NXP Semiconductors MCF5274VM166

Overview

MCF5274VM166 from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor with a 166 MHz system clock, 64 KB on-chip SRAM, 16 KB configurable instruction/data cache, dual 10/100 Mbps Ethernet MACs (FEC0 and FEC1), and a 16-bit DDR SDRAM controller. It integrates an enhanced multiply-accumulate unit (EMAC) and supports USB 2.0 Full Speed, three UARTs, I²C, QSPI, PWM, and DMA - deployed in network-attached storage and industrial gateways requiring deterministic real-time control and dual-port Ethernet bridging.

For engineers reviewing the MCF5274VM166 datasheet, MCF5274VM166 pinout, MCF5274VM166 application, or MCF5274VM166 equivalent, key selection criteria include DDR SDRAM interface timing compliance, FEC MII signal routing integrity, ColdFire V2 toolchain compatibility, and 256-ball MAPBGA layout constraints for high-density embedded designs.

Technical Context

The MCF5274VM166 implements the ColdFire V2 core with EMAC acceleration for DSP-intensive tasks and features two independent Fast Ethernet Controllers compliant with IEEE 802.3 MII, each supporting full-duplex 10/100 Mbps operation. Its DDR SDRAM controller operates in synchronous mode with dedicated SD_SRAS, SD_SCAS, SD_WE, SD_CKE, and DDR_CLKOUT signals routed to external memory.

It uses a 256-ball Mold Array Plastic Ball Grid Array (MAPBGA) package with 1.0 mm ball pitch, requiring strict power sequencing (VDD must not exceed OVDD/SDVDD/PLLVDD by >0.4 V), 4-layer PCB stack-up, and localized 0.1 µF + 0.01 µF decoupling per supply rail. The device supports JTAG debugging via IEEE 1149.1 TAP and BDM interface.

Key Specifications

Pinout & Package

The MCF5274VM166 is housed in a 256-ball MAPBGA package (17 mm × 17 mm, 1.0 mm pitch) with solder balls arranged in a 16×16 grid. Pin functions are multiplexed across GPIO, peripheral, and debug roles; primary functionality is defined by default configuration at reset, with alternate functions enabled via PADI register programming.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MCF5274CVM166 and MCF5275VM166, the MCF5274VM166 provides optimal cost-performance balance for commercial-temperature, non-crypto embedded networking - delivering full dual-Ethernet and DDR SDRAM capability without thermal derating or unused security silicon overhead.

Availability

MCF5274VM166 is available at Aetrix Electronics and suitable for industrial gateways, network-attached storage controllers, and medical imaging edge nodes requiring stable component supply and long-term production continuity.

Supply support for MCF5274VM166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5274VM166 belongs to the ColdFire V2 microprocessor family, designed specifically for cost-sensitive, high-integration embedded applications demanding dual Ethernet, DDR memory support, and real-time deterministic processing - targeting networking infrastructure and intelligent edge devices.

FAQ

What is the maximum operating frequency of the MCF5274VM166?

The MCF5274VM166 operates at a maximum system clock frequency of 166 MHz, delivering up to 159 Dhrystone 2.1 MIPS. This frequency is supported across its specified commercial temperature range (0°C to +70°C) and requires proper power supply sequencing and decoupling per Freescale's hardware specification document MCF5275EC Rev. 4. The MCF5274VM166 achieves this performance using the ColdFire V2 core with enhanced multiply-accumulate unit and 16 KB configurable cache.

Does the MCF5274VM166 support DDR SDRAM memory?

Yes, the MCF5274VM166 includes a dedicated 16-bit DDR SDRAM controller with signals including DDR_CLKOUT, SD_CS[1:0], SD_SRAS, SD_SCAS, SD_WE, SD_CKE, and SD_DQS[3:2]. It supports both 2.5 V and 3.3 V DDR SDRAM interfaces and implements JEDEC-compliant timing for row activation, precharge, and refresh cycles. The controller is fully integrated - no external memory controller logic is required when interfacing with standard DDR SDRAM components.

How many Ethernet MACs does the MCF5274VM166 integrate?

The MCF5274VM166 integrates two independent 10/100 Mbps Fast Ethernet Controllers (FEC0 and FEC1), each compliant with IEEE 802.3 MII. Both controllers support full-duplex operation, hardware checksum offload, VLAN tag insertion/removal, and priority-based queuing. They share no internal resources - enabling true concurrent packet processing on separate physical networks without software arbitration overhead.

What package type is used for the MCF5274VM166?

The MCF5274VM166 uses a 256-ball Mold Array Plastic Ball Grid Array (MAPBGA) package measuring 17 mm × 17 mm with 1.0 mm ball pitch. This package is mechanically and electrically identical to the MCF5275 variants and requires a 4-layer PCB with dedicated power/ground planes, controlled-impedance routing for MII and DDR signals, and thermal vias under the die pad for thermal management in continuous operation.

Is hardware encryption available on the MCF5274VM166?

No, the MCF5274VM166 does not include hardware encryption engines. Encryption capabilities such as MDHA (Message Digest Hash Accelerator), RNGA (Random Number Generator), and SKHA (Secure Key Hash Accelerator) are present only in the MCF5275 and MCF5275L variants. The MCF5274VM166 shares the same ColdFire V2 core, dual FECs, DDR controller, and peripheral set - but omits cryptographic accelerators to reduce cost and silicon area for non-security applications.