NXP Semiconductors MCF53721CVM240

Overview

MCF53721CVM240 from Freescale Semiconductor is a ColdFire V3 RISC microprocessor with 240 MHz core clock, integrated FlexCAN 2.0B module, 32-Kbyte dual-ported SRAM, SDR/DDR SDRAM controller, and USB 2.0 On-the-Go support - deployed in embedded VoIP gateways requiring real-time CAN messaging and Ethernet connectivity.

For engineers reviewing the MCF53721CVM240 datasheet, MCF53721CVM240 pinout, MCF53721CVM240 application, or MCF53721CVM240 equivalent, key selection criteria include FlexCAN availability, 196 MAPBGA package compatibility, 240 MHz performance at industrial temperature (–40°C to +85°C), and SDRAM interface timing compliance for memory subsystem design.

Technical Context

The MCF53721CVM240 implements a ColdFire Version 3 core with EMAC unit, supports up to 240 MHz system clock and 80 MHz peripheral bus clock (core ÷ 3), and integrates dual interrupt controllers (INTC0/INTC1) plus a 16-channel DMA controller for concurrent data movement across FEC, USB OTG, and SSI peripherals.

Its FlexCAN module-exclusive to the MCF53721 variant-is multiplexed on I2C_SDA2 (CANRX) and I2C_SCL2 (CANTX) pins, requires external transceiver, and operates in standard CAN 2.0B frame format with programmable bit timing and error handling logic.

Key Specifications

Pinout & Package

Package: 196-ball MAPBGA (15 mm × 15 mm), ball pitch 0.8 mm, JEDEC MO-255 compliant. Thermal pad exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF53721CVM240, MCF5373LCVM240 adds cryptographic acceleration but removes FlexCAN, while MCF5372LCVM240 reduces feature set to cut cost - making MCF53721CVM240 the sole option for industrial CAN + VoIP convergence.

Availability

MCF53721CVM240 is available at Aetrix Electronics and suitable for voice-over-IP gateways, industrial CAN nodes, and networked building control units requiring stable component supply across extended product lifecycles.

Supply support for MCF53721CVM240 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF537x ColdFire microprocessor family was designed for high-performance, low-power embedded applications demanding integrated connectivity (Ethernet, USB, CAN), real-time processing, and memory subsystem flexibility - particularly in VoIP, industrial control, and network edge devices.

FAQ

What is the maximum operating frequency of the MCF53721CVM240?

The MCF53721CVM240 operates at a maximum core clock frequency of 240 MHz, delivering up to 211 Dhrystone 2.1 MIPS. Its peripheral and external bus clock runs at core clock ÷ 3 (up to 80 MHz), and all timing specifications in the datasheet - including SDRAM, FEC, and USB - are validated at this speed grade. The MCF53721CVM240 achieves this performance within its specified industrial temperature range (–40°C to +85°C) and voltage tolerances (IVDD = 1.4–1.6 V, EVDD = 3.0–3.6 V).

Does the MCF53721CVM240 include a CAN controller?

Yes, the MCF53721CVM240 integrates a FlexCAN 2.0B communication module - a feature exclusive to the MCF53721 variant within the MCF537x family. It is multiplexed on I2C_SCL2 (CANTX) and I2C_SDA2 (CANRX) pins and supports standard CAN 2.0B frames, programmable bit timing, and error confinement. The MCF53721CVM240 requires an external CAN transceiver and proper termination; no additional CAN controller IC is needed.

What package type and dimensions does the MCF53721CVM240 use?

The MCF53721CVM240 uses a 196-ball MAPBGA package measuring 15 mm × 15 mm with 0.8 mm ball pitch, per JEDEC MO-255. Pin assignments match those shown in Figure 4 of the MCF5373DS Rev. 4 datasheet for MCF5373LCVM240, MCF5372LCVM240, and MCF53721CVM240. The package includes an exposed thermal pad on the underside for PCB-level heat dissipation and is qualified for reflow soldering per IPC/JEDEC J-STD-020.

How is USB implemented on the MCF53721CVM240?

The MCF53721CVM240 integrates a USB 2.0 On-the-Go (OTG) controller supporting host, device, and OTG roles. It provides dedicated USBOTG_P/USBOTG_M differential pair pins powered by USB_VDD (3.0–3.6 V), requiring external 0 Ω + 0.1 µF + 10 µF filtering per datasheet Figure 3. The MCF53721CVM240 does not include a USB host controller - that function is present only on MCF5373 variants. USB OTG enables field firmware updates and peripheral attachment without hardware mode switches.

What memory interfaces does the MCF53721CVM240 support?

The MCF53721CVM240 supports SDR and DDR SDRAM via its integrated SDRAM controller, with dedicated SD_A[13:0], SD_D[31:0], SD_CS0, SD_CKE, SD_CLK, and SD_DQS signals. It also features a 32-Kbyte dual-ported SRAM accessible by both CPU and DMA-capable peripherals (FEC, USB, SSI). External parallel memory is supported through the FlexBus interface (A[23:0], D[31:0], FB_CS[5:0]), enabling NOR flash, SRAM, or FPGA co-processor expansion.