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NXP Semiconductors MCF5275CVM166J

Part No.:
MCF5275CVM166J
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
256-LBGA
Datasheet:
AetrixMCF5275CVM166J.pdf
Description:
IC MCU 32BIT ROMLESS 256MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,782

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Product details

Overview

MCF5275CVM166J from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor delivering 159 Dhrystone 2.1 MIPS at 166 MHz, featuring dual 10/100 Mbps Ethernet MACs, hardware encryption (AES/DES/SHA), 64 KB on-chip SRAM, and a 16-bit DDR SDRAM controller in a 256-ball MAPBGA package. It targets embedded networking and security applications requiring high integration and deterministic real-time control.

For engineers reviewing the MCF5275CVM166J datasheet, MCF5275CVM166J pinout, MCF5275CVM166J application, or MCF5275CVM166J equivalent, key selection criteria include dual FEC support, DDR SDRAM interface timing compliance, hardware crypto acceleration throughput, ColdFire V2 core debug via BDM/JTAG, and industrial temperature operation (–40°C to +85°C).

Technical Context

The MCF5275CVM166J implements the ColdFire V2 core with an enhanced multiply-accumulate (EMAC) unit and configurable 16 KB instruction/data cache. Its memory subsystem integrates a 16-bit DDR SDRAM controller supporting SSTL-2.5V or SSTL-3.3V I/O, plus dedicated bus arbitration for concurrent access between CPU, DMA, and peripherals.

Dual Fast Ethernet Controllers (FEC0/FEC1) operate independently in MII or seven-wire serial mode, each with full IEEE 802.3-compliant MAC logic, MDIO management interface, and integrated DMA channels. Hardware encryption modules accelerate AES-128/192/256, DES, 3DES, and SHA-1 operations without CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureColdFire V2 32-bit RISC CPU with EMAC and 16 KB configurable cache
Max Clock Frequency166 MHz - enables 159 Dhrystone 2.1 MIPS performance
On-Chip Memory64 KB SRAM - used for code execution, data buffering, and stack without external RAM
Ethernet InterfacesDual 10/100 Mbps FECs - supports redundant network links or separate LAN/WAN interfaces
Hardware CryptoAES/DES/3DES/SHA-1 accelerators - offloads encryption from CPU, enabling secure boot and TLS handshake acceleration
DDR Controller16-bit DDR SDRAM interface - supports up to 200 MHz clock (100 MHz DDR data rate) with programmable timing registers
Operating Temperature–40°C to +85°C - qualified for industrial and extended-temperature embedded deployments

Pinout & Package

The MCF5275CVM166J is housed in a 256-ball Molded Array Plastic Ball Grid Array (MAPBGA) package measuring 17 mm × 17 mm × 1.4 mm (A2 = 1.16 mm nominal height), with 1.0 mm ball pitch and solder balls compliant to J-STD-020 moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
RESETActive-low system reset inputAsynchronous assertion forces cold reset; requires external pull-up and debounced source per design recommendations
FEC0_TXD[3:0]Fast Ethernet Controller 0 transmit data bus4-bit parallel MII transmit path; must be length-matched to FEC0_TXEN/FEC0_TXCLK for signal integrity
DDR_CLKOUTDDR SDRAM clock outputDifferential-capable clock pair (T7/P6 and T6/P5) drives SDRAM CLK inputs with controlled slew rate
SD_CS[1:0]SDRAM chip select outputsSelects up to two independent DDR SDRAM banks; mapped to PSRAM[7:6] alternate function
JTAG_ENJTAG functionality enableHigh-level assertion enables TDI/TDO/TMS/TRST pins for boundary scan and debug; defaults to GPIO otherwise

Key Features

FeatureDesign Value
Dual FEC with MII/serial PHY interfaceEnables simultaneous wired LAN and WAN connectivity or failover redundancy without external switch logic
Hardware AES/SHA accelerationReduces cryptographic processing latency by >90% vs. software-only implementation, critical for IPsec and HTTPS offload
Configurable 16 KB cacheAllows runtime partitioning between instruction and data cache to optimize throughput for mixed-code/data workloads
DDR SDRAM controller with SSTL I/OSupports industry-standard 2.5V or 3.3V DDR modules, eliminating need for level-shifting buffers in memory subsystem
BDM/JTAG debug interfaceProvides non-intrusive real-time debugging, flash programming, and trace capture via standard ColdFire BDM protocol

Applications

Industrial Ethernet GatewaySecure Network Appliance

Use Scenario: Protocol translation between Modbus TCP and EtherNet/IP in factory automation systems.

IC Role / Device Role / Timing Role: Primary application processor executing real-time protocol stacks and managing dual Ethernet ports.

Use Value: Dual FECs eliminate external PHY multiplexing; hardware crypto secures firmware updates and remote diagnostics.

Use Scenario: Embedded firewall or VPN concentrator for small business edge networks.

IC Role / Device Role / Timing Role: Host processor running Linux-based security stack with accelerated packet filtering and TLS termination.

Use Value: AES/SHA hardware engines sustain 25+ Mbps encrypted throughput while freeing CPU for deep packet inspection.

Medical Imaging ControllerDigital Video Encoder

Use Scenario: DICOM image acquisition and compression in portable ultrasound devices.

IC Role / Device Role / Timing Role: Central controller managing USB 2.0 host interface, DDR SDRAM frame buffer, and JPEG encoding pipeline.

Use Value: 64 KB SRAM stores intermediate image buffers; DDR controller supports burst transfers for real-time video streaming.

Use Scenario: HD video encoding for IP surveillance cameras with H.264 compression.

IC Role / Device Role / Timing Role: System-on-chip processor handling sensor interface, DDR memory management, and Ethernet transport layer.

Use Value: Dual FECs enable simultaneous video streaming and device management traffic; EMAC unit accelerates motion estimation algorithms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCF5275LCVM166Same core, same peripherals, but 196-ball MAPBGA package and identical –40°C to +85°C ratingLower pin count reduces PCB layer count and routing complexity; DDR interface limited to single bank due to fewer address linesSelect when board space is constrained and dual Ethernet bandwidth requirements are moderate
MCF5274CVM166Omits hardware encryption module; retains dual FEC, DDR controller, and 64 KB SRAMSuitable for cost-sensitive networking applications where crypto is handled externally or not requiredChoose when AES/SHA acceleration is unnecessary and BOM cost reduction is prioritized over security feature set

Compared with MCF5275LCVM166 and MCF5274CVM166, the MCF5275CVM166J provides the full superset of features-including hardware crypto and 256-ball DDR interface flexibility-making it optimal for security-critical, high-bandwidth industrial gateways requiring long-term supply stability.

Availability

MCF5275CVM166J is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure network appliances, medical imaging controllers, and digital video encoders requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for MCF5275CVM166J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in embedded processing solutions, specializing in microcontrollers, microprocessors, and analog products for automotive, industrial, and networking markets.

The MCF5275CVM166J belongs to the ColdFire V2 microprocessor family, designed specifically for high-performance, cost-sensitive embedded applications demanding integrated connectivity, real-time control, and hardware-accelerated security functions.

FAQ

What is the maximum DDR SDRAM data rate supported by the MCF5275CVM166J?

The MCF5275CVM166J DDR SDRAM controller supports a 100 MHz clock frequency, enabling a 200 MT/s data rate in double-data-rate mode. This is achieved using the DDR_CLKOUT signal pair (T7/P6 and T6/P5) driving standard SSTL-2.5V or SSTL-3.3V DDR modules. Timing parameters including tRCD, tRP, and tRAS are programmable via the SDRAM Control Register (SDCR) to match specific memory device specifications. The controller does not support DDR2 or LPDDR.

Does the MCF5275CVM166J support JTAG boundary scan testing?

Yes, the MCF5275CVM166J fully supports IEEE 1149.1 JTAG boundary scan testing. Pins TDO/DSO (P15), TDI/DSI (R16), TMS/BKPT (R15), TRST/DSCLK (P14), and TCLK/PSTCLK (P16) implement the standard JTAG test access port. JTAG_EN (R14) must be asserted high to enable JTAG functionality; otherwise, these pins default to GPIO or alternate peripheral roles. Boundary scan instructions and register definitions follow the ColdFire V2 architecture specification.

How is hardware encryption implemented in the MCF5275CVM166J?

The MCF5275CVM166J integrates dedicated cryptographic co-processors for AES-128/192/256, DES, 3DES, and SHA-1 algorithms. These modules operate independently of the ColdFire V2 core and are accessed via memory-mapped registers in the Chip Configuration Module (CIM) address space. Encryption keys and data are transferred through DMA channels, enabling throughput exceeding 25 Mbps for AES-CBC mode without CPU overhead. No software library is required to invoke acceleration - only proper register initialization and descriptor setup.

Can the MCF5275CVM166J operate with both 2.5V and 3.3V DDR SDRAM?

Yes, the MCF5275CVM166J DDR SDRAM interface supports both SSTL-2.5V and SSTL-3.3V signaling standards. The SD_VDD power domain (pins E9–E11, F9–F12, etc.) must be supplied at the corresponding voltage level, and the SDRAM Control Register (SDCR) must be configured to select the appropriate drive strength and termination settings. Electrical characteristics in Table 7 specify absolute maximum ratings for SDVDD as –0.3 V to +2.8 V (for 2.5V mode) or –0.3 V to +4.0 V (for 3.3V mode), confirming dual-voltage compatibility.

What debug interface does the MCF5275CVM166J use, and is it compatible with standard tools?

The MCF5275CVM166J uses the Background Debug Mode (BDM) interface, implemented on pins DSCLK (P14), PSTCLK (P16), BKPT (R15), DSI (R16), DSO (P15), and PST[3:0] (T10/R10/T11/R11). It is fully compatible with standard ColdFire BDM debuggers such as the P&E Micro USB-ML-CFE and Segger J-Link with ColdFire firmware. The interface supports real-time halt/resume, register read/write, memory access, and flash programming without requiring JTAG_EN assertion - unlike JTAG, BDM operates independently of pin muxing state.

MCF5275CVM166J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-LBGA
Series:
MCF527x
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5275CVM166J FAQ

1.How can I place an order for MCF5275CVM166J through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5275CVM166J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5275CVM166J reliable?

The price and inventory of MCF5275CVM166J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5275CVM166J is usually 5 days.

3.What payment methods are accepted for MCF5275CVM166J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5275CVM166J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5275CVM166J?

MCF5275CVM166J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5275CVM166J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5275CVM166J?

For technical support, including MCF5275CVM166J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5275CVM166J requirements.

6.How does Aetrix verify that MCF5275CVM166J is sourced from the original manufacturer or authorized distributors?

All MCF5275CVM166J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5275CVM166J meets industry standards.

7.What is the process for return or replacement of MCF5275CVM166J?

All MCF5275CVM166J units undergo pre-shipment inspection (PSI). If there is an issue with MCF5275CVM166J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5275CVM166J part is unused and in its original packaging.

Return procedure for MCF5275CVM166J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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