: On-chip SRAM avoids external memory latency; eMAC accelerates FFT computation for harmonic analysis without offloading to host processor. |
| Programmable Logic Controller (PLC) CPU Module | Building Automation Controller |
Use Scenario: Executes IEC 61131-3 ladder logic programs while managing discrete I/O expansion via EIM and fieldbus interfaces (CAN, RS-485). IC Role / Device Role / Timing Role: Deterministic real-time controller with sub-100 µs I/O scan cycle, leveraging dual INTC for prioritized interrupt handling of safety-critical inputs. Use Value: Integrated 32-bit SDRAM controller enables large program storage and data logging; QSPI supports firmware updates from external flash. | Use Scenario: Manages HVAC zone control, lighting schedules, and occupancy sensor fusion across BACnet MS/TP and LonWorks networks. IC Role / Device Role / Timing Role: Multi-protocol gateway CPU with simultaneous UARTs for legacy fieldbus and Ethernet for building management system (BMS) integration. Use Value: Three UARTs with hardware RTS/CTS eliminate software flow control overhead; I²C interface configures environmental sensors without additional level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5271CVM150 | Includes hardware encryption module (SKHA/RNGA/MDHA); identical core, memory, and peripheral set otherwise. | Required for applications needing AES-128/256, SHA-1/256, or RNG-based key generation - e.g., secure firmware OTA updates. | Select MCF5270CVM150R2 when encryption is handled externally or unnecessary; use MCF5271CVM150 only if cryptographic acceleration is mandatory. |
| MCF5282CAG80 | Higher-performance ColdFire V2 core (266 MHz), 128 KB SRAM, 16 KB cache, but uses 160-pin QFP package and lacks integrated FEC. | Suitable for compute-intensive control tasks without Ethernet - e.g., servo motion profiling - but requires external MAC/PHY and increases board area. | Choose MCF5270CVM150R2 for space-constrained Ethernet-connected designs; MCF5282CAG80 only when raw MIPS >144 and Ethernet is implemented externally. |
Compared with MCF5271CVM150, the MCF5270CVM150R2 omits hardware crypto engines but retains identical Ethernet, memory, and timing capabilities - reducing BOM cost where security is managed at network layer. Versus MCF5282CAG80, it trades peak clock speed and SRAM size for integrated FEC and smaller MAPBGA footprint - optimizing for compact, connected industrial controllers.
Availability
MCF5270CVM150R2 is available at Aetrix Electronics and suitable for industrial networking gateways, smart energy metering hubs, PLC CPU modules, and building automation controllers requiring stable component supply across extended temperature ranges (–40°C to +85°C) and long production lifecycles.
Supply support for MCF5270CVM150R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, connected, and intelligent solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MCF5270 belongs to NXP's ColdFire microprocessor family, designed specifically for cost-sensitive, high-integration 32-bit embedded applications demanding real-time performance, Ethernet connectivity, and deterministic I/O control in harsh industrial environments.
FAQ
What is the core architecture and clock speed of the MCF5270CVM150R2?
The MCF5270CVM150R2 features the ColdFire V2 32-bit RISC core running at 150 MHz, delivering 144 Dhrystone 2.1 MIPS. It includes an enhanced multiply-accumulate (eMAC) unit and hardware divide logic. This core is optimized for deterministic real-time control and embedded connectivity applications - distinct from ARM or PowerPC architectures - and requires specific toolchain support (e.g., CodeWarrior for ColdFire).
Does the MCF5270CVM150R2 support hardware encryption?
No, the MCF5270CVM150R2 does not include hardware encryption modules. Unlike the pin-compatible MCF5271CVM150, which integrates SKHA (Secure Key Hash Algorithm), RNGA (Random Number Generator), and MDHA (Message Digest Hash Algorithm) blocks, the MCF5270CVM150R2 omits these cryptographic accelerators. Encryption tasks must be performed in software or via external ICs when using the MCF5270CVM150R2.
What package type and pin count does the MCF5270CVM150R2 use?
The MCF5270CVM150R2 uses a 196-ball Mold Array Plastic Ball Grid Array (MAPBGA) package, measuring 15 mm × 15 mm with 1.0 mm ball pitch. It is RoHS-compliant and lead-free. This package requires a 4-layer PCB with dedicated power/ground planes and careful thermal management - unlike the 160-pin QFP variants of the same family.
How does the Ethernet interface on the MCF5270CVM150R2 operate?
The MCF5270CVM150R2 integrates a Fast Ethernet Controller (FEC) supporting both IEEE 802.3-compliant MII (18-signal interface) and a simplified 7-wire serial PHY interface. Mode selection is controlled by the R_CNTRL[MII_MODE] register bit. The MCF5270CVM150R2 provides all necessary MII signals (ETXCLK, ERXCLK, ETXD[3:0], ERXD[3:0], EMDC, EMDIO) without external glue logic.
What are the critical power supply requirements for the MCF5270CVM150R2?
The MCF5270CVM150R2 requires three independent supplies: VDD = 1.5 V (core), OVDD = 3.3 V (I/O), and VDDPLL = 2.5 V (PLL). During power-up, all supplies must track to 0.9 V before separating; VDD must never exceed OVDD or VDDPLL by more than 0.4 V. Recommended decoupling includes 33 μF, 0.1 μF, and 0.01 μF capacitors per supply rail placed near respective pins.
MCF5270CVM150R2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LBGA
- Series:
- MCF527x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Peripherals:
- DMA, WDT
- Number of I/O:
- 97
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 1.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5270CVM150R2 FAQ
1.How can I place an order for MCF5270CVM150R2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5270CVM150R2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5270CVM150R2 reliable?
The price and inventory of MCF5270CVM150R2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5270CVM150R2 is usually 5 days.
3.What payment methods are accepted for MCF5270CVM150R2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5270CVM150R2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5270CVM150R2?
MCF5270CVM150R2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5270CVM150R2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5270CVM150R2?
For technical support, including MCF5270CVM150R2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5270CVM150R2 requirements.
6.How does Aetrix verify that MCF5270CVM150R2 is sourced from the original manufacturer or authorized distributors?
All MCF5270CVM150R2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5270CVM150R2 meets industry standards.
7.What is the process for return or replacement of MCF5270CVM150R2?
All MCF5270CVM150R2 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5270CVM150R2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5270CVM150R2 part is unused and in its original packaging.
Return procedure for MCF5270CVM150R2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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