NXP Semiconductors MCF54452CVP200

Overview

MCF54452CVP200 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 200 MHz core clock, featuring 16-KB instruction cache, 16-KB data cache, 32-KB on-chip SRAM, dual 10/100 Ethernet MACs, and a 32-bit PCI controller - deployed in industrial networking gateways requiring deterministic real-time processing and multi-protocol connectivity.

For engineers reviewing the MCF54452CVP200 datasheet, MCF54452CVP200 pinout, MCF54452CVP200 application, or MCF54452CVP200 equivalent, key selection criteria include DDR SDRAM controller timing compliance, TEPBGA-360 thermal/power layout constraints, USB 2.0 OTG ULPI interface readiness, and ColdFire V4 ISA software compatibility with legacy MCF5xxx firmware stacks.

Technical Context

The MCF54452CVP200 implements a superscalar ColdFire V4 core with hardware MMU for full virtual memory support and integrated EMAC for high-throughput signal processing. Its crossbar switch (XBS) enables concurrent access to peripherals and SRAM by multiple bus masters including CPU, DMA, and PCI.

It integrates a 16-channel DMA controller, 4 PIT timers, 4 32-bit DMA-capable general-purpose timers, and dual FEC modules supporting MII/RMII modes - all synchronized to a configurable PLL-derived clock tree with independent peripheral bus (100 MHz) and external bus (50 MHz) domains.

Key Specifications

Pinout & Package

Package: 360-ball TEPBGA (23 mm × 23 mm), 1.0-mm ball pitch, RoHS-compliant, thermally enhanced with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF54452CVP200, the MCF54455VP266 adds ATA/CAU and raises clock speed but sacrifices industrial temperature rating, while MCF54452VP266 offers identical functionality at 266 MHz in commercial grade - making MCF54452CVP200 the optimal choice for ruggedized 200-MHz embedded control.

Availability

MCF54452CVP200 is available at Aetrix Electronics and suitable for industrial gateways, medical imaging subsystems, secure network appliances, and automotive diagnostic tools requiring stable component supply across extended product lifecycles.

Supply support for MCF54452CVP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in MCU, RF, and analog technologies.

The MCF5445x ColdFire® microprocessor family targets high-performance embedded control applications demanding real-time determinism, multi-protocol connectivity, and hardware-accelerated security - especially in industrial automation and network infrastructure.

FAQ

What is the maximum supported DDR SDRAM speed for the MCF54452CVP200?

The MCF54452CVP200 integrates a 16-bit DDR SDRAM controller rated for 133 MHz operation, supporting DDR, mobile-DDR, and DDR2 memory types. This delivers up to 266 MB/s peak bandwidth. The controller complies with JEDEC standards and requires precise trace length matching and termination per the MCF5445x Hardware Design Considerations guide. MCF54452CVP200 does not support DDR3 or LPDDR.

Does the MCF54452CVP200 include a cryptography acceleration unit (CAU)?

No, the MCF54452CVP200 does not include a Cryptography Acceleration Unit. According to Table 1 (MCF5445x Family Configurations), CAU is present only in MCF54451, MCF54453, and MCF54455 variants. MCF54452CVP200 retains all other features - dual FECs, PCI, USB OTG, and crossbar switch - but omits CAU and ATA controller to target cost-optimized industrial control applications.

What package type and ball count does the MCF54452CVP200 use?

The MCF54452CVP200 uses a 360-ball TEPBGA (Thermally Enhanced Plastic Ball Grid Array) package measuring 23 mm × 23 mm with 1.0-mm ball pitch. This matches the pinout shown in Figure 6 of the MCF5445x datasheet Rev. 9. It is distinct from the 256 MAPBGA used by MCF54450/MCF54451 and shares mechanical compatibility with MCF54453CVP200, MCF54454CVP200, and MCF54455CVP200.

Can the MCF54452CVP200 boot directly from SPI flash memory?

Yes, the MCF54452CVP200 supports booting directly from SPI-compatible flash devices, as confirmed in the Features section of the MCF5445x datasheet. Boot mode is selected via BOOTMOD[1:0] pins, and the serial boot facility (SBF) handles initialization sequence, clock configuration, and vector table loading without external boot ROM. This capability is identical across all MCF5445x variants including MCF54452CVP200.

What is the operating temperature range specified for the MCF54452CVP200?

The MCF54452CVP200 is specified for industrial temperature operation from –40°C to +85°C, as explicitly listed in Table 2 (Ordering Information) of the MCF5445x datasheet. This distinguishes it from the VP-suffixed variants (e.g., MCF54452VP266), which are rated for 0°C to +70°C. The 'C' prefix in MCF54452CVP200 denotes industrial temperature grade.