NXP Semiconductors MCF5274LVF166

Overview

MCF5274LVF166 from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor with a 166 MHz system clock, 64 KB on-chip SRAM, dual 10/100 Mbps Ethernet MACs (FEC0 and FEC1), and a 16-bit DDR SDRAM controller. It integrates an enhanced multiply-accumulate unit (EMAC), 16 KB configurable cache, USB 2.0 full-speed interface, three UARTs, I²C, QSPI, and four PWM channels. It targets embedded networking and security gateways requiring deterministic real-time control and dual-Ethernet connectivity.

For engineers reviewing the MCF5274LVF166 datasheet, MCF5274LVF166 pinout, MCF5274LVF166 application, or MCF5274LVF166 equivalent, key selection considerations include its 196-ball MAPBGA package, 166 MHz operation at industrial temperature (–40°C to +85°C), dual-FEC support in MII or serial mode, DDR SDRAM timing compliance, and hardware-level interrupt controller (INTC) architecture with two independent modules.

Technical Context

The MCF5274LVF166 implements the ColdFire V2 core with EMAC extension for accelerated signal processing tasks. Its memory subsystem includes a 16 KB configurable instruction/data cache and 64 KB tightly coupled SRAM, accessed via a unified bus architecture supporting burst transfers and backdoor access paths.

It features two independent Fast Ethernet Controllers (FEC0 and FEC1) compliant with IEEE 802.3, each supporting MII (18-signal) and seven-wire serial (AMD-mode) PHY interfaces. The DDR SDRAM controller supports synchronous mode with dedicated SD_SRAS, SD_SCAS, SD_WE, SD_CKE, and DDR_CLKOUT signals, and uses BS[3:2] as byte enables mapped to SDRAM DQM pins.

Key Specifications

Pinout & Package

The MCF5274LVF166 is housed in a 196-ball Molded Array Plastic Ball Grid Array (MAPBGA) package with 1.0 mm ball pitch and exposed thermal pad. Pin assignments follow the consolidated MCF5274L/MCF5275L pinout diagram (Figure 5) and Table 2 signal mapping in the MCF5275EC Rev. 4 datasheet.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5274VM166, the MCF5274LVF166 offers industrial temperature operation in a smaller 196-BGA package, reducing board area and thermal mass; compared with MCF5275CVM166, it omits hardware encryption but retains identical dual-FEC, DDR, and EMAC capabilities for cost-sensitive non-secure applications.

Availability

MCF5274LVF166 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure remote access appliances, and medical imaging data routers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCF5274LVF166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5274LVF166 belongs to the ColdFire V2 microprocessor family, designed specifically for cost-sensitive, high-integration embedded applications demanding dual-networking, real-time control, and efficient signal processing without external accelerators.

FAQ

What is the maximum operating frequency of the MCF5274LVF166?

The MCF5274LVF166 operates at a maximum system clock frequency of 166 MHz, delivering up to 159 Dhrystone 2.1 MIPS performance. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) when supplied with compliant VDD, OVDD, SDVDD, and VDDPLL voltages and proper decoupling. The PLL configuration must align with the external crystal or oscillator source feeding EXTAL/XTAL pins.

Does the MCF5274LVF166 support DDR SDRAM memory?

Yes, the MCF5274LVF166 includes a dedicated 16-bit DDR SDRAM controller with full signal support: DDR_CLKOUT, SD_SRAS, SD_SCAS, SD_WE, SD_CKE, SD_CS[1:0], SD_DQS[3:2], and SD_A10. It complies with JEDEC DDR SDRAM standards and manages all timing-critical command sequences autonomously via its DCR register set, eliminating need for external SDRAM controller logic.

How many Ethernet MAC interfaces does the MCF5274LVF166 integrate?

The MCF5274LVF166 integrates two independent 10/100 Mbps Fast Ethernet Controllers (FEC0 and FEC1). Each supports both MII (18-signal) and seven-wire serial (AMD-mode) PHY interfaces. They operate concurrently with separate DMA channels and interrupt vectors, enabling true hardware-isolated dual-network operation in routing, bridging, or failover applications.

What package type and ball count does the MCF5274LVF166 use?

The MCF5274LVF166 uses a 196-ball Molded Array Plastic Ball Grid Array (MAPBGA) package measuring 15 mm × 15 mm with 1.0 mm ball pitch. It includes an exposed thermal pad on the bottom for enhanced heat dissipation and mechanical stability. Pin assignments match the MCF5274L variant documented in Figure 5 and Table 2 of the MCF5275EC Rev. 4 datasheet.

Is hardware encryption available on the MCF5274LVF166?

No, the MCF5274LVF166 does not include hardware encryption modules. Unlike the MCF5275 and MCF5275L variants, it lacks the MDHA (Message Digest Hash Accelerator), RNGA (Random Number Generator), and SKHA (Security Key Handler Accelerator). For applications requiring AES, SHA, or RSA acceleration, the pin-compatible MCF5275CVM166 is the recommended alternative.