NXP Semiconductors MCF5329CVM240J

Overview

MCF5329CVM240J from NXP Semiconductors (formerly Freescale) is a 240 MHz ColdFire V3 RISC microprocessor with integrated SDR/DDR SDRAM controller, Fast Ethernet Controller (FEC), USB 2.0 Host and OTG, LCDC, FlexCAN 2.0B, and cryptography accelerators. It features 16-Kbyte unified write-back cache, 32-Kbyte dual-ported SRAM, and operates across –40°C to +85°C in a 256-ball MAPBGA package (17 mm × 17 mm). It targets embedded networking and multimedia terminals requiring real-time I/O, secure communications, and display control.

For engineers reviewing the MCF5329CVM240J datasheet, MCF5329CVM240J pinout, MCF5329CVM240J application, or MCF5329CVM240J equivalent, this page delivers verified technical context, validated pin mapping for the 256 MAPBGA variant, key timing and power specifications, and two confirmed alternative microprocessors within the MCF532x family - all grounded in Rev. 5 (11/2008) official documentation.

Technical Context

The MCF5329CVM240J implements a ColdFire Version 3 core with EMAC, supporting up to 240 MHz system clock and 80 MHz peripheral bus (core clock ÷ 3), delivering up to 211 Dhrystone 2.1 MIPS. Its dual-bus architecture separates CPU access (via internal bus) from DMA/FEC/LCDC/USB access to the 32-Kbyte SRAM, enabling concurrent high-bandwidth operations without contention.

It integrates dedicated hardware blocks including a 10/100 Mbps FEC with MII interface, ULPI-capable USB 2.0 OTG and Host controllers, a 18-bit parallel LCD controller with programmable timing, and a Phase-Locked Loop (PLL) with independent analog supply (PLLVDD) requiring external RC filtering per Figure 2 of the datasheet.

Key Specifications

Pinout & Package

Package: 256-ball MAPBGA (17 mm × 17 mm), ball pitch 1.0 mm, RoHS-compliant. Pin assignments conform to Figure 4 in MCF5329DS Rev. 5, shared with MCF5328CVM240 and MCF53281CVM240.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF5329CVM240J, MCF5328CVM240 trades cryptographic acceleration for lower unit cost in non-secure applications, while MCF53281CVM240 retains crypto capability but removes FEC - making MCF5329CVM240J the only variant combining full networking (FEC), secure media (crypto), and display (LCDC) in one package.

Availability

MCF5329CVM240J is available at Aetrix Electronics and suitable for industrial HMI displays, VoIP gateways, and secure network appliances requiring stable component supply, long-lifecycle support, and guaranteed obsolescence management.

Supply support for MCF5329CVM240J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full support for the ColdFire portfolio, offering legacy documentation, reference designs, and cross-portfolio migration paths.

The MCF532x product line was designed for cost-sensitive, high-integration embedded applications demanding real-time performance, rich peripheral sets (Ethernet, USB, LCD), and hardware-accelerated security - particularly in VoIP, industrial control, and network edge devices.

FAQ

What is the operating temperature range for the MCF5329CVM240J?

The MCF5329CVM240J is rated for industrial operation from –40°C to +85°C ambient temperature. This range is specified in Table 2 of the MCF5329DS Rev. 5 datasheet and applies to all functional operation including cache, SRAM, FEC, and USB modules. Thermal derating is not required within this envelope when PCB layout follows recommended copper pour and thermal via guidelines in Section 5.2.

Does the MCF5329CVM240J support DDR SDRAM, and what are the key interface signals?

Yes, the MCF5329CVM240J includes a dedicated SDR/DDR SDRAM controller. Key interface signals include SD_A[13:0], SD_D[31:0], SD_CKE, SD_CS0/1, SD_CLK (differential), SD_RAS/SD_CAS, and SD_WE. These are assigned to specific balls in the 256 MAPBGA package (e.g., SD_CLK on R1/R2, SD_CKE on H2) and require strict PCB layout rules per Section 5.7 of the datasheet.

How is the PLL powered and filtered on the MCF5329CVM240J?

The MCF5329CVM240J uses a dedicated PLLVDD supply pin (J12 in 256 MAPBGA) requiring an external RC filter: 10 Ω resistor followed by parallel 10 µF and 0.1 µF capacitors, placed as close as possible to the pin. This is mandated in Section 3.1 and Figure 2 of the datasheet to suppress noise that would degrade PLL jitter and cause clock instability.

Which peripherals share pins with the FlexCAN module on the MCF5329CVM240J?

FlexCAN RX (CANRX) and TX (CANTX) are multiplexed onto existing pins: CANRX maps to SSI_RXD2 (G2), I2C_SDA2 (F2), or LCD_D16 (D9); CANTX maps to SSI_TXD2 (G1), I2C_SCL2 (F3), or LCD_D17 (C9). Configuration is done via the Chip Configuration Module (CCM) and requires disabling conflicting alternate functions before CAN initialization.

Is the MCF5329CVM240J pin-compatible with other MCF532x variants, and which ones?

Yes, the MCF5329CVM240J shares identical 256-ball MAPBGA pinout and footprint with MCF5328CVM240 and MCF53281CVM240, as confirmed in Figure 4 of MCF5329DS Rev. 5. All three support the same signal assignments, voltage domains, and reset states - enabling hardware reuse across designs differing only in crypto or FEC inclusion.