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NXP Semiconductors MCF5372LCVM240J

Part No.:
MCF5372LCVM240J
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
196-LBGA
Datasheet:
AetrixMCF5372LCVM240J.pdf
Description:
IC MCU 32BIT ROMLESS 196MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,380

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Product details

Overview

MCF5372LCVM240J from NXP Semiconductors (formerly Freescale) is a ColdFire V3 RISC microprocessor with a 240 MHz core clock, 32-Kbyte dual-ported SRAM, SDR/DDR SDRAM controller, Fast Ethernet Controller (FEC), USB 2.0 Host and On-the-Go controllers, and integrated cryptography accelerators - deployed in industrial VoIP gateways requiring real-time packet processing, deterministic I/O, and secure communications.

For engineers reviewing the MCF5372LCVM240J datasheet, MCF5372LCVM240J pinout, MCF5372LCVM240J application, or MCF5372LCVM240J equivalent, key selection criteria include its 196-pin MAPBGA package, 240 MHz core frequency, dual-bus SRAM accessibility, FEC MII interface timing, and USB OTG PHY voltage domain isolation.

Technical Context

The MCF5372LCVM240J implements a ColdFire Version 3 core with EMAC unit and operates at up to 240 MHz core clock and 80 MHz peripheral bus clock (core ÷ 3). Its on-chip memory subsystem includes 16-Kbyte unified write-back cache and 32-Kbyte dual-ported SRAM accessible simultaneously by CPU and DMA-capable peripherals including FEC, USB host/OTG, and QSPI.

It integrates a full FlexBus external interface, SDR/DDR SDRAM controller with dynamic mode switching via DRAMSEL, two interrupt controllers (INTC0/INTC1), 16-channel DMA, and hardware cryptographic modules (RNGA, SKHA, MDHA) supporting AES, SHA, and RSA acceleration - all coordinated through a Chip Configuration Module (CCM) and Reset Controller.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureColdFire V3 RISC with EMAC; enables high-throughput DSP-like operations for VoIP codec execution and FEC packet filtering.
Core Clock Speed240 MHz; delivers up to 211 Dhrystone 2.1 MIPS for real-time embedded control and media processing.
On-Chip SRAM32-Kbyte dual-ported SRAM on internal CPU bus; allows concurrent access by CPU and DMA masters (e.g., FEC, USB) without arbitration stalls.
SDRAM InterfaceSDR/DDR SDRAM controller with automatic mode switching; supports JEDEC-compliant DDR1 and SDR SDRAM with programmable timing registers.
FEC InterfaceFast Ethernet Controller with MII physical layer interface; provides full-duplex 10/100 Mbps operation with integrated MAC and configurable RX/TX FIFOs.
USB SupportUSB 2.0 Host + USB 2.0 On-The-Go (OTG); enables host-peripheral role switching and VBUS sensing/control for embedded gateway USB peripheral connectivity.
Cryptography AccelerationHardware RNGA, SKHA, and MDHA modules; offloads AES-128/256, SHA-1/256, and RSA-1024/2048 operations from CPU, reducing latency in TLS/SSL and IPsec stacks.

Pinout & Package

The MCF5372LCVM240J is housed in a 196-ball MAPBGA package (15 mm × 15 mm, 0.8 mm pitch), with power domains segregated across EVDD (3.0–3.6 V I/O), IVDD (1.4–1.6 V core), SDVDD (1.7–3.6 V SDRAM/FlexBus), PLLVDD (1.4–1.6 V), and USBVDD (3.0–3.6 V).

Pin/TerminalCircuit RoleDesign Meaning
RESETActive-low reset inputAsynchronous system reset; asserted low during power-up sequencing until internal POR circuit releases it after stable IVDD/PLLVDD.
EXTAL / XTALCrystal oscillator input/outputDrives internal PLL; supports 25 MHz fundamental-mode crystal for 240 MHz core clock generation with ±50 ppm stability.
FEC_MDC / FEC_MDIOIEEE 802.3 MII management interfaceSerial bus for configuring external PHY registers; operates at ≤2.5 MHz with open-drain pull-up to EVDD.
USBOTG_P / USBOTG_MDifferential USB 2.0 OTG data pairFull-speed (12 Mbps) differential signaling; requires 27 Ω series termination and 1.5 kΩ pull-up on D+ for device enumeration.
SD_CLK / SD_CKESDRAM clock enable and clockSD_CLK is source-synchronous with SDRAM reads/writes; SD_CKE controls SDRAM power-down entry/exit per JEDEC standard.

Key Features

FeatureDesign Value
Unified write-back cache16-Kbyte cache with line locking and cache-inhibited access support - reduces instruction fetch latency and improves code execution efficiency in interrupt-driven VoIP stacks.
Dual-ported SRAM32-Kbyte SRAM accessible by both CPU and non-CPU bus masters (FEC, USB, DMA) - eliminates memory contention bottlenecks in real-time packet forwarding paths.
FlexCAN moduleNot present in MCF5372LCVM240J (only in MCF53721 variant); this part omits CAN interface to prioritize Ethernet/USB bandwidth and reduce pin count.
PWM moduleFour PWM channels (PWM1/PWM3/PWM5/PWM7) with independent period/duty-cycle registers - supports motor control, LED dimming, and analog signal generation in industrial HMI applications.
Real-time debug supportJTAG TAP with BDM interface and on-chip debug logic - enables non-intrusive breakpoint setting, register inspection, and trace capture without halting real-time FEC or USB traffic.

Applications

Industrial VoIP GatewaySecure Network Appliance

Use Scenario: Embedded gateway bridging PSTN and SIP-based VoIP networks with echo cancellation, codec transcoding, and firewall/NAT traversal.

IC Role / Device Role / Timing Role: Primary application processor executing Linux-based VoIP stack (e.g., Asterisk), managing FEC for WAN/LAN traffic, and coordinating USB OTG for firmware updates via flash drive.

Use Value: Dual-ported SRAM enables simultaneous audio buffer DMA (from USB/SSI) and packet buffer access (to FEC), eliminating interlock delays in real-time voice path.

Use Scenario: Firewall or VPN concentrator appliance performing TLS decryption, IPsec tunneling, and stateful packet inspection at line rate.

IC Role / Device Role / Timing Role: Cryptographic accelerator host running OpenSSL with hardware offload; FEC handles encrypted packet ingress/egress while USB host manages certificate storage on external media.

Use Value: RNGA/SKHA/MDHA modules reduce AES-256 encryption latency by >90% vs. software-only implementation, enabling sustained 80+ Mbps throughput at 240 MHz core clock.

Industrial Ethernet I/O ControllerMulti-Protocol Field Gateway

Use Scenario: DIN-rail mounted controller aggregating Modbus RTU, CANopen, and EtherNet/IP sensor data into a unified OPC UA server.

IC Role / Device Role / Timing Role: Real-time protocol stack host with FEC for EtherNet/IP messaging, UARTs for serial fieldbus bridging, and QSPI for boot firmware storage.

Use Value: Four UARTs (U0/U1 + muxed U2) and QSPI_CS0–CS2 allow concurrent connection to three legacy fieldbuses without external level shifters or bus expanders.

Use Scenario: Smart grid edge node collecting AMI meter data over RF (via USB-connected dongle) and backhauling via Ethernet to SCADA systems.

IC Role / Device Role / Timing Role: USB host controller manages Zigbee/Z-Wave dongle; FEC transmits encrypted telemetry; RTC and PIT timers coordinate scheduled wake-up and low-power polling cycles.

Use Value: Integrated RTC with battery-backed calendar and four 32-bit DMA timers enable precise time-synchronized data sampling and transmission windows - critical for DLMS/COSEM compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCF5373LCVM240Same 196 MAPBGA package and 240 MHz speed, but adds cryptography accelerators (RNGA/SKHA/MDHA) and USB OTG support not present in base MCF5372L.Required where hardware-accelerated TLS/SSL or IPsec is mandatory; unsuitable if crypto features are unused and BOM cost must be minimized.Select MCF5373LCVM240 only when cryptographic acceleration is required - MCF5372LCVM240J lacks RNGA/SKHA/MDHA blocks per datasheet Table 1.
i.MX27ARM926EJ-S core at 400 MHz, integrated LCD controller and camera interface; no ColdFire ISA compatibility or FEC MII timing matching.Targeted at multimedia-rich HMI gateways; lacks native FEC MII and SDRAM controller register compatibility with MCF5372LCVM240J designs.Choose i.MX27 only for new designs prioritizing ARM ecosystem tooling and multimedia peripherals - not for drop-in replacement or ColdFire software migration.

Compared with MCF5372LCVM240J, MCF5373LCVM240 adds verified cryptographic acceleration essential for secure protocols, while i.MX27 offers higher ARM performance but requires full hardware/software redesign due to incompatible peripheral mapping and timing models.

Availability

MCF5372LCVM240J is available at Aetrix Electronics and suitable for industrial VoIP gateways, secure network appliances, Ethernet I/O controllers, and multi-protocol field gateways requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MCF5372LCVM240J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and communication infrastructure markets.

The MCF537x family was designed as high-performance ColdFire microprocessors targeting real-time embedded networking applications - specifically VoIP, industrial Ethernet, and secure communications where deterministic latency, integrated peripherals, and cryptographic acceleration are critical.

FAQ

What is the maximum operating frequency of the MCF5372LCVM240J core?

The MCF5372LCVM240J core operates at up to 240 MHz, achieving 211 Dhrystone 2.1 MIPS performance. This frequency is enabled by the internal PLL driven from a 25 MHz crystal (25 MHz × 9.6 = 240 MHz), with strict power filtering requirements on PLLVDD per Section 3.1 of the datasheet. The 240 MHz rating applies only to the MCF5372L variant in 196 MAPBGA packaging - the base MCF5372 is limited to 180 MHz.

Does the MCF5372LCVM240J include hardware cryptography acceleration?

No, the MCF5372LCVM240J does not include RNGA, SKHA, or MDHA cryptographic modules. These accelerators are exclusive to the MCF5373 and MCF5373L variants per Table 1 of the datasheet. The MCF5372LCVM240J supports software-based crypto libraries only, making it suitable for applications where security requirements do not mandate hardware-accelerated AES or SHA operations.

What package type and pin count does the MCF5372LCVM240J use?

The MCF5372LCVM240J uses a 196-ball MAPBGA package (15 mm × 15 mm, 0.8 mm pitch) with ball map defined in Figure 4 of the datasheet. It is pin-compatible with MCF5373LCVM240 and MCF53721CVM240 in the same package, but functional differences exist - notably the absence of FlexCAN in MCF5372LCVM240J and missing crypto engines versus MCF5373L.

Which SDRAM standards are supported by the MCF5372LCVM240J controller?

The MCF5372LCVM240J SDRAM controller supports both SDR SDRAM (PC100/PC133) and DDR SDRAM (DDR1, 200/266 MT/s) with automatic mode switching controlled by the DRAMSEL pin. Timing parameters are fully programmable per JEDEC specifications, and AC characteristics for both modes are detailed in Sections 5.7.1 and 5.7.2 of the datasheet.

How many UART interfaces does the MCF5372LCVM240J provide, and are they all independently usable?

The MCF5372LCVM240J provides three UARTs (U0, U1, and U2), with U0 and U1 having dedicated pins and U2 multiplexed onto QSPI/DMA timer pins. All three are independently configurable and usable, though U2 requires GPIO remapping and careful conflict avoidance with QSPI or timer functions - confirmed by signal muxing table entries for U2TXD/U2RXD in Table 3.

MCF5372LCVM240J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
196-LBGA
Series:
MCF537x
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
Coldfire V3
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.4V ~ 3.6V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF5372LCVM240J FAQ

1.How can I place an order for MCF5372LCVM240J through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF5372LCVM240J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF5372LCVM240J reliable?

The price and inventory of MCF5372LCVM240J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5372LCVM240J is usually 5 days.

3.What payment methods are accepted for MCF5372LCVM240J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5372LCVM240J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF5372LCVM240J?

MCF5372LCVM240J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF5372LCVM240J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF5372LCVM240J?

For technical support, including MCF5372LCVM240J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5372LCVM240J requirements.

6.How does Aetrix verify that MCF5372LCVM240J is sourced from the original manufacturer or authorized distributors?

All MCF5372LCVM240J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5372LCVM240J meets industry standards.

7.What is the process for return or replacement of MCF5372LCVM240J?

All MCF5372LCVM240J units undergo pre-shipment inspection (PSI). If there is an issue with MCF5372LCVM240J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF5372LCVM240J part is unused and in its original packaging.

Return procedure for MCF5372LCVM240J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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