NXP Semiconductors MCF5275LCVM166J

Overview

MCF5275LCVM166J from Freescale Semiconductor is a ColdFire® V2 RISC microprocessor with 166 MHz core clock, 64 KB on-chip SRAM, 16 KB configurable instruction/data cache, dual 10/100 Mbps Ethernet MACs (FEC0/FEC1), and hardware encryption acceleration. It integrates DDR SDRAM controller, USB 2.0 Full-Speed device, three UARTs, I²C, QSPI, PWM, and 4-channel DMA - deployed in industrial networking gateways requiring deterministic real-time control and secure data forwarding.

For engineers reviewing the MCF5275LCVM166J datasheet, MCF5275LCVM166J pinout, MCF5275LCVM166J application, or MCF5275LCVM166J equivalent, key selection criteria include verified 196-ball MAPBGA package compatibility, cold-temperature operation (–40°C to +85°C), dual-FEC timing alignment, DDR SDRAM interface signal integrity, and hardware AES/SHA acceleration support per MCF5275L configuration.

Technical Context

The MCF5275LCVM166J implements the ColdFire V2 core with enhanced multiply-accumulate (EMAC) unit and supports Dhrystone 2.1 benchmark at 159 MIPS. Its memory subsystem includes 64 KB SRAM, 16 KB configurable cache, and a 16-bit DDR SDRAM controller supporting SSTL-2.5V or SSTL-3.3V interfaces.

It features two independent Fast Ethernet Controllers compliant with IEEE 802.3 MII, hardware cryptographic modules (MDHA, RNGA, SKHA), and pin-muxed peripherals including three UARTs, I²C, QSPI, and four 32-bit programmable timers with PWM capability - all managed via dual interrupt controllers (INTC0/INTC1).

Key Specifications

Pinout & Package

196-ball Mold Array Plastic Ball Grid Array (MAPBGA), 15 mm × 15 mm, 1.0 mm ball pitch, 1.25–1.60 mm package height. Pinout defined per Figure 5 and Table 2 in MCF5275EC Rev. 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5275CVM166, the MCF5275LCVM166J offers identical performance and security features in a smaller 196-ball package ideal for space-constrained gateways; versus MCF5274LCVM166, it adds critical dual-FEC redundancy and hardware crypto essential for secure edge deployments.

Availability

MCF5275LCVM166J is available at Aetrix Electronics and suitable for industrial network gateways, secure remote terminal units (RTUs), medical imaging edge nodes, and embedded digital signage controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCF5275LCVM166J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5275 family was designed as a high-integration ColdFire V2 microprocessor targeting cost-sensitive, performance-critical edge devices requiring dual Ethernet, hardware security, and DDR memory support - bridging the gap between microcontrollers and application processors.

FAQ

What is the operating temperature range for the MCF5275LCVM166J?

The MCF5275LCVM166J is rated for industrial operation from –40°C to +85°C ambient temperature. This specification is confirmed in Table 6 of the MCF5275EC datasheet (Rev. 4), which lists "MCF5275LCVM166" explicitly with the "–40° to +85° C" temperature grade. The "L" suffix denotes the extended temperature variant, and the "J" suffix indicates lead-free packaging.

Does the MCF5275LCVM166J include hardware encryption acceleration?

Yes, the MCF5275LCVM166J includes dedicated hardware cryptographic modules: MDHA (for SHA-1 and SHA-256), RNGA (true random number generator), and SKHA (for AES-128/192/256). These are present only in the "L" variants (MCF5275L/MCF5274L) per Table 1 in the MCF5275EC datasheet, distinguishing it from non-L versions like MCF5275CVM166.

What package type and ball count does the MCF5275LCVM166J use?

The MCF5275LCVM166J uses a 196-ball Mold Array Plastic Ball Grid Array (MAPBGA) package, as specified in Table 6 ("Orderable Part Numbers") and detailed in Section 6.3 ("196 MAPBGA Pinout") of the MCF5275EC Rev. 4 datasheet. Its mechanical dimensions are 15 mm × 15 mm with 1.0 mm ball pitch.

How many Ethernet MACs does the MCF5275LCVM166J support, and what interfaces do they use?

The MCF5275LCVM166J supports two independent 10/100 Mbps Fast Ethernet Controllers (FEC0 and FEC1), both compliant with IEEE 802.3 MII. As shown in Table 1 and Section 5.7.2 of the MCF5275EC datasheet, each FEC provides full MII signal sets (TXD/RXD, TXEN, RXDV, etc.) and optional seven-wire serial mode for legacy PHYs.

Is the MCF5275LCVM166J pin-compatible with other members of the MCF5275 family?

No - the MCF5275LCVM166J (196-ball MAPBGA) is not pin-compatible with the 256-ball variants (e.g., MCF5275CVM166). Per Section 6.1 and 6.3 of the MCF5275EC datasheet, the 196-ball and 256-ball packages have entirely different pinouts, ball maps, and signal allocations; PCB layout and routing must be redesigned for migration between them.