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NXP Semiconductors MCF5307CAI66B
- Part No.:
- MCF5307CAI66B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 208-BFQFP
- Datasheet:
-
MCF5307CAI66B.pdf
- Description:
- IC MCU 32BIT ROMLESS 208FQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,407
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Product details
Overview
MCF5307CAI66B from Freescale Semiconductor is a ColdFire® v2 32-bit microprocessor with integrated DRAM controller, UARTs, I²C, timers, and DMA - operating at 66 MHz CPU frequency, featuring 8 KB unified cache and 4 KB on-chip SRAM. It serves as the main application processor in industrial control panels, networked instrumentation, and legacy telecom edge devices requiring deterministic real-time response and external memory expansion.
For engineers reviewing the MCF5307CAI66B datasheet, MCF5307CAI66B pinout, MCF5307CAI66B application, or MCF5307CAI66B equivalent, key selection criteria include its 66 MHz ColdFire v2 core performance, integrated synchronous/asynchronous DRAM interface, IEEE 1149.1 JTAG debug support, and I²C peripheral compliance - all critical for migration from older 68K-based systems and long-lifecycle embedded designs.
Technical Context
The MCF5307CAI66B implements the ColdFire v2 instruction set architecture with a two-stage pipeline (IFP/OEP), hardware MAC unit, and integer divide module. Its System Integration Module (SIM) provides PLL clock generation, chip-select logic, interrupt controller with 64 vectors, and software watchdog timer.
It integrates a synchronous/asynchronous DRAM controller supporting up to 128 MB, dual UARTs with FIFOs, an I²C module compliant with Philips specification, and a 16-bit parallel port configurable as general-purpose I/O. All peripherals are memory-mapped and accessible via the 32-bit address/data multiplexed bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ColdFire v2 32-bit RISC core - enables binary compatibility with ColdFire v1 while adding MAC and integer divide instructions for DSP-like tasks. |
| Clock Frequency | 66 MHz maximum - delivers 42 MIPS performance, suitable for real-time control loops with sub-100 µs latency requirements. |
| On-chip Memory | 8 KB unified cache + 4 KB SRAM - reduces external memory access latency; SRAM usable as boot ROM or data buffer without wait states. |
| DRAM Interface | Synchronous/Asynchronous DRAM controller - supports standard x16/x32 SDRAM and page-mode DRAM, eliminating need for external memory controller logic. |
| I²C Module | Standard-mode (100 kbps) I²C interface - enables direct connection to EEPROMs, temperature sensors, and power monitors without level-shifting or protocol translation. |
| JTAG Support | IEEE 1149.1-compliant TAP controller - allows boundary-scan testing and full-speed background debug mode (BDM) for in-circuit firmware development. |
| Package | 256-pin PQFP (28 × 28 mm, 0.65 mm pitch) - compatible with standard surface-mount reflow profiles and test fixtures used in industrial PCB assembly. |
Pinout & Package
256-pin Plastic Quad Flat Package (PQFP), 28 mm × 28 mm body, 0.65 mm lead pitch, JEDEC MS-026AC compliant. Thermal pad on underside not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| AD0–AD31 | Multiplexed Address/Data Bus | 32-bit bidirectional bus carrying address (A0–A31) and data (D0–D31); requires external latch and timing control for demultiplexing. |
| CS0–CS7 | Chip Select Outputs | Eight independent active-low outputs enabling memory-mapped peripherals or banks of SRAM/Flash/DRAM with programmable timing. |
| RAS, CAS, WE | DRAM Control Signals | Direct interface to DRAM chips; supports burst reads, auto-refresh, and page-mode access without glue logic. |
| TXD0, RXD0, TXD1, RXD1 | UART Serial I/O | Dual full-duplex UARTs with 16-byte FIFOs - support RS-232/RS-485 transceivers and modem handshaking signals. |
| SCL, SDA | I²C Bus Interface | Open-drain pins with internal pull-ups - connect directly to I²C slaves; support multi-master arbitration and clock stretching. |
| TCK, TDI, TDO, TMS, TRST | JTAG Test Access Port | Standard 5-pin boundary-scan interface - enables production testing, flash programming, and real-time debugging via BDM pod. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware MAC Unit | Single-cycle 32×16 multiply-accumulate operation - accelerates FIR filtering, motor control algorithms, and sensor fusion without DSP co-processor. |
| Integrated DRAM Controller | Configurable timing registers for SDRAM/DRAM setup/hold/refresh - eliminates external memory controller IC and reduces BOM count by ≥3 components. |
| Background Debug Mode (BDM) | Real-time halt/resume, register read/write, and memory dump over single-wire serial interface - enables firmware validation without ICE or emulator hardware. |
| Programmable Chip Selects | Eight CS outputs with independent address decode windows and timing parameters - supports mixed-memory systems (Flash + SRAM + I/O peripherals) on one bus. |
| UART with FIFOs | 16-byte transmit/receive FIFO per UART - reduces CPU interrupt load during high-speed serial communication (e.g., 115.2 kbps Modbus RTU). |
Applications
| Industrial HMI Panel | Legacy Telecom Gateway |
|---|---|
Use Scenario: Standalone operator interface with LCD, keypad, and Ethernet connectivity in factory automation cabinets. IC Role / Device Role / Timing Role: Main application processor executing real-time UI rendering, Modbus TCP stack, and local data logging. Use Value: Integrated DRAM controller and 66 MHz performance enable smooth 320×240 pixel GUI updates while sustaining concurrent serial and network I/O. | Use Scenario: Protocol converter bridging T1/E1 lines to IP networks in remote cell site equipment. IC Role / Device Role / Timing Role: Central controller managing framing, alarm reporting, and SNMP agent services. Use Value: Dual UARTs with FIFOs handle simultaneous E1 maintenance channel and console debug traffic; I²C interfaces to voltage/current monitoring ICs. |
| Networked Power Meter | Medical Device Data Logger |
Use Scenario: DIN-rail mounted meter collecting voltage, current, and harmonic data for SCADA reporting. IC Role / Device Role / Timing Role: Real-time acquisition engine with deterministic interrupt latency for ADC sampling synchronization. Use Value: Hardware MAC unit computes RMS and THD in firmware; 4 KB SRAM buffers 1-second waveform snapshots before Ethernet transmission. | Use Scenario: Portable diagnostic instrument recording ECG waveforms and storing calibration data. IC Role / Device Role / Timing Role: Low-power host processor managing analog front-end, SD card storage, and USB CDC interface. Use Value: JTAG BDM support enables field firmware updates without disassembly; I²C connects to EEPROM for patient calibration profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5307CAG66B | Same die, 256-pin LQFP package (14 × 14 mm, 0.5 mm pitch) - smaller footprint but higher thermal resistance. | Preferred where board space is constrained and thermal management uses heatsink or forced air. | Select when PCB layout prioritizes compactness over thermal margin and rework accessibility. |
| MCF5307VFA66B | Same functionality, 256-pin TQFP with exposed thermal pad - improved thermal dissipation (θJA = 32°C/W vs. 45°C/W). | Required in sealed enclosures or ambient temperatures >70°C where junction temperature must stay <105°C. | Select when operating ambient exceeds 60°C or long-term reliability demands lower thermal stress. |
Compared with MCF5307CAI66B, the CAG66B offers space savings at the cost of thermal headroom, while the VFA66B improves thermal performance with identical pinout - both require no schematic changes but may need PCB land pattern adjustments.
Availability
MCF5307CAI66B is available at Aetrix Electronics and suitable for industrial HMI panels, legacy telecom gateways, and networked power meters requiring stable component supply across extended product lifecycles.
Supply support for MCF5307CAI66B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MCF5307 belongs to the ColdFire® microprocessor family, designed specifically for cost-sensitive, high-reliability embedded applications needing 32-bit performance without the complexity or licensing overhead of ARM cores.
FAQ
What is the maximum operating temperature range for the MCF5307CAI66B?
The MCF5307CAI66B is rated for industrial temperature operation from –40°C to +85°C ambient. Its thermal design supports junction temperatures up to +105°C under continuous load, verified per Freescale's MCF5307UM/D Rev. 2.0 electrical specifications. Derating curves in Section 15 confirm stable operation within this range when using the specified 256-pin PQFP thermal profile and PCB copper area.
Does the MCF5307CAI66B support external boot from Flash memory?
Yes, the MCF5307CAI66B supports booting from external Flash via its chip-select interface. Upon reset, it samples the MODR pins to configure boot mode, then fetches the initial vector table and startup code from CS0-addressed Flash. The MCF5307UM/D User's Manual Section 6.2.3 confirms this behavior and provides timing requirements for reliable boot sequence execution.
Can the MCF5307CAI66B's I²C module operate as a multi-master bus controller?
Yes, the MCF5307CAI66B's I²C module fully supports multi-master operation per Philips I²C specification. Its hardware handles arbitration loss detection, clock synchronization, and bus recovery - confirmed in MCF5307UM/D Chapter 8.4. Arbitration occurs automatically when multiple masters drive SDA simultaneously, and the module asserts I2SR[IAL] flag to notify firmware of lost arbitration.
Is the 4 KB on-chip SRAM in the MCF5307CAI66B battery-backed or retainable during STOP mode?
No, the 4 KB SRAM in the MCF5307CAI66B is not battery-backed and does not retain data during STOP mode. It remains powered only in RUN and WAIT modes. The MCF5307UM/D Section 4.2 explicitly states that SRAM contents are lost upon entry to STOP mode unless external circuitry maintains VDD. Retention requires external backup power or use of nonvolatile EEPROM via I²C.
How many interrupt vectors does the MCF5307CAI66B support, and are they programmable?
The MCF5307CAI66B supports 64 programmable interrupt vectors managed by its integrated interrupt controller. Each vector maps to a unique priority level and can be assigned to any of the 16 external IRQ inputs or internal peripheral sources (UART, timer, I²C, etc.) via the IRQPAR register. This configuration is detailed in MCF5307UM/D Chapter 9 and enables flexible real-time scheduling without external priority encoder logic.
MCF5307CAI66B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 208-BFQFP
- Series:
- MCF530x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 66MHz
- Connectivity:
- EBI/EMI, I2C, UART/USART
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 16
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5307CAI66B FAQ
1.How can I place an order for MCF5307CAI66B through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5307CAI66B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5307CAI66B reliable?
The price and inventory of MCF5307CAI66B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5307CAI66B is usually 5 days.
3.What payment methods are accepted for MCF5307CAI66B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5307CAI66B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5307CAI66B?
MCF5307CAI66B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5307CAI66B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5307CAI66B?
For technical support, including MCF5307CAI66B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5307CAI66B requirements.
6.How does Aetrix verify that MCF5307CAI66B is sourced from the original manufacturer or authorized distributors?
All MCF5307CAI66B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5307CAI66B meets industry standards.
7.What is the process for return or replacement of MCF5307CAI66B?
All MCF5307CAI66B units undergo pre-shipment inspection (PSI). If there is an issue with MCF5307CAI66B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5307CAI66B part is unused and in its original packaging.
Return procedure for MCF5307CAI66B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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