NXP Semiconductors MCF5275LCVM166

Overview

MCF5275LCVM166 from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor with a 166 MHz system clock, 159 Dhrystone 2.1 MIPS performance, dual 10/100 Mbps Ethernet MACs (FEC0 and FEC1), hardware encryption engine (MDHA/RNGA/SKHA), 64 KB on-chip SRAM, and 16 KB configurable instruction/data cache. It integrates a DDR SDRAM controller, USB 2.0 full-speed device, three UARTs, I²C, QSPI, and four PWM timers - deployed in industrial networking gateways requiring deterministic real-time control and secure data transport.

For engineers reviewing the MCF5275LCVM166 datasheet, MCF5275LCVM166 pinout, MCF5275LCVM166 application, or MCF5275LCVM166 equivalent, key selection criteria include dual-FEC timing alignment, DDR SDRAM interface voltage compatibility (2.5V/3.3V), hardware crypto acceleration support for TLS/IPsec offload, and 196-ball MAPBGA thermal-mechanical constraints in space-constrained embedded designs.

Technical Context

The MCF5275LCVM166 implements the ColdFire V2 core with an enhanced multiply-accumulate (EMAC) unit optimized for signal processing tasks. Its memory subsystem includes a 16-bit DDR SDRAM controller supporting SSTL-2.5V or SSTL-3.3V interfaces, plus dedicated bus signals (SD_CS[1:0], SD_SRAS, SD_SCAS, SD_WE, SD_CKE, DDR_CLKOUT) routed to external DRAM banks.

Dual Fast Ethernet controllers operate independently with full MII interface support (18-pin per MAC), including MDIO/MDC management channels and separate TX/RX clock domains. Hardware encryption modules (MDHA, RNGA, SKHA) are accessible via memory-mapped registers and support AES-128/192/256, SHA-1/256, and RSA key generation without CPU intervention.

Key Specifications

Pinout & Package

196-ball Molded Array Plastic Ball Grid Array (MAPBGA), 15 mm × 15 mm body, 1.0 mm ball pitch, 1.25–1.60 mm height (A dimension), solder ball diameter 0.45–0.55 mm (b dimension). Thermal pad not present; bottom-side balls provide signal/power/ground connections only.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MCF5275CVM166, the MCF5275LCVM166 saves 1.2 cm² PCB area and eases thermal design but sacrifices 60 GPIO pins; versus MCF5274LCVM166, it adds critical dual-FEC redundancy and hardware crypto essential for medical/industrial security certifications.

Availability

MCF5275LCVM166 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure remote terminal units (RTUs), medical imaging edge nodes, and networked digital signage controllers requiring stable component supply across extended temperature ranges.

Supply support for MCF5275LCVM166 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance, low-power microcontrollers for automotive, industrial, and networking markets.

The MCF5275 family targets cost-sensitive embedded systems needing integrated connectivity, real-time control, and hardware security - specifically engineered for industrial gateways, medical edge devices, and secure IoT endpoints.

FAQ

What is the operating temperature range for the MCF5275LCVM166?

The MCF5275LCVM166 is rated for industrial temperature operation from –40°C to +85°C. This range is validated per Freescale's Electrical Characteristics specification (Table 7), ensuring reliable functionality in harsh environments such as factory floors or outdoor telecom cabinets. The 'L' suffix in the part number explicitly denotes this extended temperature grade, and thermal derating is not required within these limits.

Does the MCF5275LCVM166 support DDR2 memory?

No, the MCF5275LCVM166 supports only standard DDR SDRAM (not DDR2). Its DDR SDRAM controller implements the JEDEC PC133-compliant interface with SSTL_25 or SSTL_33 I/O standards, 16-bit data bus width, and programmable CAS latency (CL = 2 or 3). DDR2-specific features like on-die termination or additive latency are absent; attempting DDR2 connection will result in initialization failure.

How is hardware encryption accessed in the MCF5275LCVM166?

Hardware encryption in the MCF5275LCVM166 is accessed via memory-mapped registers in the Cryptography Modules (MDHA, RNGA, SKHA) located at fixed addresses in the on-chip peripheral space. Software uses standard store/load instructions to configure algorithms, load keys, submit data, and read results - no special instructions or privilege modes are required. The MCF5275LCVM166 datasheet Section 3.4 details register offsets and usage sequences.

What package type does the MCF5275LCVM166 use?

The MCF5275LCVM166 uses a 196-ball Molded Array Plastic Ball Grid Array (MAPBGA) package measuring 15 mm × 15 mm with 1.0 mm ball pitch. Mechanical dimensions comply with Freescale specification Figure 6, including A1 ball identification via laser mark and solder ball height tolerance (0.45–0.55 mm). This package is distinct from the 256-ball variant used in the MCF5275CVM166.

Can the MCF5275LCVM166 boot from QSPI flash?

Yes, the MCF5275LCVM166 supports direct boot from QSPI flash using its integrated QSPI controller. Pins QSPI_CS0–QSPI_CS3, QSPI_CLK, QSPI_DIN, and QSPI_DOUT are assigned to dedicated ball locations (e.g., P12, M9, T15, T13, R12) and configured at reset via CLKMOD[1:0] strap pins. The boot ROM initializes the QSPI interface and executes code from flash without external glue logic or FPGA assistance.