NXP Semiconductors MCF5274LCVM166

Overview

MCF5274LCVM166 from NXP Semiconductors (formerly Freescale) is a ColdFire® V2 RISC microprocessor with a 166 MHz core clock, 64 KB on-chip SRAM, dual 10/100 Mbps Ethernet MACs, and a 16-bit DDR SDRAM controller. It integrates an enhanced multiply-accumulate unit (EMAC), USB 2.0 full-speed device interface, three UARTs, I²C, QSPI, PWM, and GPIO - deployed in industrial networking gateways requiring deterministic real-time control and dual-port connectivity.

For engineers reviewing the MCF5274LCVM166 datasheet, MCF5274LCVM166 pinout, MCF5274LCVM166 application, or MCF5274LCVM166 equivalent, key selection criteria include its 196-ball MAPBGA package, -40°C to +85°C industrial temperature grade, dual FEC support for redundant or load-balanced Ethernet links, DDR memory interface timing compliance, and ColdFire V2 instruction set compatibility with legacy MCF52xx codebases.

Technical Context

The MCF5274LCVM166 implements the ColdFire V2 core with EMAC acceleration for signal processing tasks and supports both MII and seven-wire serial PHY interfaces per Ethernet controller. Its DDR SDRAM controller operates in synchronous mode with configurable SD_CS[1:0], SD_SRAS/SD_SCAS, SD_WE, SD_CKE, and DDR_CLKOUT outputs aligned to JEDEC-compliant timing.

It features two independent interrupt controllers (INTC0/INTC1), a 4-channel DMA engine, and pin-muxed peripherals including FEC0/FEC1, USB, QSPI, UARTs, and timers - all mapped to a fixed 196-ball MAPBGA footprint with defined ball assignments for A[20:0], D[31:16], and DDR-specific signals like SD_DQS[3:2] and SD_VREF.

Key Specifications

Pinout & Package

The MCF5274LCVM166 is housed in a 196-ball Molded Array Plastic Ball Grid Array (MAPBGA) package measuring 15 mm × 15 mm with 1.0 mm ball pitch. The package uses solder balls (not leads), and mechanical dimensions comply with Freescale specification MCF5275EC Rev. 4, Figure 6.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5274CVM166 and MCF5275CVM166, the MCF5274LCVM166 uniquely combines industrial temperature operation (-40°C to +85°C) with the compact 196-ball MAPBGA package - optimizing board area and thermal robustness for space-constrained edge gateways without crypto acceleration overhead.

Availability

MCF5274LCVM166 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, remote terminal units (RTUs), and network-attached storage appliances requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCF5274LCVM166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full support for the ColdFire portfolio, including documentation, errata, and long-term supply commitments for industrial microprocessors.

The MCF5274LCVM166 belongs to the ColdFire V2 microprocessor family, designed specifically for cost-sensitive, high-integration embedded applications demanding dual Ethernet, real-time responsiveness, and DDR memory scalability in industrial automation and communications infrastructure.

FAQ

What is the maximum operating frequency of the MCF5274LCVM166?

The MCF5274LCVM166 operates at a maximum core frequency of 166 MHz, delivering up to 159 Dhrystone 2.1 MIPS performance. This speed is guaranteed across the full industrial temperature range (-40°C to +85°C) and requires proper power supply sequencing per Freescale's MCF5275EC Rev. 4 specification. The PLL generates the core clock from an external 1–50 MHz crystal or oscillator connected to EXTAL/XTAL pins.

Does the MCF5274LCVM166 support DDR SDRAM memory?

Yes, the MCF5274LCVM166 includes a dedicated 16-bit DDR SDRAM controller with outputs including DDR_CLKOUT, SD_CKE, SD_SRAS, SD_SCAS, SD_WE, SD_CS[1:0], and SD_DQS[3:2]. It supports both 2.5 V and 3.3 V DDR I/O voltage levels (SDVDD), and timing parameters are programmable via memory controller registers to match JEDEC-compliant DDR chips.

How many Ethernet interfaces does the MCF5274LCVM166 provide?

The MCF5274LCVM166 integrates two independent 10/100 Mbps Fast Ethernet Controllers (FEC0 and FEC1), each supporting full MII interface and optional seven-wire serial mode. Both controllers share no internal resource contention and can operate simultaneously - enabling redundant LAN links, separate management/data planes, or bridging functionality without external switch ICs.

What package type and ball count does the MCF5274LCVM166 use?

The MCF5274LCVM166 uses a 196-ball Molded Array Plastic Ball Grid Array (MAPBGA) package with 15 mm × 15 mm body size and 1.0 mm ball pitch. Pin assignments follow Freescale's MCF5275EC Rev. 4 mechanical drawings, and the package is optimized for industrial thermal performance with exposed thermal pad-compatible PCB layout.

Is hardware encryption available on the MCF5274LCVM166?

No, the MCF5274LCVM166 does not include hardware encryption modules (MDHA, RNGA, SKHA). Those features are present only in the MCF5275L and MCF5275 variants. The MCF5274LCVM166 relies on software-based cryptography or external security ICs for encryption tasks, preserving die area and cost for applications where crypto acceleration is not required.