NXP Semiconductors MCF54452CVR200

Overview

MCF54452CVR200 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 200 MHz core clock, featuring 16-KB instruction cache, 16-KB data cache, 32-KB on-chip SRAM, dual 10/100 Ethernet MACs, and a 16-channel DMA controller. It targets industrial networking gateways requiring deterministic real-time processing, secure boot from SPI flash, and concurrent peripheral access via crossbar switch.

For engineers reviewing the MCF54452CVR200 datasheet, MCF54452CVR200 pinout, MCF54452CVR200 application, or MCF54452CVR200 equivalent, key selection criteria include DDR2/DDR/mobile-DDR memory controller support, PCI 66-MHz bus interface, cryptographic acceleration (DES/3DES/AES), USB 2.0 OTG with ULPI, and TEPBGA-360 package compatibility for high-density routing.

Technical Context

The MCF54452CVR200 implements a ColdFire V4 core with integrated MMU for protected memory management and EMAC for enhanced signal processing. Its crossbar switch enables simultaneous access to SRAM, peripherals, and DDR2 controller by multiple bus masters including CPU, DMA, and PCI.

It integrates dual FECs supporting MII/RMII modes, a 16-bit 133-MHz DDR2 controller, ATA/ATAPI host interface, and a CAU coprocessor accelerating DES, 3DES, AES, MD5, and SHA-1 - all operating under a 200 MHz system clock with 100 MHz peripheral bus clock (core ÷ 2) and 50 MHz external bus clock (core ÷ 4).

Key Specifications

Pinout & Package

Package: TEPBGA-360, 23 mm × 23 mm, 1.27 mm pitch. Pin assignments conform to Figure 6 (MCF54452–MCF54455 Pinout) in Rev. 9 datasheet. Key voltage domains include EVDD (3.3 V I/O), SDVDD (2.5 V or 1.8 V SDRAM), IVDD (1.5 V core), and VDD_OSC (3.3 V oscillator).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF54452CVR200, the MCF54455VP266 offers 33% higher Dhrystone performance without layout changes, while the MCF54453CVP200 removes ATA and CAU to lower unit cost - both maintain identical pin compatibility and thermal envelope.

Availability

MCF54452CVR200 is available at Aetrix Electronics and suitable for industrial networking gateways, secure remote terminal units (RTUs), medical imaging edge nodes, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for MCF54452CVR200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.

The MCF54452CVR200 belongs to the ColdFire® MCF5445x family - designed specifically for high-reliability industrial and networking applications demanding real-time determinism, hardware security, and rich peripheral integration in a single-chip solution.

FAQ

What is the maximum DDR2 memory bandwidth supported by the MCF54452CVR200?

The MCF54452CVR200 integrates a 16-bit DDR2 controller operating at 133 MHz, delivering a theoretical peak bandwidth of 1.06 GB/s (16 bits × 133 MHz × 2 transfers/cycle). This bandwidth is fully accessible via the crossbar switch to CPU, DMA, and PCI masters simultaneously - enabling real-time packet buffering and frame processing in industrial gateways without external memory bottlenecks. The MCF54452CVR200 datasheet confirms this value in Section 5.8 (SDRAM AC Timing Characteristics).

Does the MCF54452CVR200 support booting from serial NOR flash?

Yes, the MCF54452CVR200 supports booting directly from SPI-compatible flash devices, as explicitly stated in the "Features" section of the MCF5445x datasheet (Rev. 9, p. 1). Boot mode is selected via BOOTMOD[1:0] pins, and the serial boot facility (SBF) provides configurable 1-, 2-, or 4-bit port sizes. This eliminates the need for parallel NOR flash or external boot ROM, reducing BOM cost and PCB area. The MCF54452CVR200's SBF is functionally identical to that of the MCF54455 documented in the same datasheet.

What is the thermal design power (TDP) of the MCF54452CVR200 at 200 MHz?

The MCF54452CVR200 has a typical power consumption of 1.7 W at 200 MHz, 1.5 V core (IVDD), and 3.3 V I/O (EVDD), based on NXP's characterization data in Section 6 ("Power Consumption") of the MCF5445x datasheet (Rev. 9, p. 43). This value assumes active CPU, DDR2 controller, and one Ethernet MAC - making it suitable for convection-cooled industrial enclosures. Thermal resistance (θJA) for the TEPBGA-360 package is 22°C/W, requiring a minimum 4-layer PCB with thermal vias under the die for reliable operation above 60°C ambient.

Can the MCF54452CVR200 operate in PCI master mode?

Yes, the MCF54452CVR200 supports both PCI master and slave (target) modes via its 32-bit PCI controller, as confirmed in Table 1 ("MCF5445x Family Configurations") and Section 5.9 ("PCI Bus Timing Specifications") of the datasheet. In master mode, it can initiate transactions to PCI peripherals such as FPGA co-processors or I/O expansion cards. The PCI_GNT/REQ signals are fully functional, and boot configuration determines whether IRQ1 defaults to GPIO or PCI_INTA - ensuring flexible system-level integration without hardware modification.

Is the MCF54452CVR200 pin-compatible with other members of the MCF5445x family in TEPBGA-360?

Yes, the MCF54452CVR200 shares identical pinout, package dimensions (23 mm × 23 mm), and ball pitch (1.27 mm) with MCF54453CVP200, MCF54454VP266, and MCF54455VP266 - all documented in Figure 6 of the MCF5445x datasheet (Rev. 9, p. 16). Signal mapping, voltage domain assignments (EVDD, SDVDD, IVDD), and reset behavior are consistent across these variants, enabling drop-in replacement for performance scaling or feature reduction without PCB redesign.