NXP Semiconductors MCF5271CVM100

Overview

MCF5271CVM100 from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire V2 RISC microprocessor with integrated 10/100 Ethernet MAC, 64 KB on-chip SRAM, 8 KB configurable instruction/data cache, and a 32-bit SDR SDRAM controller. It operates at 100 MHz, delivers 96 Dhrystone 2.1 MIPS, and supports hardware encryption for secure networked embedded applications including industrial gateways and network-attached storage.

For engineers reviewing the MCF5271CVM100 datasheet, MCF5271CVM100 pinout, MCF5271CVM100 application, or MCF5271CVM100 equivalent, key selection criteria include its 196 MAPBGA package, dual interrupt controllers (INTC0/INTC1), FEC interface compatibility with MII or 7-wire serial PHYs, and support for external memory up to 2 GB via EIM with programmable timing.

Technical Context

The MCF5271CVM100 implements the ColdFire V2 core with enhanced multiply-accumulate (eMAC) unit and hardware divide, enabling deterministic real-time signal processing. Its memory subsystem integrates a 32-bit SDRAM controller supporting synchronous DRAM with configurable CAS latency, row/column addressing, and SD_CKE-controlled power-down/self-refresh modes.

Peripheral integration includes three UARTs (with RTS/CTS flow control), I²C master/slave, QSPI with four chip selects, four 32-bit DMA timers, and a Fast Ethernet Controller (FEC) that supports both IEEE 802.3-compliant MII (18-signal) and simplified 7-wire serial interfaces - selected via R_CNTRL[MII_MODE].

Key Specifications

Pinout & Package

Package: 196-ball Mold Array Plastic Ball Grid Array (MAPBGA), 15 mm × 15 mm, 1.0 mm pitch, lead-free, RoHS compliant (Case No. 1128A-01). Thermal resistance θJMA = 32°C/W (natural convection, 4-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit networked microprocessor applications.

Compared with MCF5271CVM150, the MCF5271CVM100 offers lower power consumption and relaxed timing margins at the cost of 48 MIPS; compared with MCF5282CVM120, it retains hardware crypto essential for secure boot and encrypted firmware updates but lacks USB connectivity.

Availability

MCF5271CVM100 is available at Aetrix Electronics and suitable for industrial gateways, network-attached storage controllers, secure remote terminal units, and medical device network interfaces requiring stable component supply across extended temperature ranges (–40°C to +85°C).

Supply support for MCF5271CVM100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full support for the ColdFire portfolio, emphasizing long-term industrial and automotive MCU supply with ISO 9001-certified manufacturing.

The MCF5271 family was designed as a cost-optimized, highly integrated solution for Ethernet-connected embedded systems requiring deterministic real-time performance, hardware security acceleration, and broad peripheral support - targeting industrial automation and network infrastructure markets.

FAQ

What is the maximum operating frequency of the MCF5271CVM100?

The MCF5271CVM100 is rated for a maximum clock frequency of 100 MHz, delivering 96 Dhrystone 2.1 MIPS. This speed grade is validated across the full industrial temperature range (–40°C to +85°C) and defines the timing budget for all internal peripherals, including the SDRAM controller and FEC. The MCF5271CVM100 uses the same silicon die as the 150 MHz variant but is binned and tested to guarantee stable operation at 100 MHz under worst-case voltage and temperature conditions.

Does the MCF5271CVM100 support hardware encryption acceleration?

Yes, the MCF5271CVM100 includes dedicated hardware cryptographic modules: SKHA (Security Kernel Hash Accelerator), RNGA (Random Number Generator Accelerator), and MDHA (Message Digest Hash Accelerator). These accelerate AES, SHA-1/SHA-256, and HMAC operations, enabling real-time TLS 1.2 handshakes and IPsec processing without consuming CPU cycles. This capability is confirmed in the MCF5271EC datasheet Section 1 and Figure 1 block diagram.

What package type and pin count does the MCF5271CVM100 use?

The MCF5271CVM100 uses a 196-ball Mold Array Plastic Ball Grid Array (MAPBGA) package, measuring 15 mm × 15 mm with 1.0 mm ball pitch. Pinout details are documented in Figure 3 of the MCF5271EC datasheet, showing ball assignments for power, I/O, Ethernet, SDRAM, and debug interfaces. This package is lead-free and RoHS compliant (Case No. 1128A-01).

Can the MCF5271CVM100 interface directly with standard SDRAM chips?

Yes, the MCF5271CVM100 features a fully integrated 32-bit SDR SDRAM controller with dedicated signals including SD_SRAS, SD_SCAS, SD_WE, SD_CKE, and SD_CS[1:0]. It supports standard JEDEC-compliant SDRAM chips with programmable timing parameters (tRCD, tRP, tWR) and power management modes (self-refresh, power-down). Configuration is performed via the SDRAM Control Register (SDCR) in the memory map.

What is the difference between the MCF5271CVM100 and MCF5271CAB100?

The MCF5271CVM100 uses a 196-ball MAPBGA package optimized for high-density, thermally demanding applications, while the MCF5271CAB100 uses a 160-pin Quad Flat Package (QFP) suited for prototyping and lower-speed layouts. Both share identical electrical specifications, core functionality, and peripheral sets at 100 MHz, but differ in thermal resistance (θJMA = 32°C/W vs. 40°C/W), pin assignment, and PCB assembly requirements (reflow vs. wave solder).