NXP Semiconductors MCF5327CVM240

Overview

MCF5327CVM240 from Freescale Semiconductor is a 240 MHz ColdFire V3 RISC microprocessor in 196-pin MAPBGA (15 mm × 15 mm), featuring 16 KB unified write-back cache, 32 KB dual-ported SRAM, SDR/DDR SDRAM controller, USB 2.0 Host and OTG, FEC, LCDC, and FlexCAN-designed for embedded industrial control and VoIP gateway applications.

For engineers reviewing the MCF5327CVM240 datasheet, MCF5327CVM240 pinout, MCF5327CVM240 application, or MCF5327CVM240 equivalent, key selection considerations include its 196-MAPBGA package, -40°C to +85°C industrial temperature grade, 240 MHz core clock with peripheral bus at ≤80 MHz, and integrated cryptography accelerators supporting secure boot and data path encryption.

Technical Context

The MCF5327CVM240 implements the ColdFire Version 3 variable-length RISC core with EMAC unit and operates at up to 240 MHz core clock, with peripheral and external bus clock derived as core clock ÷ 3 (≤80 MHz). It integrates dual interrupt controllers (INTC0/INTC1), 16-channel DMA, and two independent PLLs-one for system clock generation and one dedicated to USB timing.

Its memory subsystem includes 32 KB on-chip dual-ported SRAM accessible by CPU and bus masters (FEC, LCDC, USB, DMA), plus external interface via FlexBus and SDR/DDR SDRAM controller supporting programmable burst lengths, CAS latency, and auto-refresh. Power domains are segregated: IVDD (core), EVDD (I/O), SDVDD (memory), PLLVDD, and USBVDD-with strict sequencing requirements during power-up/down.

Key Specifications

Pinout & Package

196-ball MAPBGA package (15 mm × 15 mm, 0.8 mm pitch), thermally enhanced with exposed thermal pad per Freescale specification. Pinout conforms to Figure 5 in MCF532x Data Sheet Rev. 5.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5327CVM240, the MCF5328CVM240 adds Ethernet and ULPI but removes no features, while MCF5329CVM240 adds crypto/VoIP acceleration at the cost of larger footprint-neither is pin-compatible, requiring PCB redesign.

Availability

MCF5327CVM240 is available at Aetrix Electronics and suitable for industrial PLC controllers, VoIP gateways, network edge routers, and secure IIoT gateways requiring stable component supply across extended product lifecycles.

Supply support for MCF5327CVM240 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF532x ColdFire family was designed for high-performance, low-power embedded applications requiring real-time determinism, rich peripheral integration, and industrial temperature operation-targeting industrial control, communications, and human-machine interface systems.

FAQ

What is the maximum operating frequency of the MCF5327CVM240 core?

The MCF5327CVM240 operates at a maximum core clock frequency of 240 MHz, delivering up to 211 Dhrystone 2.1 MIPS performance. This frequency is achieved using an internal PLL that multiplies the external crystal input, and the peripheral bus runs at core clock ÷ 3 (≤80 MHz). The MCF5327CVM240 datasheet specifies this rating under industrial temperature conditions (-40°C to +85°C) with proper power supply regulation and thermal management.

Does the MCF5327CVM240 include an integrated Fast Ethernet Controller (FEC)?

No, the MCF5327CVM240 does not include a Fast Ethernet Controller. According to the MCF532x Family Configurations table in the official datasheet, FEC is only present in MCF5328, MCF53281, and MCF5329 variants. The MCF5327CVM240 pinout and feature list confirm absence of FEC signals (e.g., FEC_TXD0, FEC_RXCLK), making it unsuitable for native 10/100 Mbps Ethernet applications without external MAC/PHY.

What package type and dimensions does the MCF5327CVM240 use?

The MCF5327CVM240 uses a 196-ball MAPBGA package measuring 15 mm × 15 mm with 0.8 mm ball pitch, as confirmed in Table 2 (Ordering Information) and Figure 5 (Pinout Top View) of the MCF532x datasheet Rev. 5. This package is distinct from the 256-ball MAPBGA used by MCF5328/MCF5329 variants and requires specific PCB land patterns and reflow profiles defined in Freescale's packaging documentation.

Which USB modes does the MCF5327CVM240 support?

The MCF5327CVM240 supports both USB 2.0 Host and USB 2.0 On-The-Go (OTG) modes via dedicated differential pairs (USBHOST_M/P and USBOTG_M/P). It does not support ULPI or high-speed (480 Mbps) operation-only full-speed (12 Mbps). The USB PHY must be implemented externally, and the MCF5327CVM240 provides link-layer control, endpoint management, and OTG session request protocol (SRP) handling.

Is the MCF5327CVM240 pin-compatible with other MCF532x family members?

No, the MCF5327CVM240 is not pin-compatible with MCF5328CVM240, MCF53281CVM240, or MCF5329CVM240 due to its 196-ball MAPBGA package versus their 256-ball MAPBGA packages. Pin assignments differ significantly-e.g., MCF5327CVM240 lacks FEC, ULPI, and certain crypto-related signals present in larger variants. Migration requires full PCB redesign and layout revision.