NXP Semiconductors MCF5275LCVM133

Overview

MCF5275LCVM133 from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor with 166 MHz core clock, 64 KB on-chip SRAM, 16 KB configurable instruction/data cache, dual 10/100 Mbps Ethernet MACs (FEC0/FEC1), USB 2.0 Full-Speed device interface, and hardware encryption acceleration. It targets embedded networking gateways, industrial security appliances, and medical imaging control systems requiring deterministic real-time processing and secure data handling.

For engineers reviewing the MCF5275LCVM133 datasheet, MCF5275LCVM133 pinout, MCF5275LCVM133 application, or MCF5275LCVM133 equivalent, key selection criteria include DDR SDRAM controller timing compliance, FEC MII/serial PHY interface configuration, ColdFire V2 toolchain compatibility, and -40°C to +85°C industrial temperature operation.

Technical Context

The MCF5275LCVM133 implements the ColdFire V2 core with enhanced multiply-accumulate (EMAC) unit for signal processing acceleration and supports both synchronous and DDR SDRAM interfaces via dedicated SD_CS[1:0], SD_SRAS/SCAS/WE, and DDR_CLKOUT outputs. Its dual FEC modules operate in MII (18-signal) or seven-wire serial mode, selectable via R_CNTRL[MII_MODE].

Hardware encryption includes SKHA (Secure Key Hash Accelerator), RNGA (Random Number Generator), and MDHA (Message Digest Hash Accelerator) modules supporting AES, SHA-1/256, and HMAC. The 196-ball MAPBGA package uses ball-grid routing with dedicated power domains: VDD (core), OVDD (I/O), SD_VDD (SDRAM), and VDDPLL (PLL).

Key Specifications

Pinout & Package

Package: 196-ball Molded Array Plastic Ball Grid Array (MAPBGA), 15 mm × 15 mm body, 1.0 mm ball pitch, 1.25–1.60 mm height. Pinout defined per Table 2 and Figure 5 of MCF5275EC Rev. 4, with primary I/O functions including dual FEC MII signals (FEC0_TXD[3:0], FEC1_RXD[3:0]), DDR_CLKOUT, SD_CS[1:0], USB_RP/TN/TP/TN, and QSPI_DIN/DOUT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MCF5275CVM166, the MCF5275LCVM133 saves board space and routing complexity with its 196-ball footprint while retaining dual Ethernet and crypto acceleration; compared with MCF5274LCVM166, it adds critical redundancy and security features essential for medical and surveillance deployments.

Availability

MCF5275LCVM133 is available at Aetrix Electronics and suitable for industrial network gateways, medical imaging control units, and secure video surveillance appliances requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCF5275LCVM133 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in embedded processing solutions, specializing in automotive, industrial, and networking microcontrollers and processors.

The MCF5275 family was designed to deliver high-performance ColdFire V2 processing with integrated networking and security peripherals for cost-sensitive, real-time embedded applications in harsh environments.

FAQ

What is the maximum operating frequency of the MCF5275LCVM133?

The MCF5275LCVM133 operates at a maximum core clock frequency of 166 MHz, delivering up to 159 Dhrystone 2.1 MIPS performance. This frequency is achieved using an external 25 MHz crystal connected to EXTAL/XTAL pins and internally multiplied via the PLL. The rated speed is guaranteed across the full -40°C to +85°C industrial temperature range specified for the MCF5275LCVM133.

Does the MCF5275LCVM133 support DDR SDRAM memory interfaces?

Yes, the MCF5275LCVM133 includes a dedicated DDR SDRAM controller with outputs DDR_CLKOUT, SD_CS[1:0], SD_SRAS/SCAS/WE, SD_A10, SD_DQS[3:2], and SD_CKE. It supports both 2.5 V and 3.3 V SSTL signaling levels and requires proper termination and trace length matching per Freescale AN1259 guidelines. The controller is fully integrated and does not require external logic for DDR command sequencing.

How many Ethernet MAC interfaces does the MCF5275LCVM133 provide?

The MCF5275LCVM133 provides two independent 10/100 Mbps Fast Ethernet Controllers (FEC0 and FEC1), each supporting MII (18-signal) and seven-wire serial PHY interfaces. These are physically distinct modules with separate register sets, DMA channels, and interrupt vectors, enabling true concurrent operation for applications like network bridging, firewalling, or redundant LAN paths in the MCF5275LCVM133 design.

What hardware encryption capabilities are integrated into the MCF5275LCVM133?

The MCF5275LCVM133 integrates three dedicated security accelerators: SKHA (Secure Key Hash Accelerator) for AES-128/256 encryption/decryption, RNGA (Random Number Generator) for cryptographically secure entropy, and MDHA (Message Digest Hash Accelerator) for SHA-1/256 and HMAC computation. These modules operate independently of the ColdFire V2 core and are accessible via memory-mapped registers, reducing CPU load during TLS handshakes or encrypted data streaming in the MCF5275LCVM133.

What is the package type and ball count for the MCF5275LCVM133?

The MCF5275LCVM133 uses a 196-ball Molded Array Plastic Ball Grid Array (MAPBGA) package measuring 15 mm × 15 mm with 1.0 mm ball pitch. This compact footprint is documented in Figure 5 and Section 6.3 of the MCF5275EC Rev. 4 datasheet and is distinct from the 256-ball variant used in the MCF5275CVM166. The 196-MAPBGA supports all core peripherals while minimizing PCB area and routing layers.