NXP Semiconductors MCF5373LCVM240J
- Part No.:
- MCF5373LCVM240J
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 196-LBGA
- Datasheet:
-
MCF5373LCVM240J.pdf
- Description:
- IC MCU 32BIT ROMLESS 196MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,128
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Product details
Overview
MCF5373LCVM240J from NXP Semiconductors (formerly Freescale) is a ColdFire V3-based 32-bit microprocessor with integrated SDR/DDR SDRAM controller, USB 2.0 Host and OTG controllers, Fast Ethernet Controller (FEC), cryptography accelerators, and FlexCAN module. It operates at 240 MHz core clock, features 32-Kbyte dual-ported SRAM, 16-Kbyte unified write-back cache, and is packaged in a 196-pin MAPBGA (15 mm × 15 mm) for embedded VoIP, industrial networking, and secure gateway applications.
For engineers reviewing the MCF5373LCVM240J datasheet, MCF5373LCVM240J pinout, MCF5373LCVM240J application, or MCF5373LCVM240J equivalent, key selection considerations include its 240 MHz ColdFire V3 core, dual-bus SDRAM interface support (SDR/DDR), FEC with MII interface, USB OTG capability, and cryptographic hardware acceleration - all within a thermally optimized 196 MAPBGA package rated for –40°C to +85°C operation.
Technical Context
The MCF5373LCVM240J implements a ColdFire Version 3 RISC core with EMAC unit, supporting up to 240 MHz system clock and 80 MHz peripheral bus (core ÷ 3). Its memory subsystem integrates 32-Kbyte dual-ported SRAM accessible by CPU and DMA/FEC/USB masters, plus a 16-Kbyte unified write-back cache.
It features two independent interrupt controllers (INTC0/INTC1), a programmable PLL for clock generation, and a FlexBus external interface with configurable chip selects and timing. The SDRAM controller supports both SDR and DDR modes via DRAMSEL pin control, with dedicated SD_CLK, SD_CKE, SD_CS0, SD_A[13:0], SD_D[31:0], and SD_DQM signals routed to specific MAPBGA pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire V3 RISC with EMAC; enables high-efficiency signal processing and real-time control in VoIP and network stacks. |
| Max Core Clock | 240 MHz; delivers up to 211 Dhrystone 2.1 MIPS for demanding embedded applications. |
| On-chip SRAM | 32-Kbyte dual-ported SRAM on internal CPU bus; allows concurrent access by CPU and peripherals (e.g., FEC, USB, DMA) without contention. |
| Cache | 16-Kbyte unified write-back cache; reduces external memory accesses and improves instruction/data throughput. |
| SDRAM Interface | SDR/DDR SDRAM controller with dynamic mode switching; supports industry-standard memory modules with configurable timing. |
| USB Support | USB 2.0 Host and On-The-Go (OTG) controllers; enables host-peripheral dual-role connectivity for field-upgradable devices. |
| FEC Interface | Fast Ethernet Controller with MII interface; provides full-duplex 10/100 Mbps Ethernet connectivity with integrated MAC and PHY signaling support. |
| Cryptography | Hardware accelerators for RNG, SHA, MD5, DES, 3DES, and AES; offloads encryption/decryption from CPU for secure communications. |
Pinout & Package
Package: 196-ball MAPBGA (15 mm × 15 mm, 0.8 mm pitch), RoHS-compliant, designed for thermal performance in industrial environments with θJMA = 42°C/W (natural convection, 4-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A14, B1–B14, etc. (196 balls) | Ball-grid array terminals | Includes dedicated EVDD/IVDD/SDVDD/USBVDD power domains, ground (VSS/PLL_VSS/USB_VSS), and function-multiplexed I/O (e.g., A[23:0], D[31:0], FB_CS[5:0], SD_A[13:0], SD_D[31:0]). |
| FB_CS0–FB_CS5 | FlexBus chip select outputs | Enable up to six external memory or peripheral devices on the parallel FlexBus interface with programmable timing. |
| SD_CLK, SD_CKE, SD_CS0 | SDRAM clock, clock enable, chip select | Drive synchronous SDRAM operations; SD_CLK is output-only, phase-aligned to internal PLL-derived clock. |
| FEC_MDC, FEC_MDIO | Management Data Clock/Input-Output | Implement IEEE 802.3 MII management interface for PHY configuration and status monitoring. |
| USBOTG_P / USBOTG_M | USB OTG differential data pair | Support full-speed USB 2.0 OTG operation including session request protocol (SRP) and host negotiation protocol (HNP). |
| QSPI_DOUT / QSPI_CLK | Quad SPI data output and clock | Enable high-speed serial flash interfacing with up to four data lines and programmable clock polarity/phase. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded VoIP solution | Integrated SSI, UARTs, PWM, and real-time timers enable end-to-end voice packetization, echo cancellation, and jitter buffering without external DSP. |
| Dual-domain power management | Separate IVDD (1.4–1.6 V core), EVDD (3.0–3.6 V I/O), SDVDD (1.7–3.6 V memory), and USBVDD (3.0–3.6 V) rails allow optimized voltage scaling per subsystem. |
| Hardware crypto acceleration | RNGA, SKHA, and MDHA modules accelerate SHA-1/256, MD5, DES/3DES, and AES-128/192/256 - reducing latency and CPU load in TLS/IPsec implementations. |
| Flexible interrupt architecture | Two independent INTCs with 64 total vectors and priority encoding support deterministic real-time response for FEC, USB, and timer events. |
| Configurable FlexBus interface | Programmable wait states, burst modes, and address/data multiplexing enable seamless connection to NOR/NAND flash, SRAM, FPGAs, and legacy peripherals. |
| Debug & test support | JTAG (IEEE 1149.1) with boundary scan, BDM interface, and debug AC timing compliance ensure robust board-level testability and firmware development. |
Applications
| Voice-over-IP Gateway | Industrial Ethernet Router |
|---|---|
Use Scenario: Residential or SMB VoIP gateway aggregating analog phone lines and SIP trunking over broadband. IC Role / Device Role / Timing Role: Central processor executing VoIP stack (SIP, RTP, G.711/G.729), managing SSI-connected codecs, and handling USB-hosted configuration storage. Use Value: Integrated SSI, three UARTs, and hardware crypto enable secure, low-latency voice transport with <10 ms jitter and TLS 1.2 handshake in <50 ms. | Use Scenario: DIN-rail mounted router connecting PLCs, HMIs, and sensors via 10/100 Mbps Ethernet in factory automation. IC Role / Device Role / Timing Role: Network processor running real-time Linux, driving FEC for dual-port MII, and managing QSPI-booted firmware with secure OTA updates. Use Value: FEC with MII timing compliance (tskew ≤ 1 ns), 240 MHz deterministic scheduling, and AES acceleration ensure sub-100 µs packet forwarding and encrypted firmware validation. |
| Secure IoT Edge Gateway | Medical Data Aggregator |
Use Scenario: Field-deployable gateway collecting sensor data from BLE/Zigbee nodes and forwarding to cloud via TLS-secured Ethernet or USB cellular modem. IC Role / Device Role / Timing Role: Application processor executing lightweight MQTT/CoAP, performing AES-256 encryption on payload, and managing USB OTG for modem attachment. Use Value: Hardware AES engine achieves 45 MB/s encryption throughput; USB OTG supports CDC ACM class modems without driver porting effort. | Use Scenario: Portable diagnostic device aggregating ECG, SpO₂, and temperature data from multiple wired/wireless sources for HIPAA-compliant transmission. IC Role / Device Role / Timing Role: Real-time data concentrator using dual-ported SRAM for zero-copy buffer sharing between FEC, UARTs, and crypto engines. Use Value: 32-Kbyte dual-ported SRAM eliminates inter-processor handshaking; cryptographic accelerators meet FDA-required FIPS 140-2 Level 1 for data-at-rest and in-transit protection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF5373CAB180 | 160-pin QFP package; 180 MHz core clock; same peripheral set but lower frequency and larger footprint. | Suitable for prototyping or space-tolerant designs where thermal constraints permit QFP; lacks MAPBGA's thermal efficiency. | Select when board reworkability or legacy QFP tooling is required; verify PCB layout for 28 mm × 28 mm area and higher thermal resistance (θJMA = 49°C/W). |
| i.MX283 | ARM926EJ-S core; 454 MHz; integrated LCD controller, NAND flash controller, and security boot ROM - no ColdFire ISA compatibility. | Better suited for Linux-based HMI or multimedia edge devices; lacks native ColdFire toolchain and VoIP-optimized SSI. | Choose for new ARM-based designs requiring higher compute density and rich peripheral integration; not a drop-in replacement due to architecture and pinout mismatch. |
Compared with MCF5373CAB180, the MCF5373LCVM240J offers 33% higher core performance and superior thermal dissipation in a smaller 15 mm × 15 mm footprint; versus i.MX283, it provides deterministic ColdFire V3 real-time behavior and VoIP-specific peripherals but lacks ARM ecosystem tooling and multimedia acceleration.
Availability
MCF5373LCVM240J is available at Aetrix Electronics and suitable for voice-over-IP gateways, industrial Ethernet routers, and secure IoT edge gateways requiring stable component supply across extended product lifecycles.
Supply support for MCF5373LCVM240J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller and processor innovation.
The MCF5373LCVM240J belongs to the ColdFire V3 microprocessor family, engineered specifically for embedded voice, networking, and secure communications applications requiring real-time determinism, integrated peripherals, and hardware-accelerated cryptography.
FAQ
What is the maximum operating junction temperature for the MCF5373LCVM240J?
The MCF5373LCVM240J has a maximum operating junction temperature of 105°C, validated under natural convection conditions on a four-layer PCB. Thermal design must maintain TJ ≤ 105°C using the specified θJMA = 42°C/W and appropriate board copper area, especially during sustained 240 MHz operation with FEC and USB active. Derating curves are provided in Section 5.2 of the MCF5373DS Rev. 4 datasheet.
Does the MCF5373LCVM240J support DDR SDRAM, and how is mode selection handled?
Yes, the MCF5373LCVM240J supports both SDR and DDR SDRAM through its integrated SDRAM controller. Mode selection is controlled by the DRAMSEL pin: asserted (high) enables SDR mode, while negated (low) enables DDR mode. This hardware-selectable configuration avoids software overhead and ensures reliable initialization - critical for boot-time memory setup in the MCF5373LCVM240J reference design.
What USB capabilities does the MCF5373LCVM240J provide, and are external transceivers required?
The MCF5373LCVM240J integrates full-speed USB 2.0 Host and On-The-Go (OTG) controllers with on-die PHY drivers. No external transceiver is needed for basic USB operation; however, external USBVDD filtering (per Figure 3 in MCF5373DS Rev. 4) and ESD protection are mandatory. The MCF5373LCVM240J supports OTG session request protocol (SRP) and host negotiation protocol (HNP) for role swapping between host/peripheral modes.
How many UARTs are available on the MCF5373LCVM240J, and what are their primary use cases?
The MCF5373LCVM240J provides three UARTs (U0, U1, U2), with U0 and U1 having dedicated pins and U2 multiplexed onto QSPI/DMA timer pins. These support console debugging, modem interfacing, and peripheral communication in VoIP gateways and industrial routers. U1 supports SSI multiplexing for codec control, and all UARTs feature FIFOs and programmable baud rates - essential for robust MCF5373LCVM240J system integration.
What cryptographic algorithms are accelerated by hardware in the MCF5373LCVM240J?
The MCF5373LCVM240J includes three dedicated hardware accelerators: RNGA (random number generation), SKHA (secure key hash accelerator for SHA-1/SHA-256 and MD5), and MDHA (modular math accelerator for DES, 3DES, and AES-128/192/256). These offload computationally intensive operations from the ColdFire V3 core, enabling TLS 1.2 handshake completion in under 50 ms and sustained AES encryption at 45 MB/s - key performance attributes of the MCF5373LCVM240J in secure gateway applications.
MCF5373LCVM240J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 196-LBGA
- Series:
- MCF537x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF5373LCVM240J FAQ
1.How can I place an order for MCF5373LCVM240J through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF5373LCVM240J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF5373LCVM240J reliable?
The price and inventory of MCF5373LCVM240J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF5373LCVM240J is usually 5 days.
3.What payment methods are accepted for MCF5373LCVM240J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF5373LCVM240J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF5373LCVM240J?
MCF5373LCVM240J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF5373LCVM240J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF5373LCVM240J?
For technical support, including MCF5373LCVM240J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF5373LCVM240J requirements.
6.How does Aetrix verify that MCF5373LCVM240J is sourced from the original manufacturer or authorized distributors?
All MCF5373LCVM240J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF5373LCVM240J meets industry standards.
7.What is the process for return or replacement of MCF5373LCVM240J?
All MCF5373LCVM240J units undergo pre-shipment inspection (PSI). If there is an issue with MCF5373LCVM240J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF5373LCVM240J part is unused and in its original packaging.
Return procedure for MCF5373LCVM240J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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