NXP Semiconductors MCF5271CVM100J

Overview

MCF5271CVM100J from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire V2 RISC microprocessor in 196-pin MAPBGA packaging, delivering 100 MHz operation and 144 Dhrystone 2.1 MIPS performance. It integrates a 10/100 Fast Ethernet MAC, 64 KB on-chip SRAM, 8 KB configurable instruction/data cache, and a 32-bit SDR SDRAM controller - enabling embedded networking applications such as industrial gateways and protocol-converged edge devices.

For engineers reviewing the MCF5271CVM100J datasheet, MCF5271CVM100J pinout, MCF5271CVM100J application, or MCF5271CVM100J equivalent, key selection criteria include Ethernet PHY interface mode (MII vs. serial), SDRAM timing compatibility, hardware encryption capability (absent in this variant), and thermal management under sustained 100 MHz operation with multiple peripheral clocks active.

Technical Context

The MCF5271CVM100J implements the ColdFire V2 core with enhanced multiply-accumulate (eMAC) unit and dual interrupt controllers (INTC0/INTC1). Its memory subsystem supports synchronous DRAM via dedicated SD_WE, SD_SCAS, SD_SRAS, SD_CKE, and SD_CS[1:0] signals, while external bus interface (EIM) provides CS[7:0], A[23:0], D[31:0], R/W, and BS[3:0] for parallel memory and peripheral expansion.

It features three UARTs (U0–U2), I²C, QSPI, four 32-bit DMA timers, and programmable GPIO with pin multiplexing - all managed through the PADI (Pin Muxing) module. The device lacks hardware encryption (SKHA/RNGA/MDHA modules are not enabled in this configuration), distinguishing it from the MCF5271CVM150 variant.

Key Specifications

Pinout & Package

196-ball Mold Array Plastic Ball Grid Array (MAPBGA), case number 1128A-01, 15.0 mm × 15.0 mm footprint, 1.0 mm ball pitch, 1.25–1.60 mm package height. Requires reflow profile compatible with lead-free solder (J-STD-020D).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.

Compared with MCF5271CVM150 and MCF5272CVM100, the MCF5271CVM100J offers optimal balance of industrial-grade reliability, Ethernet integration, and thermal efficiency at 100 MHz - making it ideal for cost-sensitive, thermally constrained edge nodes where crypto acceleration is handled externally or omitted.

Availability

MCF5271CVM100J is available at Aetrix Electronics and suitable for industrial gateways, protocol converters, networked HMIs, and embedded network appliances requiring stable component supply across extended product lifecycles.

Supply support for MCF5271CVM100J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller and processor IP.

The MCF5271 family was designed as a cost-optimized, highly integrated ColdFire V2 solution for industrial Ethernet edge devices - emphasizing on-chip memory, deterministic real-time performance, and simplified PHY interfacing without hardware crypto overhead.

FAQ

What is the maximum operating frequency of the MCF5271CVM100J?

The MCF5271CVM100J operates at a maximum frequency of 100 MHz, delivering 144 Dhrystone 2.1 MIPS performance. This speed is guaranteed across the full industrial temperature range (–40°C to +85°C) and requires proper decoupling, thermal management, and voltage sequencing per Freescale's AN1259 layout guidelines. The MCF5271CVM100J does not support overclocking beyond 100 MHz.

Does the MCF5271CVM100J include hardware encryption capabilities?

No, the MCF5271CVM100J does not include hardware encryption modules (SKHA, RNGA, or MDHA). These features are present only in the MCF5272 series and certain MCF5271 variants like the MCF5271CVM150 with optional crypto enablement. For secure communications, software-based AES or SHA implementations must be used, or an external crypto co-processor interfaced via the EIM or SPI.

Which package type and pin count does the MCF5271CVM100J use?

The MCF5271CVM100J uses a 196-ball Mold Array Plastic Ball Grid Array (MAPBGA) package, case number 1128A-01, with 15.0 mm × 15.0 mm body size and 1.0 mm ball pitch. Pin assignments match the MCF5270/71CVMxxx family layout shown in Figure 3 of the MCF5271EC datasheet Rev. 4, and are incompatible with the 160-pin QFP variants (e.g., MCF5271CAB100).

What are the required power supply voltages for the MCF5271CVM100J?

The MCF5271CVM100J requires three independent supplies: VDD = 1.5 V ± 3% (core), OVDD = 3.3 V ± 5% (I/O), and VDDPLL = 2.5 V ± 3% (PLL). Power-up sequencing must ensure VDD and OVDD/VDDPLL track to 0.9 V before separating, with rise times slower than 1 μs to prevent ESD diode conduction. Failure to follow this sequence risks latch-up or permanent damage.

Can the MCF5271CVM100J interface directly with standard SDRAM chips?

Yes, the MCF5271CVM100J includes a fully integrated 32-bit SDR SDRAM controller with dedicated SD_SRAS, SD_SCAS, SD_WE, SD_CKE, SD_CS[1:0], and CLKOUT signals. It supports standard 168-pin 3.3 V SDRAM modules (e.g., Micron MT48LC16M16A2) with configurable timing parameters. External termination resistors and matched trace lengths are required for reliable operation at 100 MHz bus speeds.