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NXP Semiconductors MCF5275CVM166

Part No.:
MCF5275CVM166
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
256-LBGA
Datasheet:
AetrixMCF5275CVM166.pdf
Description:
IC MCU 32BIT ROMLESS 256MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,737

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Product details

Overview

MCF5275CVM166 from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor delivering 159 Dhrystone 2.1 MIPS at 166 MHz, featuring dual 10/100 Mbps Ethernet MACs, hardware encryption, 64 KB on-chip SRAM, 16 KB configurable cache, and a 16-bit DDR SDRAM controller in a 256-ball MAPBGA package. It targets embedded networking and security applications requiring high integration and deterministic real-time control.

For engineers reviewing the MCF5275CVM166 datasheet, MCF5275CVM166 pinout, MCF5275CVM166 application, or MCF5275CVM166 equivalent, key selection criteria include dual-FEC support, DDR SDRAM interface timing compliance, hardware crypto acceleration (AES/SHA), ColdFire V2 core instruction set compatibility, and industrial temperature range (–40°C to +85°C) operation.

Technical Context

The MCF5275CVM166 implements the ColdFire V2 core with an enhanced multiply-accumulate unit (EMAC) optimized for signal processing tasks. Its memory subsystem integrates a 16-bit DDR SDRAM controller supporting SSTL-2.5V or SSTL-3.3V I/O, plus 64 KB of on-die SRAM and 16 KB of configurable instruction/data cache.

Dual Fast Ethernet Controllers (FEC0 and FEC1) operate independently in MII mode with full 18-signal MII compliance, including dedicated MDIO/MDC management interfaces and separate TX/RX clock domains. Hardware encryption includes MDHA (SHA-1/SHA-256), SKHA (AES-128/192/256), and RNGA modules accessible via memory-mapped registers.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureColdFire V2 RISC CPU with EMAC - enables efficient DSP-like operations without external coprocessor.
Max Clock Frequency166 MHz - determines maximum instruction throughput and real-time interrupt latency bound.
Dhrystone Performance159 MIPS @ 166 MHz - benchmarked integer performance metric for embedded control code efficiency.
On-chip Memory64 KB SRAM + 16 KB configurable cache - reduces external memory access latency for critical firmware and buffers.
Ethernet InterfacesDual 10/100 Mbps FECs with MII support - enables redundant network links or separate LAN/WAN ports in routing/firewall designs.
Hardware CryptoMDHA (SHA-1/256), SKHA (AES-128/192/256), RNGA - offloads TLS/IPsec stack processing from main CPU.
SDRAM Interface16-bit DDR controller with SSTL-2.5V/3.3V support - directly drives standard DDR SDRAM chips without level-shifting.

Pinout & Package

The MCF5275CVM166 is housed in a 256-ball Molded Array Plastic Ball Grid Array (MAPBGA) package with 1.0 mm ball pitch, 17.0 mm × 17.0 mm body size, and 1.25–1.60 mm height. Pin assignments follow the consolidated MCF5274/75 256 MAPBGA layout per Figure 3 of the hardware specification.

Pin/TerminalCircuit RoleDesign Meaning
RESETActive-low reset inputAsynchronous system initialization; requires external pull-up and debounced assertion per power sequencing guidelines.
EXTAL / XTALOscillator input/outputAccepts 1–50 MHz crystal or external clock; XTAL output drives crystal; EXTAL input accepts buffered clock source.
FEC0_TXD[3:0] / FEC0_RXD[3:0]MII transmit/receive data4-bit parallel MII data path for first Ethernet port; requires matched trace lengths and 50 Ω termination per IEEE 802.3.
FEC1_MDIO / FEC1_MDCPHY management interfaceShared bidirectional serial bus (MDIO) and clock (MDC) for configuring external PHY registers per IEEE 802.3u.
DDR_CLKOUTDDR clock outputDifferential-capable clock output driving SDRAM CLK; must be routed as controlled-impedance 50 Ω line with minimal skew.
SD_CS[1:0]SDRAM chip selectTwo independent chip selects enabling up to two DDR SDRAM banks; supports interleaved access patterns.

Key Features

FeatureDesign Value
Dual Fast Ethernet MACsIndependent FEC0/FEC1 with full MII interface and integrated DMA - eliminates need for external switch or PHY arbitration logic.
Hardware Encryption EngineIntegrated MDHA (SHA), SKHA (AES), and RNGA - achieves >20 MB/s AES-128 throughput without CPU cycles or software library dependencies.
DDR SDRAM Controller16-bit DDR interface with programmable timing registers and auto-refresh control - supports JEDEC-compliant DDR chips up to 266 MT/s data rate.
Enhanced Multiply-Accumulate UnitSingle-cycle 32×32→64-bit MAC with saturation - accelerates FIR/IIR filtering, FFT twiddle factor computation, and motor control algorithms.
Configurable Cache16 KB unified instruction/data cache with write-through or write-back policy - improves code execution speed from internal SRAM while maintaining coherency with external DDR.

Applications

Network RouterSecure Industrial Gateway

Use Scenario: Edge routing device aggregating multiple fieldbus networks (Modbus TCP, EtherNet/IP) into a corporate LAN.

IC Role / Device Role / Timing Role: Primary application processor executing Linux-based routing stack, managing dual Ethernet interfaces, and handling packet forwarding at line rate.

Use Value: Dual FECs enable simultaneous WAN/LAN separation; hardware crypto secures VPN tunnels without degrading throughput.

Use Scenario: Programmable logic controller (PLC) gateway enforcing TLS 1.2 encrypted communication between OT devices and cloud SCADA systems.

IC Role / Device Role / Timing Role: Real-time host processor running deterministic RTOS, performing protocol translation, and executing cryptographic signing of sensor data payloads.

Use Value: Integrated SHA-256 and AES-256 engines validate firmware updates and encrypt telemetry before transmission over untrusted networks.

Medical Imaging ConsoleVideo Surveillance NVR

Use Scenario: DICOM workstation receiving and preprocessing ultrasound image streams from connected probes.

IC Role / Device Role / Timing Role: High-bandwidth data concentrator with DDR SDRAM buffering, EMAC-accelerated image compression, and USB 2.0 host for peripheral control.

Use Value: 64 KB SRAM stores frame buffers; EMAC unit performs real-time JPEG quantization; DDR controller sustains 400+ MB/s sustained read/write for video streaming.

Use Scenario: Network video recorder aggregating H.264 video feeds from 8+ IP cameras via managed Ethernet switches.

IC Role / Device Role / Timing Role: Embedded Linux host managing camera discovery, RTSP session control, storage I/O, and web-based configuration UI.

Use Value: Dual Ethernet ports isolate camera traffic from management traffic; hardware AES encrypts stored footage at rest without CPU overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCF5275LCVM166Same core, same peripherals, but in 196-ball MAPBGA package with reduced pin count and no FEC1_MDIO/FEC1_MDC pins.Lacks second Ethernet management interface; suitable only for single-FEC designs with space-constrained PCBs.Select when board area is critical and dual-MII management is unnecessary.
MCF5274CVM166Identical package and speed grade, but omits hardware encryption (SKHA/MDHA/RNGA) and second FEC (FEC1).Cannot perform on-the-fly TLS handshake or secure boot; limited to single-network edge node roles.Select for cost-sensitive non-security applications where dual Ethernet is not required.

Compared with MCF5275LCVM166 and MCF5274CVM166, the MCF5275CVM166 uniquely delivers full dual-MII Ethernet management and hardware crypto acceleration in the 256-ball footprint-enabling secure, high-throughput network appliance designs without external co-processors or PHY switches.

Availability

MCF5275CVM166 is available at Aetrix Electronics and suitable for network router design, secure industrial gateway development, and medical imaging console production requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MCF5275CVM166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in microcontrollers, processors, and analog solutions for automotive, industrial, and networking markets.

The MCF5275CVM166 belongs to the ColdFire V2 microprocessor family, designed specifically for cost-sensitive, high-integration embedded applications demanding real-time networking, security, and signal processing capabilities in a single-chip solution.

FAQ

What is the operating temperature range for the MCF5275CVM166?

The MCF5275CVM166 is rated for industrial temperature operation from –40°C to +85°C, as confirmed in Table 6 of the ordering information section. This range ensures reliable functionality in harsh environments such as factory automation cabinets, outdoor telecom enclosures, and medical equipment housings where ambient thermal conditions exceed commercial-grade limits.

Does the MCF5275CVM166 support DDR1 or DDR2 SDRAM?

The MCF5275CVM166 supports DDR1 SDRAM only, as specified by its DDR SDRAM controller implementation compliant with JEDEC Standard No. 21-C, Annex L (DDR SDRAM). It does not support DDR2 features such as additive latency or OCD calibration. The controller operates at 133–266 MT/s data rates with programmable CAS latency and burst length settings.

How many Ethernet MACs does the MCF5275CVM166 integrate?

The MCF5275CVM166 integrates two independent Fast Ethernet MACs (FEC0 and FEC1), each supporting full MII interface with dedicated MDIO/MDC management channels, TX/RX clocks, and 4-bit data paths. This dual-MAC capability is explicitly documented in Table 1 and the block diagram of the MCF5275 Hardware Specification Rev. 4.

Is hardware encryption available on the MCF5275CVM166?

Yes, the MCF5275CVM166 includes integrated hardware encryption modules: MDHA for SHA-1 and SHA-256 hashing, SKHA for AES-128/192/256 encryption/decryption, and RNGA for true random number generation. These are memory-mapped peripherals accessible without CPU intervention, as detailed in Section 3 and the block diagram of the MCF5275 Hardware Specification.

What package type and ball count does the MCF5275CVM166 use?

The MCF5275CVM166 uses a 256-ball Molded Array Plastic Ball Grid Array (MAPBGA) package with 1.0 mm ball pitch and 17.0 mm × 17.0 mm body dimensions, as defined in Section 6.1 and Figure 3 of the MCF5275 Hardware Specification Rev. 4. Pin assignments match the MCF5274/75 superset layout.

MCF5275CVM166 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-LBGA
Series:
MCF527x
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5275CVM166 FAQ

1.How can I place an order for MCF5275CVM166 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5275CVM166 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5275CVM166 reliable?

The price and inventory of MCF5275CVM166 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5275CVM166 is usually 5 days.

3.What payment methods are accepted for MCF5275CVM166?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5275CVM166 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5275CVM166?

MCF5275CVM166 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5275CVM166 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5275CVM166?

For technical support, including MCF5275CVM166 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5275CVM166 requirements.

6.How does Aetrix verify that MCF5275CVM166 is sourced from the original manufacturer or authorized distributors?

All MCF5275CVM166 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5275CVM166 meets industry standards.

7.What is the process for return or replacement of MCF5275CVM166?

All MCF5275CVM166 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5275CVM166, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5275CVM166 part is unused and in its original packaging.

Return procedure for MCF5275CVM166:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCF5275CVM166 Tags

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