NXP Semiconductors MCF5372LCVM240

Overview

MCF5372LCVM240 from Freescale Semiconductor is a ColdFire V3 RISC microprocessor with 240 MHz core clock, 32-Kbyte dual-ported SRAM, SDR/DDR SDRAM controller, Fast Ethernet Controller (FEC), and USB 2.0 On-the-Go support - deployed in industrial VoIP gateways requiring real-time packet processing and deterministic I/O.

For engineers reviewing the MCF5372LCVM240 datasheet, MCF5372LCVM240 pinout, MCF5372LCVM240 application, or MCF5372LCVM240 equivalent, key selection criteria include its 196 MAPBGA package, 240 MHz performance ceiling, dual-bus memory architecture, FEC+USB OTG coexistence, and FlexCAN exclusion versus MCF53721 variants.

Technical Context

The MCF5372LCVM240 integrates a ColdFire Version 3 core with EMAC unit, operating at up to 240 MHz with peripheral bus clock at up to 80 MHz (core ÷ 3). It features two interrupt controllers (INTC0/INTC1), a 16-Kbyte unified write-back cache, and a 32-Kbyte dual-ported SRAM accessible by CPU and DMA masters including FEC and USB OTG.

Its external interface includes FlexBus for parallel memory expansion, SDR/DDR SDRAM controller with dedicated SD_A[13:0], SD_D[31:0], SD_CKE, SD_CS0, and SD_CLK signals, plus full USB 2.0 Host and OTG PHY support on dedicated USBVDD-supplied pins (USBOTG_P/M, USBHOST_P/M).

Key Specifications

Pinout & Package

196-ball MAPBGA package (15 mm × 15 mm, 0.8 mm pitch) with four power domains: IVDD (core), EVDD (I/O), SDVDD (memory/FlexBus), and USBVDD (USB PHY). Ball assignments follow Figure 4 in MCF5373DS Rev. 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF53721CVM240 and MCF5373LCVM240, the MCF5372LCVM240 provides the leanest feature set at identical clock speed and package - making it ideal for applications needing FEC, USB OTG, and SDRAM without FlexCAN or crypto acceleration overhead.

Availability

MCF5372LCVM240 is available at Aetrix Electronics and suitable for industrial VoIP gateways, Ethernet protocol bridges, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MCF5372LCVM240 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MCF5372LCVM240 belongs to the ColdFire MCF537x family - designed specifically for cost-optimized, high-performance embedded networking and voice-processing applications requiring integrated Ethernet, USB, and memory controllers.

FAQ

What is the maximum operating frequency of the MCF5372LCVM240?

The MCF5372LCVM240 operates at a maximum core clock frequency of 240 MHz, with a corresponding peripheral and external bus clock of up to 80 MHz (core clock ÷ 3). This is confirmed in Table 1 ("MCF537x Family Configurations") of the MCF5373DS Rev. 4 datasheet, which explicitly lists "up to 240 MHz" under the MCF5372L column for Core (System) Clock. The MCF5372LCVM240 part number maps directly to this MCF5372L variant.

Does the MCF5372LCVM240 include FlexCAN functionality?

No, the MCF5372LCVM240 does not include FlexCAN. According to Table 1 in the MCF5373DS Rev. 4 datasheet, FlexCAN 2.0B is only present in the MCF53721 device variant. The MCF5372LCVM240 is based on the MCF5372L configuration, which omits FlexCAN - a distinction clearly indicated in the "FlexCAN 2.0B communication module" row showing "-" for MCF5372L and "•" only for MCF53721.

What package type and dimensions does the MCF5372LCVM240 use?

The MCF5372LCVM240 uses a 196-ball MAPBGA package measuring 15 mm × 15 mm with 0.8 mm ball pitch. This is specified in Table 2 ("Orderable Part Numbers") and verified in Section 4.2 ("Pinout-196 MAPBGA"), which explicitly states that the pinout applies to "MCF5373LCVM240, MCF5372LCVM240, and MCF53721CVM240" - all sharing the same 196 MAPBGA mechanical form factor.

Which USB modes are supported by the MCF5372LCVM240?

The MCF5372LCVM240 supports both USB 2.0 Host and USB 2.0 On-the-Go (OTG) modes, as confirmed in Table 2 ("Ordering Information") and the "Features" section of the MCF5373DS Rev. 4 datasheet. It includes dedicated USBOTG_P/M and USBHOST_P/M pins routed to separate USBVDD power domain, enabling simultaneous host/peripheral role switching without external transceivers.

What are the key power supply requirements for the MCF5372LCVM240?

The MCF5372LCVM240 requires four distinct supply domains: IVDD (1.4–1.6 V for core), EVDD (3.0–3.6 V for I/O), SDVDD (1.7–3.6 V for SDRAM/FlexBus), and USBVDD (3.0–3.6 V for USB PHY). Per Section 3.3 of the datasheet, IVDD must not lead EVDD/SDVDD by more than 0.4 V during power-up, and IVDD/PLLVDD must be powered down before EVDD/SDVDD to prevent ESD diode conduction.