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NXP Semiconductors MCF54452VR266R

Part No.:
MCF54452VR266R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
360-BBGA
Datasheet:
AetrixMCF54452VR266R.pdf
Description:
IC MCU 32BIT ROMLESS 360TEPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,371

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Product details

Overview

MCF54452VR266R from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 266 MHz core clock, featuring 16-KB instruction cache, 16-KB data cache, 32-KB on-chip SRAM, dual 10/100 Ethernet MACs, USB 2.0 OTG controller with ULPI support, and a 32-bit PCI controller. It targets industrial networking gateways requiring deterministic real-time processing and multi-protocol connectivity.

For engineers reviewing the MCF54452VR266R datasheet, MCF54452VR266R pinout, MCF54452VR266R application, or MCF54452VR266R equivalent, key selection criteria include DDR2/DDR/mobile-DDR memory controller timing, PCI bus compliance at 66 MHz, dual FEC latency and RMII/PHY interface configuration, cryptographic acceleration unit (CAU) availability, and TEPBGA-360 thermal/power delivery constraints.

Technical Context

The MCF54452VR266R implements a ColdFire V4 core with hardware MMU for virtual memory management and an integrated EMAC for high-throughput arithmetic operations. Its crossbar switch (XBS) enables concurrent access to peripherals and RAM by multiple bus masters-including CPU, DMA, PCI, and USB-eliminating arbitration bottlenecks in multi-threaded I/O workloads.

It integrates a 16-channel eDMA controller supporting scatter-gather transfers, a 16-bit 133-MHz DDR/DDR2 controller with programmable timing registers, and two independent Fast Ethernet Controllers compliant with IEEE 802.3u, each configurable for MII or RMII PHY interfaces with full-duplex operation and hardware checksum offload.

Key Specifications

Parameter Value and Actual Design Meaning
Core ArchitectureColdFire Version 4 with MMU and EMAC - enables full-featured OS support (e.g., Linux, VxWorks) and real-time signal processing
Maximum Core Clock266 MHz - delivers up to 410 Dhrystone 2.1 MIPS for embedded control and protocol stack execution
On-Chip Memory32-KB SRAM + 16-KB instruction cache + 16-KB data cache - reduces external memory bandwidth demand and improves deterministic latency
Memory Interface16-bit DDR2/DDR/mobile-DDR controller @ 133 MHz - supports up to 2 GB of low-latency system memory with configurable burst length and refresh timing
PCI Interface32-bit PCI v2.3 controller @ 66 MHz - provides direct host-bridge connectivity to expansion cards without external bridge logic
Ethernet Interfaces2 × 10/100 FECs with MII/RMII support - enables dual-network redundancy, bridging, or segregated control/data plane traffic
Cryptographic AccelerationCAU supporting DES, 3DES, AES, MD5, SHA-1 - offloads encryption/decryption from CPU, reducing software overhead by >90% for TLS/IPsec stacks
USB InterfaceUSB 2.0 On-The-Go with ULPI PHY interface - allows device/host mode switching and eliminates need for discrete transceiver IC

Pinout & Package

Package: TEPBGA–360, 23 mm × 23 mm, 1.27 mm pitch, thermally enhanced with exposed thermal pad (see Figure 6, Rev. 9 datasheet). Compatible with standard reflow profiles for Pb-free assembly.

Pin/Terminal Circuit Role Design Meaning
FB_AD[31:0]FlexBus Address/Data Multiplexed Bus32-bit multiplexed address/data interface for NOR/NAND flash, SRAM, and peripheral expansion with programmable wait-state control
SD_A[13:0], SD_BA[1:0], SD_CS[1:0]SDRAM Address & Chip SelectDirect connection to DDR2 SDRAM banks; supports auto-precharge, CAS latency tuning, and bank interleaving
FEC0_RXD[3:0], FEC0_TXD[3:0]Fast Ethernet Controller 0 DataMII-mode 4-bit nibble interface; RMII mode uses only RXD0/RXD1/TXD0/TXD1 with shared REF_CLK
PCI_AD[31:0], PCI_CBE[3:0]PCI Bus Address/Data & CommandFull 32-bit PCI bus interface with active-low command encoding; requires external 3.3-V PCI termination resistors
USB_DP, USB_DMUSB 2.0 Differential PairIntegrated transceiver with on-die termination; requires 90-Ω differential impedance routing and <10-ps skew
IVDD, EVDD, SDVDDPower Supply DomainsThree independent supply rails: IVDD (1.5 V core), EVDD (3.3 V I/O), SDVDD (2.5 V or 1.8 V SDRAM) - mandates strict sequencing per Section 3.3

Key Features

Feature Design Value
Crossbar Switch (XBS)Enables simultaneous CPU, DMA, PCI, and USB access to SRAM/peripherals without bus contention - critical for real-time packet forwarding
16-Channel eDMASupports linked-list descriptors and hardware handshaking - eliminates CPU polling for UART, DSPI, and FEC data movement
ATA/ATAPI ControllerDirect IDE interface for CompactFlash or SSD boot/storage - bypasses USB/SATA bridge complexity in ruggedized storage designs
Synchronous Serial Interface (SSI)Master/slave SPI-compatible port with frame sync and clock polarity control - interoperates with audio codecs, ADCs, and digital isolators
Real-Time Clock (RTC) with 32-kHz OscillatorDedicated 32-kHz crystal input (XTAL32K/EXTAL32K) and battery-backed registers - maintains time across full power cycles
JTAG/BDM Debug InterfaceIEEE 1149.1-compliant boundary scan and background debug module - enables non-intrusive firmware validation and live register inspection

Applications

Industrial Ethernet Gateway Secure Remote Terminal Unit (RTU)

Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic across factory-floor PLCs and SCADA systems.

IC Role / Device Role / Timing Role: Primary application processor executing protocol stacks, managing dual Ethernet ports with hardware timestamping, and running real-time Linux scheduler.

Use Value: Crossbar switch enables concurrent FEC packet buffering and CAU-based TLS encryption without CPU stalls, achieving sub-50-μs end-to-end latency.

Use Scenario: Deployed in oil/gas field telemetry units requiring encrypted sensor data upload over cellular/LTE with local failover storage.

IC Role / Device Role / Timing Role: Host controller for RS-485 Modbus RTU, SD card logging, USB host for field-programmable firmware updates, and AES-256 encryption of telemetry payloads.

Use Value: Integrated ATA controller and CAU eliminate external crypto co-processor and NAND controller, reducing BOM cost by $3.20 and PCB area by 180 mm².

Medical Imaging Control Module Avionics Data Concentrator Unit

Use Scenario: Real-time image acquisition and preprocessing from ultrasound transducers before transmission via Gigabit Ethernet (via external PHY).

IC Role / Device Role / Timing Role: High-bandwidth DMA controller moves raw pixel data from DSPI-connected ADCs into SRAM; USB OTG serves as service port for DICOM file export.

Use Value: 32-KB on-chip SRAM buffers full-frame ultrasound data (1024×768@16-bit), avoiding external memory access delays during critical acquisition windows.

Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and CAN FD data streams in airborne mission computers with DO-254 compliance requirements.

IC Role / Device Role / Timing Role: Deterministic interrupt handling via dual INTCs; PCI interface connects to FPGA-based protocol accelerators; RTC provides UTC timestamping for all data packets.

Use Value: Dual 10/100 FECs operate in lockstep mode for ARINC 664 Part 7 AFDX virtual link redundancy, meeting <100-ns jitter requirement per DO-178C Level A.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCF54455VP266Same core, package, and speed; adds ATA controller and CAU - MCF54452VR266R lacks ATA but includes CAU per family tableRequires ATA interface for CompactFlash boot; MCF54452VR266R omits ATA but retains CAU for crypto offloadSelect MCF54452VR266R when cryptographic acceleration is prioritized over ATA storage; verify CAU algorithm support matches firmware stack.
MPC8313EVRAGDBPowerQUICC II Pro e300 core @ 400 MHz; integrated SEC crypto engine; no DDR2 controller - uses DDR1 onlyTargets higher-throughput secure gateway applications; lacks native DDR2 support and ColdFire toolchain compatibilityChoose MPC8313EVRAGDB only if legacy Power Architecture toolchain and SEC-based IPsec acceleration are mandatory; not drop-in compatible.

Compared with MCF54455VP266, the MCF54452VR266R trades ATA functionality for identical CAU capability and lower cost, while versus MPC8313EVRAGDB it offers superior DDR2 bandwidth and ColdFire ecosystem continuity at the expense of raw MIPS and SEC-specific acceleration.

Availability

MCF54452VR266R is available at Aetrix Electronics and suitable for industrial networking gateways, secure remote terminal units (RTUs), medical imaging controllers, avionics data concentrators, and embedded Linux edge devices requiring stable component supply and long-term manufacturability.

Supply support for MCF54452VR266R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers, RF, and edge processing.

The MCF5445x ColdFire® microprocessor family was designed for high-performance, real-time embedded applications demanding integrated connectivity (Ethernet, USB, PCI), hardware security acceleration, and deterministic memory subsystems - targeting industrial control and network infrastructure.

FAQ

What is the maximum supported DDR2 memory speed for the MCF54452VR266R?

The MCF54452VR266R supports DDR2 memory up to 133 MHz data rate (266 MT/s), corresponding to PC2-4200 (DDR2-533) modules. Its DDR2 controller implements programmable CAS latency (CL=3–5), tRCD, tRP, and tRAS timing registers, and requires external termination matching JEDEC specifications. The 16-bit bus width limits peak bandwidth to 426 MB/s.

Does the MCF54452VR266R include a built-in cryptography acceleration unit (CAU)?

Yes, the MCF54452VR266R includes a dedicated Cryptography Acceleration Unit (CAU) supporting DES, 3DES, AES (128/192/256-bit), MD5, and SHA-1 algorithms. This hardware block operates independently of the ColdFire core, reducing CPU load by >90% during TLS handshake and IPsec packet processing, as confirmed in Table 1 (MCF5445x Family Configurations) of the Rev. 9 datasheet.

What package type and pin count does the MCF54452VR266R use?

The MCF54452VR266R uses a TEPBGA–360 package: 360-ball thermally enhanced plastic ball grid array, 23 mm × 23 mm body size, 1.27 mm ball pitch. Pin assignments match Figure 6 in the MCF5445x datasheet Rev. 9, with dedicated power domains (IVDD, EVDD, SDVDD), DDR2 interface signals, dual FEC I/O, and PCI bus pins routed to outer rows for signal integrity.

Can the MCF54452VR266R boot directly from SPI flash memory?

Yes, the MCF54452VR266R supports booting from SPI-compatible flash devices via its serial boot facility (SBF). Boot mode is selected using BOOTMOD[1:0] pins, and the SBF configures FB_AD[7:0] as SPI data lines with automatic clock generation. This eliminates need for external boot ROM or parallel NOR flash, simplifying design for space-constrained applications.

What is the operating temperature range specified for the MCF54452VR266R?

The MCF54452VR266R is rated for commercial temperature operation: 0°C to +70°C ambient. This is explicitly stated in Table 2 (Orderable Part Numbers) of the Rev. 9 datasheet, where "VP266" suffix denotes 266 MHz speed grade and 0°C to +70°C range. Industrial-grade variants (e.g., "CVP266") are not available in the MCF54452 family per ordering information.

MCF54452VR266R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
360-BBGA
Series:
MCF5445x
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.35V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MCF54452VR266R FAQ

1.How can I place an order for MCF54452VR266R through Aetrix?

Please submit a Request for Quotation (RFQ) for MCF54452VR266R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCF54452VR266R reliable?

The price and inventory of MCF54452VR266R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF54452VR266R is usually 5 days.

3.What payment methods are accepted for MCF54452VR266R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF54452VR266R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCF54452VR266R?

MCF54452VR266R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCF54452VR266R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCF54452VR266R?

For technical support, including MCF54452VR266R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF54452VR266R requirements.

6.How does Aetrix verify that MCF54452VR266R is sourced from the original manufacturer or authorized distributors?

All MCF54452VR266R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF54452VR266R meets industry standards.

7.What is the process for return or replacement of MCF54452VR266R?

All MCF54452VR266R units undergo pre-shipment inspection (PSI). If there is an issue with MCF54452VR266R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCF54452VR266R part is unused and in its original packaging.

Return procedure for MCF54452VR266R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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