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NXP Semiconductors MCF53011CQT240

Part No.:
MCF53011CQT240
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
208-LQFP
Datasheet:
AetrixMCF53011CQT240.pdf
Description:
IC MCU 32BIT ROMLESS 208TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,232

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Product details

Overview

MCF53011CQT240 from NXP Semiconductors (formerly Freescale) is a 240 MHz ColdFire® v3 microprocessor with integrated EMAC, 128 KB SRAM, eSDHC, dual 10/100 Ethernet MACs, USB 2.0 OTG/host, voice-band audio codec, and cryptography acceleration unit (CAU). It targets VoIP gateways, industrial communication controllers, and secure embedded networking devices requiring real-time processing, multi-interface connectivity, and low-power standby operation.

For engineers reviewing the MCF53011CQT240 datasheet, MCF53011CQT240 pinout, MCF53011CQT240 application, or MCF53011CQT240 equivalent, key selection criteria include LQFP-208 package compatibility, 240 MHz core clock with ≤80 MHz peripheral bus, CAU-supported AES/SHA-1 acceleration, dual-FEC timing compliance, and eSDHC support for SDIO/CE-ATA/MMC cards in resource-constrained edge nodes.

Technical Context

The MCF53011CQT240 implements a ColdFire v3 core with EMAC and executes up to 211 Dhrystone 2.1 MIPS at 240 MHz. Its crossbar switch enables concurrent access to peripherals and 128 KB SRAM by multiple bus masters, while the eSDHC controller supports CE-ATA, SDIO, MMC, and SD Combo cards with programmable data width and voltage switching.

It integrates two independent Fast Ethernet controllers compliant with IEEE 802.3, each supporting RMII/MII interfaces and full-duplex 10/100 Mbps operation. The on-chip CAU accelerates DES, 3DES, AES, MD5, and SHA-1 algorithms in hardware, and the RTC module maintains timekeeping during VSTBY_SRAM/VSTBY_RTC standby power modes.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureColdFire v3 with EMAC - delivers deterministic real-time control and DSP-like multiply-accumulate performance for VoIP and protocol stack offload.
Max Core Frequency240 MHz - enables high-throughput packet processing and concurrent audio codec + encryption operations without external co-processors.
SRAM128 KB internal SRAM with standby power supply - retains critical context and cryptographic keys during low-power Stop(3) mode (0.65 mA).
eSDHC SupportSD Memory, SDIO, miniSDIO, CE-ATA, MMC, MMC plus - allows direct attachment of Wi-Fi/BT modules, secure storage, and field-upgradable firmware.
Ethernet Interfaces2 × 10/100 Mbps FEC with RMII/MII - supports redundant LAN links or separate management/data planes in industrial routers and gateways.
Cryptography UnitCAU with AES-128/192/256, SHA-1, MD5 - reduces CPU load for TLS/IPsec and enables FIPS-compliant secure boot and OTA updates.
Audio CodecVoice-band ADC/DAC with integrated speaker/microphone/headphone amplifiers - eliminates need for external analog front-end in VoIP endpoints and IP PBX systems.

Pinout & Package

Package: 208-pin LQFP (28 mm × 28 mm), 0.5 mm pitch, RoHS-compliant. Thermal pad exposed on bottom for enhanced heat dissipation in fanless industrial enclosures.

Pin/TerminalCircuit RoleDesign Meaning
FB_CS0 / FB_CS1FlexBus Chip SelectEnable external NOR/NAND flash or SRAM banks; supports configurable wait states and burst transfers for legacy memory expansion.
RMII0_TXD[1:0] / RMII0_RXD[1:0]Ethernet PHY Data InterfaceDirect 2-bit RMII connection to single PHY; eliminates need for MII-level routing complexity and reduces PCB layer count.
SDHC_CMD / SDHC_CLK / SDHC_DAT[3:0]eSDHC Bus SignalsSupport 4-bit SDIO mode at up to 50 MHz; enable hot-pluggable wireless modules with interrupt-driven command/response handling.
USBH_DP / USBH_DMUSB 2.0 Host Differential PairConnects directly to USB peripherals (e.g., cellular modems, HID devices); requires external 1.5 kΩ pull-up on DP per USB spec.
IVDD / EVDD / SDVDDIndependent Power DomainsSeparate 1.2 V core (IVDD), 3.3 V I/O (EVDD), and 2.5/1.8 V SDRAM (SDVDD) rails - allow dynamic voltage scaling and selective power gating.

Key Features

FeatureDesign Value
Crossbar Switch (XBS)Enables simultaneous DMA transfers to SRAM and Ethernet buffers without arbitration stalls - critical for jitter-sensitive VoIP packet buffering.
CAU Cryptographic AccelerationOffloads AES-128 encryption at >20 MB/s - frees CPU cycles for SIP signaling and media stream management in real-time applications.
Dual FEC with RMIIReduces PHY interface pin count by 50% vs. MII; supports IEEE 1588 PTP timestamping via dedicated registers for industrial time-synchronization.
Voice-band Audio CodecIntegrated 16-bit ADC/DAC with 8 kHz–48 kHz sampling - eliminates external codec IC and associated analog layout constraints in compact VoIP handsets.
16-channel eDMA ControllerHandles scatter-gather transfers across FlexBus, USB, and Ethernet without CPU intervention - improves throughput and lowers interrupt latency in multi-interface designs.

Applications

Voice over IP GatewayIndustrial Ethernet Router

Use Scenario: Residential or SMB VoIP gateway aggregating analog PSTN lines and SIP trunks.

IC Role / Device Role / Timing Role: Central processor executing Linux-based SIP stack, audio echo cancellation, and CAU-accelerated TLS handshake.

Use Value: Integrated codec and CAU eliminate 2–3 discrete ICs; 128 KB SRAM stores call state and crypto keys during power-loss events.

Use Scenario: DIN-rail mounted router connecting PLCs, HMIs, and SCADA systems over redundant Ethernet links.

IC Role / Device Role / Timing Role: Real-time network controller managing dual-FEC traffic, Modbus TCP bridging, and secure firmware updates via eSDHC.

Use Value: Crossbar switch enables concurrent packet forwarding and logging to SD card; Stop(3) mode draws only 0.65 mA for battery-backed configuration retention.

Secure Remote Terminal Unit (RTU)Multi-Protocol Field Gateway

Use Scenario: Oil & gas RTU performing encrypted telemetry transmission over cellular backhaul.

IC Role / Device Role / Timing Role: Trusted execution environment hosting FIPS-mode crypto, watchdog-managed failover, and RTC-synchronized event logging.

Use Value: CAU ensures AES-256 encryption meets NIST SP 800-131A requirements; VSTBY_RTC maintains accurate timestamps during brownouts.

Use Scenario: Smart building gateway translating BACnet MS/TP, KNX, and Zigbee to MQTT over Ethernet/Wi-Fi.

IC Role / Device Role / Timing Role: Protocol translation hub using USB host for Wi-Fi dongle, eSDHC for OTA update storage, and dual-FEC for LAN/WAN separation.

Use Value: Single-chip integration reduces BOM cost by $3.20 vs. MPU + separate crypto + audio + SD host solution; LQFP-208 simplifies rework in high-mix manufacturing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
i.MX287ARM9 @ 454 MHz, no integrated audio codec, lacks CAU but includes security boot ROM and NAND controller.Better suited for Linux-based HMI with rich graphics; requires external codec and crypto ICs for VoIP/audio use cases.Select i.MX287 when prioritizing ARM ecosystem tooling and NAND-based root filesystems over analog integration.
MPC8313EPowerQUICC II Pro @ 333 MHz, dual FEC, no audio codec or CAU, includes PCI interface and DDR2 controller.Targeted at higher-throughput industrial routers; lacks voice-band signal chain, requiring external codec and crypto acceleration.Choose MPC8313E for applications needing PCI expansion or DDR2 memory bandwidth exceeding SDR/DDR SDRAM limits of MCF53011CQT240.

Compared with i.MX287 and MPC8313E, the MCF53011CQT240 uniquely combines voice-band audio, CAU, and dual-FEC in a single LQFP-208 package - reducing system-level component count and PCB area for cost-sensitive, analog-rich edge nodes where ARM licensing or PCI expansion is unnecessary.

Availability

MCF53011CQT240 is available at Aetrix Electronics and suitable for VoIP gateways, industrial Ethernet routers, and secure remote terminal units requiring stable component supply, long-term lifecycle support, and qualified automotive-grade temperature range (–40°C to +85°C).

Supply support for MCF53011CQT240 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets.

The MCF53011CQT240 belongs to the ColdFire® v3 microprocessor family designed for cost-effective, low-power embedded networking and voice-enabled edge devices requiring integrated security, real-time responsiveness, and analog interface capability.

FAQ

What is the maximum operating frequency of the MCF53011CQT240?

The MCF53011CQT240 operates at a maximum core frequency of 240 MHz, with a corresponding peripheral bus clock of up to 80 MHz (core clock ÷ 3). This frequency is validated across the full industrial temperature range (–40°C to +85°C) and supports sustained Dhrystone 2.1 performance of 211 MIPS. The PLL configuration and power supply sequencing must follow Section 3.1 and 3.3 of the MCF5301x datasheet to maintain stability at this speed.

Does the MCF53011CQT240 support USB device and host modes simultaneously?

Yes, the MCF53011CQT240 integrates both a USB 2.0 On-The-Go (OTG) controller and a separate USB 2.0 host controller. The OTG controller supports device/peripheral mode with session request protocol (SRP) and host negotiation protocol (HNP), while the dedicated host controller provides full-speed host functionality for peripherals like cellular modems or HID devices. Both controllers operate independently and can be used concurrently in multi-role applications such as field gateways.

What memory interfaces does the MCF53011CQT240 support?

The MCF53011CQT240 supports a 16- or 32-bit SDR SDRAM interface and a 16-bit DDR/mobile-DDR SDRAM controller. It also includes a 32-bit FlexBus external interface with programmable wait states, chip selects, and burst capabilities for connecting NOR/NAND flash, SRAM, or FPGA logic. Internal memory consists of 128 KB SRAM with standby power support and 16 KB unified instruction/data cache - eliminating need for external cache SRAM in most real-time applications.

How does the cryptography acceleration unit (CAU) in the MCF53011CQT240 improve security performance?

The CAU in the MCF53011CQT240 accelerates DES, 3DES, AES (128/192/256-bit), MD5, and SHA-1 algorithms in hardware, achieving AES-128 throughput exceeding 20 MB/s. This offloads computationally intensive operations from the ColdFire v3 core, reducing CPU utilization by up to 70% during TLS handshake or IPsec packet processing. The CAU operates independently via DMA and supports key wrapping for secure key storage - enabling FIPS 140-2 Level 1–compliant implementations in the MCF53011CQT240.

What is the function of the crossbar switch (XBS) in the MCF53011CQT240 architecture?

The crossbar switch (XBS) in the MCF53011CQT240 enables concurrent, non-blocking access to internal SRAM and peripherals by multiple bus masters - including the ColdFire core, eDMA controller, USB OTG, and dual FEC modules. Unlike traditional shared buses, XBS eliminates arbitration delays and priority conflicts, allowing simultaneous Ethernet packet reception, audio buffer DMA, and crypto engine access without pipeline stalls. This is essential for deterministic real-time behavior in VoIP and industrial control applications.

MCF53011CQT240 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
208-LQFP
Series:
MCF5301x
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
61
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.08V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF53011CQT240 FAQ

1.How can I place an order for MCF53011CQT240 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF53011CQT240 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF53011CQT240 reliable?

The price and inventory of MCF53011CQT240 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF53011CQT240 is usually 5 days.

3.What payment methods are accepted for MCF53011CQT240?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF53011CQT240 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF53011CQT240?

MCF53011CQT240 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF53011CQT240 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF53011CQT240?

For technical support, including MCF53011CQT240 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF53011CQT240 requirements.

6.How does Aetrix verify that MCF53011CQT240 is sourced from the original manufacturer or authorized distributors?

All MCF53011CQT240 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF53011CQT240 meets industry standards.

7.What is the process for return or replacement of MCF53011CQT240?

All MCF53011CQT240 units undergo pre-shipment inspection (PSI). If there is an issue with MCF53011CQT240, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF53011CQT240 part is unused and in its original packaging.

Return procedure for MCF53011CQT240:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCF53011CQT240 Tags

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