NXP Semiconductors MCF5329CVM240

Overview

MCF5329CVM240 from Freescale Semiconductor is a 240 MHz ColdFire V3 RISC microprocessor in 256-pin MAPBGA (17 mm × 17 mm), featuring 16 KB unified write-back cache, 32 KB dual-ported SRAM, SDR/DDR SDRAM controller, USB 2.0 Host and OTG, Fast Ethernet Controller (FEC), FlexCAN 2.0B, and cryptography hardware accelerators - deployed in embedded VoIP gateways and industrial HMI systems.

For engineers reviewing the MCF5329CVM240 datasheet, MCF5329CVM240 pinout, MCF5329CVM240 application, or MCF5329CVM240 equivalent, key selection criteria include its 240 MHz core clock, dual-bus SRAM accessibility by DMA/FEC/LCDC/USB, 256-MAPBGA package with EVDD/SDVDD/IVDD/PLLVDD power domain separation, and support for DDR/SDR memory interfaces with programmable timing.

Technical Context

The MCF5329CVM240 implements a ColdFire Version 3 core with EMAC, operating at up to 240 MHz system clock and 80 MHz peripheral bus (core ÷ 3). Its integrated SDRAM controller supports both SDR and DDR modes via DRAMSEL pin control, with dedicated SD_CLK, SD_CKE, SD_CS0/1, SD_A[13:0], SD_D[31:0], and SD_DQS signals routed on the 256-MAPBGA package.

It integrates dual interrupt controllers (INTC0/INTC1), 16-channel DMA, four 32-bit DMA timers, and a FlexBus external interface with A[23:0], D[31:0], BE/BWE[3:0], R/W, TS, TA, and CS[5:0] - all multiplexed with GPIO or alternate functions such as QSPI, SSI, UARTs, and I²C, requiring explicit configuration via Chip Configuration Module (CCM) and Pin Assignment and Drive Interface (PADI).

Key Specifications

Pinout & Package

Package: 256-ball MAPBGA, 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal resistance θJMA = 37°C/W (natural convection, 4-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5328CVM240, MCF5329CVM240 adds hardware crypto acceleration without changing footprint or clock performance - enabling secure VoIP or medical firmware signing without layout changes. Compared with i.MX27, it offers lower power and deterministic real-time behavior but lacks multimedia engines and requires ColdFire toolchain investment.

Availability

MCF5329CVM240 is available at Aetrix Electronics and suitable for voice-over-IP gateways, industrial HMIs, and networked medical devices requiring stable component supply, long-term lifecycle support, and qualified industrial temperature grade (–40°C to +85°C).

Supply support for MCF5329CVM240 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5329CVM240 belongs to the ColdFire® MCF532x family, designed specifically for cost-sensitive, high-performance embedded applications requiring integrated networking, display, and security - targeting VoIP infrastructure and industrial control.

FAQ

What is the maximum operating frequency of the MCF5329CVM240 core?

The MCF5329CVM240 operates at a maximum core clock frequency of 240 MHz, delivering up to 211 Dhrystone 2.1 MIPS. This frequency is achieved using an internal Phase-Locked Loop (PLL) with external crystal reference (EXTAL/XTAL), and requires proper PLL power filtering per Figure 2 in the datasheet to maintain stability and low jitter.

Does the MCF5329CVM240 support DDR SDRAM, and how is mode selection handled?

Yes, the MCF5329CVM240 supports both SDR and DDR SDRAM through its integrated SDRAM controller. Mode selection is controlled by the DRAMSEL input pin: asserted (high) selects SDR mode, while negated (low) selects DDR mode. The controller automatically switches pin functionality (e.g., SD_A[13:0], SD_D[31:0]) based on this signal, and full AC timing specifications are provided for both modes in Section 5.7 of the MCF5329DS Rev. 5 datasheet.

What are the power supply requirements for the MCF5329CVM240?

The MCF5329CVM240 requires five independent supply domains: IVDD (1.8 V ±0.1 V, core), EVDD (3.3 V ±0.3 V, I/O), SDVDD (2.5 V or 3.3 V ±0.3 V, SDRAM), PLLVDD (1.8 V ±0.1 V, analog PLL), and USBVDD (3.3 V ±0.3 V, USB PHY). Power-up sequencing must ensure IVDD does not lead EVDD/SDVDD/PLLVDD by more than 0.4 V, and rise times must be slower than 500 µs to prevent ESD diode conduction.

How many UART interfaces does the MCF5329CVM240 provide, and are they fully independent?

The MCF5329CVM240 provides three UART modules (U0, U1, U2), with U0 and U1 having dedicated pins, while U2 is multiplexed onto QSPI, SSI, DMA timer, and I²C pins. All three support standard asynchronous framing, programmable baud rates, and hardware flow control (RTS/CTS). U2's shared pin assignment requires careful muxing configuration via the Chip Configuration Module (CCM) and may limit concurrent use with QSPI or SSI.

Is the MCF5329CVM240 pin-compatible with other members of the MCF532x family?

Yes, the MCF5329CVM240 is pin-compatible with MCF5328CVM240 and MCF53281CVM240 in the 256-MAPBGA package (Figure 4), sharing identical pinout, power domains, and peripheral signal mapping. However, feature differentiation exists: only MCF5329CVM240 includes RNGA, SKHA, and MDHA cryptography accelerators; MCF53281CVM240 adds embedded VoIP support; and MCF5328CVM240 omits both.