NXP Semiconductors MCF5271CAB100
- Part No.:
- MCF5271CAB100
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 160-BQFP
- Datasheet:
-
MCF5271CAB100.pdf
- Description:
- IC MCU 32BIT ROMLESS 160QFP
- Quantity:
- Payment:

- Shipping:

Inventory:18,500
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Product details
Overview
MCF5271CAB100 from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire V2 RISC microprocessor in 160-pin QFP package, operating at 100 MHz with 144 Dhrystone 2.1 MIPS performance. It integrates a 10/100 Fast Ethernet MAC, 64 KB on-chip SRAM, 8 KB configurable instruction/data cache, and SDR SDRAM controller - deployed in industrial gateways requiring deterministic real-time connectivity and local protocol bridging.
For engineers reviewing the MCF5271CAB100 datasheet, MCF5271CAB100 pinout, MCF5271CAB100 application, or MCF5271CAB100 equivalent, key selection criteria include Ethernet PHY interface mode (MII vs. serial), SDRAM timing compliance, ColdFire V2 core debug via BDM/JTAG, and thermal derating for extended temperature (-40°C to +85°C) operation.
Technical Context
The MCF5271CAB100 implements the ColdFire V2 core with enhanced multiply-accumulate (eMAC) unit and hardware divide logic. Its memory subsystem includes a 32-bit SDR SDRAM controller supporting synchronous burst reads/writes, configurable CAS latency, and automatic refresh control via SD_CKE, SD_SRAS, and SD_SCAS signals.
Peripheral integration includes three UARTs (U0–U2), dual I²C interfaces (I2C_SDA/I2C_SCL), quad SPI (QSPI_CS0–QSPI_CS1, QSPI_CLK, QSPI_DIN/DOUT), four DMA timers (DT0–DT3), and dual interrupt controllers (INTC0/INTC1). The FEC supports both IEEE 802.3 MII (18-signal) and 7-wire AMD serial modes, selected by R_CNTRL[MII_MODE].
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V2 32-bit RISC CPU with eMAC and hardware divide unit |
| Max Clock Frequency | 100 MHz - defines maximum instruction throughput and peripheral timing margins |
| Dhrystone 2.1 Performance | 144 MIPS - benchmarked integer compute capability for embedded control tasks |
| On-chip Memory | 64 KB SRAM + 8 KB configurable cache - enables zero-wait-state code execution and data buffering |
| Ethernet Interface | 10/100 Fast Ethernet Controller (FEC) with MII or 7-wire serial PHY support |
| SDRAM Support | 32-bit SDR SDRAM controller with programmable timing, auto-refresh, and byte-enable (BS[3:0]) masking |
| Operating Temperature | -40°C to +85°C - qualified for industrial-grade environmental resilience |
| Package | 160-pin Plastic Quad Flat Package (QFP), 28 mm × 28 mm, lead-free |
Pinout & Package
Package: 160-pin Plastic Quad Flat Package (QFP), 28 mm × 28 mm body, 0.65 mm pitch, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous system initialization; requires external pull-up and debounced assertion |
| EXTAL / XTAL | Oscillator input/output pair | Drives internal PLL; supports crystal (4–50 MHz) or external clock source |
| ETXCLK / ERXCLK | Ethernet transmit/receive clock | MII mode: 25 MHz (100 Mbps) or 2.5 MHz (10 Mbps); drives PHY timing synchronization |
| ETXD[3:0] / ERXD[3:0] | Ethernet transmit/receive data bus | 4-bit parallel MII data path; requires controlled impedance routing and length matching |
| SD_SRAS / SD_SCAS / SD_WE | SDRAM row/column address strobe, write enable | Directly drive SDRAM command pins; timing critical for setup/hold compliance per JEDEC spec |
| A[20:0] / D[31:0] | Address/data multiplexed bus | 32-bit data + 21-bit address; supports external memory expansion up to 4 GB address space |
| JTAG_EN / TMS / TDI / TDO / TCK | IEEE 1149.1 boundary-scan interface | Enables BDM debugging, flash programming, and structural test without dedicated debug port |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 10/100 FEC | Reduces BOM count by eliminating external MAC; supports MII and 7-wire serial PHY interfaces |
| Hardware Encryption Accelerator | Offloads AES/SHA operations from CPU, enabling secure firmware updates and TLS handshake acceleration |
| Configurable 8 KB Cache | Improves instruction fetch efficiency; configurable as split I/D or unified cache to match application memory access patterns |
| Four DMA Timers (DT0–DT3) | Enable precise PWM generation, quadrature decoding, and time-triggered peripheral control without CPU intervention |
| Edge Port Module (EPORT) | Provides GPIO interrupt-on-change capability for fast edge detection on up to 32 pins |
| External Interface Module (EIM) | Manages chip selects CS[0:7], address/data bus timing, and wait-state insertion for legacy parallel peripherals |
Applications
| Industrial Ethernet Gateway | Secure Remote HMI Terminal |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud-connected MQTT networks over cellular/Wi-Fi backhaul. IC Role / Device Role / Timing Role: Central processing unit executing real-time Linux, managing dual Ethernet ports (LAN/WAN), and running TLS 1.2 stack. Use Value: Integrated FEC eliminates external MAC, reducing latency and PCB area; hardware encryption accelerates TLS handshakes by >5× versus software-only implementation. | Use Scenario: Operator-facing touchscreen terminal in hazardous environments with encrypted firmware OTA updates and tamper-resistant boot. IC Role / Device Role / Timing Role: Main controller executing secure bootloader, UI rendering engine, and cryptographic key management. Use Value: Hardware encryption module validates firmware signatures in <10 ms; 64 KB SRAM buffers UI assets while preserving deterministic response to touch interrupts. |
| Programmable Logic Controller (PLC) Base Unit | Networked Building Automation Controller |
Use Scenario: DIN-rail mounted PLC executing ladder logic with EtherNet/IP slave functionality and analog I/O expansion. IC Role / Device Role / Timing Role: Real-time deterministic controller with cycle times <10 ms; manages EtherNet/IP CIP messaging and local I/O scanning. Use Value: ColdFire V2 core delivers consistent interrupt latency (<2 µs); SDRAM controller supports large tag databases and motion control trajectory buffers. | Use Scenario: HVAC controller interfacing BACnet MS/TP fieldbus and connecting to enterprise BACnet/IP network via managed switch. IC Role / Device Role / Timing Role: Dual-network processor handling BACnet stack, scheduling, and supervisory logic. Use Value: Three UARTs enable simultaneous RS-485 BACnet MS/TP, debug console, and Modbus gateway; 100 MHz clock ensures sub-100 ms BACnet poll cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5271CVM100 | Same core, 196-ball MAPBGA package; identical 100 MHz speed and feature set | Higher pin density, better thermal dissipation (θJB = 25°C/W vs. 36°C/W), but requires BGA rework capability | Select when board space is constrained and thermal design supports BGA mounting. |
| MCF5272CAB100 | Successor ColdFire V2 variant with larger 128 KB SRAM, same 100 MHz, added USB 2.0 OTG | Enables host-side USB device enumeration (e.g., flash drives, HID), not supported by MCF5271CAB100 | Select when USB host capability or extended on-chip memory is required for firmware staging or logging. |
Compared with MCF5271CVM100, the MCF5271CAB100 offers easier prototyping and rework via QFP, while MCF5272CAB100 adds USB 2.0 OTG and doubles SRAM - making it suitable for applications needing local mass storage or richer HMI asset caching.
Availability
MCF5271CAB100 is available at Aetrix Electronics and suitable for industrial gateways, secure HMIs, PLC base units, and building automation controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCF5271CAB100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full support for the ColdFire portfolio, including documentation, reference designs, and long-term supply commitments for industrial microprocessors.
The MCF5271CAB100 belongs to the ColdFire V2 microprocessor family, designed specifically for cost-sensitive, high-integration industrial networking applications requiring deterministic real-time performance, Ethernet connectivity, and hardware-accelerated security.
FAQ
What is the maximum SDRAM capacity supported by the MCF5271CAB100?
The MCF5271CAB100 supports up to 256 MB of SDR SDRAM using its 21-bit address bus (A[20:0]) and configurable bank addressing. The SDRAM controller implements standard JEDEC timing parameters including tRCD, tRP, and tRC, and supports programmable CAS latency (CL=2 or CL=3) to match commercial-grade SDRAM parts.
Does the MCF5271CAB100 support JTAG debugging out-of-the-box?
Yes, the MCF5271CAB100 supports IEEE 1149.1 JTAG debugging via pins TMS, TDI, TDO, TCK, and TRST/DSCLK. JTAG functionality is enabled by asserting JTAG_EN; otherwise, these pins default to GPIO. The integrated BDM interface allows full-cycle accurate breakpoints and register inspection without requiring external debug probes beyond standard BDM cables.
Can the MCF5271CAB100 operate with an external 25 MHz oscillator instead of a crystal?
Yes, the MCF5271CAB100 accepts a single-ended CMOS-level clock signal on the EXTAL pin, with XTAL left unconnected or tied to ground. The internal PLL locks to the external clock and generates the 100 MHz core clock. This configuration simplifies layout and improves jitter immunity compared to crystal-based oscillators in electrically noisy industrial environments.
How does the hardware encryption module in the MCF5271CAB100 function?
The MCF5271CAB100 includes a dedicated cryptographic accelerator supporting AES-128/192/256 (ECB/CBC modes), SHA-1, and SHA-256. It operates independently of the CPU via DMA transfers, enabling concurrent encryption/decryption while the ColdFire core executes application code - critical for maintaining real-time responsiveness during secure communications.
What are the power supply sequencing requirements for reliable startup of the MCF5271CAB100?
The MCF5271CAB100 requires OVDD and VDD to track within 0.4 V during ramp-up, with recommended 1 ms or slower rise time. VDD and OVDD/VDDPLL should rise together to 0.9 V, then separate to final voltages (VDD = 1.5 V, OVDD = 3.3 V). Violating this sequence risks ESD diode conduction and potential latch-up, especially during cold-start conditions.
MCF5271CAB100 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 160-BQFP
- Series:
- MCF527x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Peripherals:
- DMA, WDT
- Number of I/O:
- 39
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5271CAB100 FAQ
1.How can I place an order for MCF5271CAB100 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5271CAB100 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5271CAB100 reliable?
The price and inventory of MCF5271CAB100 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5271CAB100 is usually 5 days.
3.What payment methods are accepted for MCF5271CAB100?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5271CAB100 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5271CAB100?
MCF5271CAB100 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5271CAB100 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5271CAB100?
For technical support, including MCF5271CAB100 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5271CAB100 requirements.
6.How does Aetrix verify that MCF5271CAB100 is sourced from the original manufacturer or authorized distributors?
All MCF5271CAB100 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5271CAB100 meets industry standards.
7.What is the process for return or replacement of MCF5271CAB100?
All MCF5271CAB100 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5271CAB100, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5271CAB100 part is unused and in its original packaging.
Return procedure for MCF5271CAB100:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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