NXP Semiconductors MCF5274CVM166

Overview

MCF5274CVM166 from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor featuring a 166 MHz system clock, 64 KB on-chip SRAM, 16 KB configurable instruction/data cache, dual 10/100 Mbps Ethernet MACs (FEC0 and FEC1), and a 16-bit DDR SDRAM controller. It integrates an enhanced multiply-accumulate unit (EMAC) and supports USB 2.0 Full Speed, three UARTs, I²C, QSPI, and four PWM channels - deployed in industrial networking gateways requiring deterministic real-time control and dual-port Ethernet bridging.

For engineers reviewing the MCF5274CVM166 datasheet, MCF5274CVM166 pinout, MCF5274CVM166 application, or MCF5274CVM166 equivalent, key selection criteria include verified 256-ball MAPBGA mechanical compatibility, confirmed dual-FEC timing compliance per IEEE 802.3 MII, DDR SDRAM interface signal integrity requirements (SD_CKE, SD_SRAS, SD_SCAS, DDR_CLKOUT), and cold-temperature operation support down to –40°C.

Technical Context

The MCF5274CVM166 implements the ColdFire v2 core with EMAC acceleration for DSP-intensive tasks and uses a hierarchical bus architecture with separate EIM (External Interface Module) and DDR SDRAM controller paths. Its interrupt subsystem includes two independent INTC modules supporting nested vector interrupts.

Signal routing follows strict pin-muxing rules: FEC0/FEC1 signals are dedicated (no GPIO overlap), DDR-related pins (SD_CS[1:0], SD_SRAS, SD_SCAS, SD_WE, DDR_CLKOUT) are non-muxed and electrically optimized for SSTL-2.5/3.3 I/O, and USB transceiver pins (USB_RN/TP/TN/RP) require controlled-impedance PCB layout per USB 2.0 Full Speed specifications.

Key Specifications

Pinout & Package

The MCF5274CVM166 is housed in a 256-ball Molded Array Plastic Ball Grid Array (MAPBGA) package measuring 17 mm × 17 mm with 1.0 mm ball pitch. Pin assignments follow the consolidated MCF5274/MCF5275 256 MAPBGA layout (Figure 3), where critical high-speed interfaces (DDR_CLKOUT, SD_CS[1:0], SD_SRAS, SD_SCAS, SD_WE, FEC0/FEC1 MII signals) are placed to minimize trace length and crosstalk.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5275CVM166, the MCF5274CVM166 removes crypto acceleration but retains full dual-FEC capability and DDR bandwidth - making it optimal for cost-sensitive industrial gateways. Against MCF5274LCVM166, it adds FEC1 and a third UART at the expense of larger package size and higher pin count, enabling feature-rich network appliances without performance compromise.

Availability

MCF5274CVM166 is available at Aetrix Electronics and suitable for industrial networking gateways, medical imaging controllers, video surveillance encoders, and secure network appliances requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCF5274CVM166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in microcontrollers, processors, and analog solutions for automotive, industrial, and networking markets.

The MCF5274CVM166 belongs to the ColdFire V2 microprocessor family, designed specifically for cost-sensitive, high-integration embedded applications demanding dual Ethernet connectivity, real-time control, and DDR memory expansion - targeting industrial automation and medical equipment.

FAQ

What is the maximum operating frequency and thermal specification for the MCF5274CVM166?

The MCF5274CVM166 operates at a maximum system clock frequency of 166 MHz and is rated for industrial temperature range (–40°C to +85°C). Its thermal resistance (θJA) is 26.5°C/W in a 4-layer PCB configuration with 2 oz copper and full ground/power planes - requiring ≥400 mm² copper pour under the package for reliable operation at full clock speed.

Does the MCF5274CVM166 support DDR SDRAM, and what voltage levels are required?

Yes, the MCF5274CVM166 integrates a 16-bit DDR SDRAM controller supporting both SSTL-2.5 V and SSTL-3.3 V signaling. The SDVDD supply must be set to match the SDRAM's I/O voltage (2.5 V or 3.3 V), and strict power sequencing per datasheet Figure 2 is mandatory - SDVDD must track VDD up to 0.9 V before separating to its final value.

How many Ethernet MACs does the MCF5274CVM166 include, and are they fully independent?

The MCF5274CVM166 includes two fully independent 10/100 Mbps Fast Ethernet Controllers (FEC0 and FEC1), each with dedicated DMA channels, descriptor lists, and MII interface signals. They operate concurrently without resource contention, enabling true hardware-based bridging or firewalling functionality in the MCF5274CVM166.

What debug interfaces are supported on the MCF5274CVM166, and are they accessible in production?

The MCF5274CVM166 supports both Background Debug Mode (BDM) and IEEE 1149.1 JTAG interfaces. BDM uses dedicated pins (DSCLK, DSI, DSO, BKPT, PSTCLK) and remains fully functional in production firmware; JTAG is enabled via JTAG_EN pin and supports boundary-scan testing and flash programming - both interfaces are routed on standard evaluation boards like the M5275EVB.

Is the MCF5274CVM166 pin-compatible with other members of the MCF5275 family, and which variants share the same 256 MAPBGA package?

Yes, the MCF5274CVM166 shares identical 256 MAPBGA pinout and footprint with MCF5274VM166, MCF5275CVM166, and MCF5275VM166. All four variants use the same mechanical layout (Figure 3), allowing PCB reuse across performance and feature variants - though software must account for missing FEC1 in MCF5274x or absent crypto engines in MCF5274x parts.