NXP Semiconductors MCF5373LCVM240
- Part No.:
- MCF5373LCVM240
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LBGA
- Datasheet:
-
MCF5373LCVM240.pdf
- Description:
- IC MCU 32BIT ROMLESS 196MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCF5373LCVM240 from Freescale Semiconductor is a ColdFire V3 RISC microprocessor with 240 MHz core clock, 32-Kbyte dual-ported SRAM, SDR/DDR SDRAM controller, USB 2.0 Host and OTG controllers, Fast Ethernet Controller (FEC), and cryptography hardware accelerators - deployed in embedded VoIP gateways requiring real-time packet processing, secure media transport, and multi-interface connectivity.
For engineers reviewing the MCF5373LCVM240 datasheet, MCF5373LCVM240 pinout, MCF5373LCVM240 application, or MCF5373LCVM240 equivalent, key selection criteria include MAPBGA-196 package compatibility, 240 MHz core performance, EVDD/SDVDD/IVDD voltage domain separation, FlexCAN absence (vs. MCF53721), and USB OTG + FEC coexistence in single-chip VoIP system solutions.
Technical Context
The MCF5373LCVM240 implements a ColdFire Version 3 core with EMAC unit, operating at up to 240 MHz core clock and 80 MHz peripheral bus clock (core ÷ 3). It integrates dual interrupt controllers (INTC0/INTC1), a 16-channel DMA controller, and a Phase-Locked Loop (PLL) with dedicated PLLVDD/PLLVSS power domains requiring external RC filtering per Figure 2 of the datasheet.
Its memory subsystem includes 16-Kbyte unified write-back cache and 32-Kbyte dual-ported SRAM accessible by CPU and bus masters (DMA, FEC, USB). The SDR/DDR SDRAM controller supports dynamic mode switching via DRAMSEL pin, while USB OTG and Host PHYs share dedicated USBVDD/USBVSS rails with mandatory external decoupling per Figure 3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V3 RISC with EMAC unit - enables deterministic DSP-like operations for VoIP codec acceleration |
| Core Clock Speed | 240 MHz - delivers 211 Dhrystone 2.1 MIPS for real-time media stack execution |
| On-Chip SRAM | 32-Kbyte dual-ported - allows concurrent CPU and DMA/FEC/USB access without arbitration stalls |
| SDRAM Interface | SDR/DDR controller with DRAMSEL pin - enables runtime selection between SDR and DDR modes |
| USB Support | USB 2.0 Host + OTG controllers - provides host-peripheral flexibility in gateway endpoint management |
| FEC Interface | Fast Ethernet Controller with MII - supports 10/100 Mbps LAN connectivity with full-duplex operation |
| Package | 196-pin MAPBGA, 15 mm × 15 mm - requires 0.8 mm pitch PCB layout and thermal pad under die |
| Supply Voltages | IVDD = 1.4–1.6 V, EVDD = 3.0–3.6 V, SDVDD = 1.7–3.6 V - mandates independent LDO regulation and sequencing |
Pinout & Package
Package: 196-ball MAPBGA (15 mm × 15 mm, 0.8 mm pitch), thermally enhanced with exposed die paddle. Ball map follows JEDEC MO-255 standard with dedicated power/ground arrays for IVDD, EVDD, SDVDD, PLLVDD, USBVDD, and VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_CS[5:0] | FlexBus Chip Selects | Enable six external memory/peripheral devices on parallel bus; FB_CS0–FB_CS5 mapped to balls C7, D7, A8, B8, C8, D8 |
| SD_A[13:0], SD_D[31:0] | SDRAM Address/Data Bus | Direct interface to SDR/DDR SDRAM; address lines multiplexed with FlexBus A[23:11]; data lines shared with D[31:16]/D[15:1] |
| FEC_MDC/FEC_MDIO | IEEE 802.3 MII Management | Serial interface to PHY registers; requires 2.5 V tolerant I/O on EVDD domain (balls B1/A1) |
| USBOTG_P/USBOTG_M | USB OTG Differential Pair | Full-speed USB 2.0 differential signals routed to balls H13/H14; require 90 Ω controlled impedance and USBVDD decoupling |
| RESET2/RSTOUT | Reset Input/Output | Asynchronous reset assertion (ball K13); open-drain RSTOUT output (ball L12) drives external reset tree |
| EXTAL/XTAL | Oscillator Inputs | Crystal oscillator drive pins (balls L14/K14); support 25–50 MHz fundamental-mode crystals for core PLL reference |
Key Features
| Feature | Design Value |
|---|---|
| Embedded VoIP System Solution | Integrated FEC, USB OTG, SSI, and cryptography accelerators enable single-chip VoIP gateway implementation without external co-processors |
| Dual-Ported SRAM | 32-Kbyte memory accessible simultaneously by CPU and DMA/FEC/USB - eliminates bus contention in real-time packet buffering |
| Hardware Cryptography Accelerators | Dedicated RNGA, SKHA, MDHA modules offload AES, SHA, and RSA operations - reduce CPU load during TLS/SRTP processing |
| Flexible Clock Architecture | PLL with programmable dividers and multiple clock domains (IVDD, EVDD, SDVDD, USBVDD) - supports independent power gating per subsystem |
| JTAG + BDM Debug Support | IEEE 1149.1 TAP (balls G10, K11, L13, K12, L11) plus background debug mode - enables non-intrusive firmware validation in production systems |
| Power Sequencing Compliance | Defined power-up/down order (IVDD must not lead/lag EVDD/SDVDD by >0.4 V) - prevents ESD diode conduction and latch-up risk |
Applications
| Voice-over-IP Gateway | Industrial Ethernet Controller |
|---|---|
Use Scenario: Residential or SMB VoIP gateway aggregating analog phone lines, SIP trunking, and Wi-Fi/USB client interfaces. IC Role / Device Role / Timing Role: Central media processor executing SIP stack, G.711/G.729 codecs, FEC-based LAN bridging, and USB-hosted storage for call logs. Use Value: 240 MHz ColdFire V3 core + dual-ported SRAM enables concurrent voice packet processing, encryption, and Ethernet forwarding without external buffers. | Use Scenario: Programmable logic controller (PLC) with integrated 100BASE-TX Ethernet for factory floor I/O monitoring and remote HMI access. IC Role / Device Role / Timing Role: Real-time controller managing Modbus TCP over FEC, local PWM-driven actuator control, and secure firmware updates via USB OTG. Use Value: FEC MII interface + 4× 32-bit DMA timers + FlexBus allow deterministic I/O scanning cycles synchronized to Ethernet frame boundaries. |
| Secure Remote Access Terminal | Multi-Protocol Communication Hub |
Use Scenario: Field-deployable terminal connecting legacy RS-232/RS-485 devices to cloud infrastructure via encrypted TLS tunnels. IC Role / Device Role / Timing Role: Secure edge node performing UART-to-TCP bridging, certificate-based authentication, and AES-encrypted payload encapsulation. Use Value: Hardware RNGA + SKHA + MDHA modules accelerate TLS handshake and SRTP media encryption, reducing latency below 15 ms per session. | Use Scenario: Building automation hub interfacing BACnet MS/TP, KNX, and Zigbee modules via UART/I²C/QSPI while routing traffic over Ethernet. IC Role / Device Role / Timing Role: Protocol translation engine using three UARTs, I²C, QSPI, and FEC to unify disparate fieldbus networks into IP backbone. Use Value: 3× UARTs + I²C + QSPI + FEC + USB OTG provide native physical layer support for five major industrial protocols without bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5373CAB180 | 160-pin QFP package, 180 MHz core clock, same peripheral set except no USB OTG | Preferred for cost-sensitive designs where USB device-only mode suffices and QFP rework is acceptable | Select when board space permits larger QFP footprint and lower clock speed meets throughput requirements |
| MCF5372LCVM240 | Same 196 MAPBGA package and 240 MHz speed, but lacks cryptography accelerators and USB OTG controller | Suitable for non-secure VoIP endpoints or Ethernet-only gateways without encrypted media transport | Choose when cryptographic offload is unnecessary and BOM cost reduction outweighs security feature loss |
Compared with MCF5373CAB180 and MCF5372LCVM240, the MCF5373LCVM240 uniquely combines 240 MHz performance, USB OTG, and hardware crypto acceleration in the compact 196 MAPBGA form factor - making it optimal for secure, space-constrained VoIP and industrial edge nodes.
Availability
MCF5373LCVM240 is available at Aetrix Electronics and suitable for voice-over-IP gateways, industrial Ethernet controllers, and secure remote access terminals requiring stable component supply across extended product lifecycles.
Supply support for MCF5373LCVM240 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MCF5373LCVM240 belongs to the ColdFire MCF537x family, designed specifically for high-performance, low-power embedded communications applications including VoIP, industrial control, and secure network edge devices.
FAQ
What is the maximum operating frequency of the MCF5373LCVM240 core?
The MCF5373LCVM240 features a ColdFire V3 core rated for up to 240 MHz operation, delivering 211 Dhrystone 2.1 MIPS performance. This frequency is achieved using an internal PLL driven by an external crystal (25–50 MHz) applied to the EXTAL/XTAL pins, with IVDD regulated to 1.4–1.6 V. The MCF5373LCVM240 datasheet specifies this speed grade exclusively for the 196 MAPBGA package variant.
Does the MCF5373LCVM240 support DDR SDRAM memory?
Yes, the MCF5373LCVM240 includes an integrated SDR/DDR SDRAM controller capable of driving both SDR and DDR memory types. Mode selection is controlled by the DRAMSEL pin: asserted for SDR mode, negated for DDR mode. The controller supports standard DDR timing parameters and interfaces directly to SD_A[13:0], SD_D[31:0], SD_CKE, SD_CS0, and SD_CLK pins on the 196 MAPBGA package.
Is FlexCAN available on the MCF5373LCVM240?
No, FlexCAN 2.0B is not implemented in the MCF5373LCVM240. According to Table 1 of the MCF537x Family Configurations datasheet, FlexCAN is only present on the MCF53721 derivative. The MCF5373LCVM240 retains all other peripherals - including FEC, USB Host/OTG, SSI, I²C, QSPI, and three UARTs - but omits CAN functionality entirely.
What power supply sequencing is required for reliable startup of the MCF5373LCVM240?
The MCF5373LCVM240 requires strict supply sequencing: IVDD must not lead EVDD or SDVDD by more than 0.4 V during power-up, nor lag them by more than 0.4 V during power-down. Violation risks high current through internal ESD protection diodes. Recommended sequence is simultaneous ramp of EVDD/SDVDD followed by IVDD/PLLVDD within 0.4 V tolerance, with rise/fall times slower than 500 µs.
How many UART interfaces does the MCF5373LCVM240 provide, and what are their pin assignments?
The MCF5373LCVM240 provides three UART interfaces. UART0 uses pins U0RXD/U0TXD/U0RTS/U0CTS (balls P14/N14/M13/M14); UART1 uses U1RXD/U1TXD/U1RTS/U1CTS (balls B7/A7/D6/C6); UART2 signals are multiplexed onto QSPI and timer pins (e.g., QSPI_DIN/QSPI_DOUT for RX/TX). All UARTs operate at EVDD voltage domain and support programmable baud rates up to 3 Mbps.
MCF5373LCVM240 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LBGA
- Series:
- MCF537x
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5373LCVM240 FAQ
1.How can I place an order for MCF5373LCVM240 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5373LCVM240 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5373LCVM240 reliable?
The price and inventory of MCF5373LCVM240 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5373LCVM240 is usually 5 days.
3.What payment methods are accepted for MCF5373LCVM240?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5373LCVM240 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5373LCVM240?
MCF5373LCVM240 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5373LCVM240 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5373LCVM240?
For technical support, including MCF5373LCVM240 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5373LCVM240 requirements.
6.How does Aetrix verify that MCF5373LCVM240 is sourced from the original manufacturer or authorized distributors?
All MCF5373LCVM240 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5373LCVM240 meets industry standards.
7.What is the process for return or replacement of MCF5373LCVM240?
All MCF5373LCVM240 units undergo pre-shipment inspection (PSI). If there is an issue with MCF5373LCVM240, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5373LCVM240 part is unused and in its original packaging.
Return procedure for MCF5373LCVM240:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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