NXP Semiconductors MCF5274LVM166

Overview

MCF5274LVM166 from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor with 166 MHz core clock, 64 KB on-chip SRAM, 16 KB configurable instruction/data cache, dual 10/100 Mbps Ethernet MACs (FEC0/FEC1), and DDR SDRAM controller - deployed in network-attached storage, industrial gateways, and embedded security appliances.

For engineers reviewing the MCF5274LVM166 datasheet, MCF5274LVM166 pinout, MCF5274LVM166 application, or MCF5274LVM166 equivalent, key selection criteria include 196-ball MAPBGA package compatibility, dual-FEC timing constraints, DDR SDRAM interface voltage tolerance (2.5V/3.3V), ColdFire V2 instruction set support, and hardware-level interrupt controller (INTC) configuration for real-time I/O handling.

Technical Context

The MCF5274LVM166 implements the ColdFire V2 core with enhanced multiply-accumulate (EMAC) unit and supports Dhrystone 2.1 benchmark at 159 MIPS. It integrates two independent Fast Ethernet Controllers (FEC0/FEC1) compliant with IEEE 802.3 MII and seven-wire serial PHY interfaces, plus a 16-bit DDR SDRAM controller supporting synchronous burst transfers and programmable timing registers.

Its memory subsystem includes 64 KB of on-chip SRAM, 16 KB of configurable cache, and external bus interface (EIM) with programmable chip selects (CS[7:0]), byte enables (BS[3:2]), and address/data multiplexing. The device uses a 196-ball MAPBGA package with dedicated DDR_CLKOUT, SD_CKE, SD_SRAS/SCAS, and SD_DQS[3:2] signals routed to match JEDEC SSTL-2 or SSTL-3 signaling requirements.

Key Specifications

Pinout & Package

196-ball Mold Array Plastic Ball Grid Array (MAPBGA), 15 mm × 15 mm body, 1.0 mm ball pitch, 1.25–1.60 mm height (A dimension), solder ball diameter 0.45–0.55 mm (b dimension). Pin mapping follows Table 2 and Figure 5 in MCF5275EC Rev. 4, with primary I/O functions assigned per ball location (e.g., A1 = NC, K13 = IRQ1, N15 = RESET, P11 = JTAG_EN).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MCF5274VM166, the MCF5274LVM166 saves PCB area and routing complexity via 196-BGA while retaining dual-FEC and DDR SDRAM functionality; versus MCF5275LVM166, it omits hardware crypto but reduces BOM cost and power consumption by ~120 mW typical.

Availability

MCF5274LVM166 is available at Aetrix Electronics and suitable for industrial gateways, network-attached storage systems, and secure video encoder designs requiring stable component supply across extended production lifecycles.

Supply support for MCF5274LVM166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance, low-power microcontrollers for automotive, industrial, and networking markets.

The MCF5274LVM166 belongs to the ColdFire V2 microprocessor family, engineered for cost-sensitive embedded applications demanding integrated Ethernet, DDR memory support, and deterministic real-time processing without external co-processors.

FAQ

What is the maximum operating frequency of the MCF5274LVM166?

The MCF5274LVM166 operates at a maximum core frequency of 166 MHz, achieving 159 Dhrystone 2.1 MIPS performance. This speed is guaranteed under commercial temperature conditions (0°C to +70°C) with proper power supply sequencing, decoupling, and thermal management per Freescale's MCF5275EC Rev. 4 specification.

Does the MCF5274LVM166 support DDR SDRAM memory interfaces?

Yes, the MCF5274LVM166 includes a dedicated 16-bit DDR SDRAM controller with SD_CKE, SD_SRAS/SCAS, SD_WE, SD_DQS[3:2], and DDR_CLKOUT signals. It supports both 2.5V and 3.3V SSTL I/O standards and complies with JEDEC DDR timing parameters including programmable CAS latency and tRCD.

How many Ethernet MACs does the MCF5274LVM166 integrate?

The MCF5274LVM166 integrates two independent 10/100 Mbps Fast Ethernet Controllers (FEC0 and FEC1), each supporting MII and AMD-mode serial PHY interfaces. They feature separate DMA channels, interrupt vectors, and register sets - enabling true concurrent operation without resource contention.

What package type is used for the MCF5274LVM166?

The MCF5274LVM166 uses a 196-ball Mold Array Plastic Ball Grid Array (MAPBGA) package measuring 15 mm × 15 mm with 1.0 mm ball pitch. Its mechanical dimensions and ball map are fully documented in Section 6.3 and Figure 5 of the MCF5275EC Rev. 4 datasheet.

Is hardware encryption available on the MCF5274LVM166?

No, the MCF5274LVM166 does not include hardware encryption modules. Encryption acceleration (SKHA/RNGA/MDHA) is present only in the MCF5275L and MCF5275 variants. For applications requiring AES or SHA offload, MCF5275LVM166 is the functionally equivalent alternative within the same 196-BGA package family.