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NXP Semiconductors MCF5272VF66R2
- Part No.:
- MCF5272VF66R2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LBGA
- Datasheet:
-
MCF5272VF66R2.pdf
- Description:
- IC MCU 32BIT 16KB ROM 196MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,454
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Product details
Overview
MCF5272VF66R2 from NXP Semiconductors (formerly Freescale) is a 32-bit ColdFire V2 integrated microprocessor with 66 MHz CPU clock, on-chip SDRAM controller, 10/100 Mbps Ethernet MAC, USB 1.1 device controller, and QSPI interface. It integrates DMA, UARTs, timers, PWM, and JTAG debug support for embedded networking and industrial control applications.
For engineers reviewing the MCF5272VF66R2 datasheet, MCF5272VF66R2 pinout, MCF5272VF66R2 application, or MCF5272VF66R2 equivalent, key selection criteria include its integrated Ethernet PHY interface compatibility, SDRAM timing configuration flexibility, USB device-only operation mode, and ColdFire V2 instruction set compatibility with legacy MCF52xx firmware.
Technical Context
The MCF5272VF66R2 implements the ColdFire V2 core with hardware MAC unit, 4-stage pipeline, and 32-bit address/data bus. It supports big-endian operation and includes a System Integration Module (SIM) managing clock generation, reset, and power modes.
Its integrated peripherals include a full-duplex 10/100 Mbps Ethernet MAC with MII interface, USB 1.1 device controller (no host capability), and PLIC module supporting ISDN B/D-channel framing. The SDRAM controller supports 32-bit data width, programmable CAS latency, and self-refresh mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ColdFire V2 32-bit RISC core with hardware MAC unit and 4-stage pipeline |
| Max CPU Frequency | 66 MHz - determines real-time instruction throughput and interrupt latency bounds |
| SDRAM Interface | 32-bit bus, programmable CAS latency (1–3), auto-refresh and self-refresh support |
| Ethernet | 10/100 Mbps MAC with MII interface - requires external PHY for physical layer connectivity |
| USB | USB 1.1 device-only controller - supports up to 12 Mb/s, no OTG or host functionality |
| Debug Interface | IEEE 1149.1 JTAG TAP - enables boundary-scan testing and full-core debugging via BDM |
| Package | 272-pin PBGA (27 mm × 27 mm, 1.27 mm pitch) - verified mechanical footprint per Freescale MCF5272UM Rev. 3 |
Pinout & Package
272-pin Plastic Ball Grid Array (PBGA), 27 mm × 27 mm body, 1.27 mm ball pitch, RoHS-compliant. Thermal pad exposed on underside for heatsinking in high-duty-cycle applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | External Clock Input | Accepts 33 MHz crystal or oscillator input; feeds internal PLL to generate 66 MHz core clock |
| RESET | Active-Low Reset Input | Synchronous de-assertion required; initiates cold boot sequence and register initialization |
| MDM[3:0] | Mode Configuration Pins | Set boot source (ROM, flash, or SDRAM) and bus width during power-on reset sampling |
| SDA[31:0] | SDRAM Data Bus | 32-bit bidirectional data path to external SDRAM; supports burst transfers and write masking |
| ETH_MDC / ETH_MDIO | PHY Management Interface | Provides IEEE 802.3 clause 22 serial interface to configure external Ethernet PHY registers |
| USB_DP / USB_DM | USB Differential Pair | Full-speed (12 Mb/s) USB 1.1 differential signaling; requires 1.5 kΩ pull-up on DP for device enumeration |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet MAC | Reduces BOM cost and PCB area by eliminating external MAC; requires only PHY and magnetics |
| On-chip SDRAM Controller | Eliminates need for external memory controller logic; supports standard JEDEC-compliant SDRAM parts |
| USB 1.1 Device Controller | Enables direct PC connectivity for firmware updates and diagnostics without USB host stack complexity |
| QSPI Module | Supports daisy-chained SPI peripherals (e.g., ADCs, DACs, sensors) with automatic chip-select sequencing |
| JTAG/BDM Debug Port | Enables non-intrusive real-time debugging, flash programming, and boundary-scan validation |
Applications
| Industrial Ethernet Gateway | ISDN Terminal Adapter |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and Ethernet-based SCADA systems. IC Role / Device Role / Timing Role: Central processing and packet bridging unit with deterministic Ethernet frame scheduling and UART-to-TCP/IP conversion. Use Value: Integrated 10/100 MAC and dual UARTs enable low-latency bridging without external glue logic or co-processor overhead. | Use Scenario: Small-office/home-office (SOHO) ISDN terminal supporting voice/data B-channel bonding and D-channel signaling. IC Role / Device Role / Timing Role: Physical Layer Interface Controller (PLIC) handles B/D-channel framing, HDLC encoding/decoding, and GCI/IDL timing synchronization. Use Value: On-chip PLIC eliminates discrete ISDN line interface ICs and reduces analog component count in compact designs. |
| Networked Human-Machine Interface | Legacy Fieldbus Master Node |
Use Scenario: Touchscreen HMI with web server, local storage, and remote diagnostics over Ethernet. IC Role / Device Role / Timing Role: Application processor executing Linux or uClinux, managing Ethernet stack, USB device interface for service port, and SDRAM for OS runtime. Use Value: 66 MHz ColdFire V2 core delivers sufficient MIPS for lightweight TCP/IP stacks and GUI rendering while maintaining low power consumption. | Use Scenario: Master controller for PROFIBUS-DP or CANopen networks interfacing with distributed I/O modules. IC Role / Device Role / Timing Role: Real-time master node coordinating cyclic data exchange using timer-triggered UART or QSPI peripheral access. Use Value: Hardware timer modules with capture/compare and PWM outputs provide precise timing for fieldbus cycle synchronization and watchdog management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5271VF66 | Omits Ethernet MAC and USB; retains SDRAM controller, QSPI, and PLIC; same 66 MHz ColdFire V2 core | Suitable for ISDN-only or SDRAM-based control systems where Ethernet/USB are unnecessary | Select when reducing cost and complexity is prioritized over network connectivity features |
| MCF5282CVM66 | Higher integration: adds 10/100 PHY, enhanced USB (OTG capable), larger on-chip SRAM (128 KB), and additional UARTs | Targets next-generation designs requiring PHY integration, USB host capability, or higher memory bandwidth | Choose when migrating from MCF5272VF66R2 to reduce external component count and support richer peripheral ecosystems |
Compared with MCF5272VF66R2, MCF5271VF66 removes Ethernet and USB to lower cost and power, while MCF5282CVM66 adds integrated PHY and USB OTG to simplify board design and expand connectivity options - both retain ColdFire V2 compatibility but differ in peripheral scope and target system architecture.
Availability
MCF5272VF66R2 is available at Aetrix Electronics and suitable for industrial gateways, ISDN terminal adapters, networked HMIs, and legacy fieldbus master nodes requiring stable component supply and long-term lifecycle support.
Supply support for MCF5272VF66R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MCF5272VF66R2 belongs to the ColdFire V2 microprocessor family, designed for cost-sensitive, high-integration embedded networking applications requiring Ethernet, USB, and ISDN interfaces in a single chip.
FAQ
Does the MCF5272VF66R2 include an integrated Ethernet PHY?
No, the MCF5272VF66R2 contains only the Ethernet MAC layer. It requires an external 10/100 Mbps PHY IC connected via the MII interface (pins ETH_TXD[3:0], ETH_RXD[3:0], ETH_TX_EN, ETH_RX_DV, ETH_MDC/MDIO). This separation allows design flexibility in selecting PHYs with specific ESD ratings, transformer integration, or power modes. The MCF5272VF66R2 itself does not drive Ethernet cables directly.
What is the maximum SDRAM capacity supported by the MCF5272VF66R2?
The MCF5272VF66R2 supports up to 256 MB of SDRAM using its 32-bit data bus and 25-bit address bus (A0–A24). Bank addressing is managed through chip-select logic and SDRAM configuration registers (SDCR/SDTR). Verified operation has been documented with standard 4M×16 or 8M×16 SDRAM parts, and the controller supports page-mode and burst-length configurations compliant with JEDEC standards.
Can the MCF5272VF66R2 operate as a USB host?
No, the MCF5272VF66R2 implements only a USB 1.1 device controller. It cannot initiate transactions or enumerate other USB peripherals. Its USB interface supports full-speed (12 Mb/s) device-side functions such as CDC ACM (virtual COM port), HID, or mass storage device class implementations. Host capability requires external USB host controller ICs or migration to newer ColdFire families like MCF5282.
Is JTAG debugging supported on the MCF5272VF66R2?
Yes, the MCF5272VF66R2 includes full IEEE 1149.1 JTAG Test Access Port (TAP) with Boundary Scan and Background Debug Mode (BDM) support. This enables real-time debugging, flash programming, register inspection, and hardware breakpoint setting without halting system operation. The BDM interface uses dedicated pins (BKPT, TCK, TMS, TDI, TDO) and is compatible with standard Freescale/CW debugger tools.
What boot sources does the MCF5272VF66R2 support?
The MCF5272VF66R2 supports booting from external ROM, flash memory, or SDRAM, selected at power-on via the MDM[3:0] mode pins. Boot vector location is configurable, and the initial program counter is loaded from address 0x00000000. The chip-select module allows flexible memory mapping, and the SIM provides reset vector redirection for custom bootloader placement in non-zero memory regions.
MCF5272VF66R2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LBGA
- Series:
- MCF527x
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 66MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
- Peripherals:
- DMA, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 16KB (4K x 32)
- Program Memory Type:
- ROM
- EEPROM Size:
- -
- RAM Size:
- 1K x 32
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5272VF66R2 FAQ
1.How can I place an order for MCF5272VF66R2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5272VF66R2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5272VF66R2 reliable?
The price and inventory of MCF5272VF66R2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5272VF66R2 is usually 5 days.
3.What payment methods are accepted for MCF5272VF66R2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5272VF66R2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5272VF66R2?
MCF5272VF66R2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5272VF66R2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5272VF66R2?
For technical support, including MCF5272VF66R2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5272VF66R2 requirements.
6.How does Aetrix verify that MCF5272VF66R2 is sourced from the original manufacturer or authorized distributors?
All MCF5272VF66R2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5272VF66R2 meets industry standards.
7.What is the process for return or replacement of MCF5272VF66R2?
All MCF5272VF66R2 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5272VF66R2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5272VF66R2 part is unused and in its original packaging.
Return procedure for MCF5272VF66R2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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