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NXP Semiconductors MCF54453CVP200
- Part No.:
- MCF54453CVP200
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 360-BBGA
- Datasheet:
-
MCF54453CVP200.pdf
- Description:
- IC MCU 32BIT ROMLESS 360BGA
- Quantity:
- Payment:
- Shipping:
Inventory:294
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Product details
Overview
MCF54453CVP200 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 200 MHz core clock, featuring 16-KB instruction cache, 16-KB data cache, 32-KB on-chip SRAM, dual 10/100 Ethernet MACs, and a 16-channel DMA controller. It targets industrial networking gateways requiring deterministic real-time processing, secure boot from SPI flash, and DDR SDRAM interfacing.
For engineers reviewing the MCF54453CVP200 datasheet, MCF54453CVP200 pinout, MCF54453CVP200 application, or MCF54453CVP200 equivalent, key selection criteria include its 360-pin TEPBGA package, -40°C to +85°C industrial temperature grade, PCI 66-MHz controller support, and cryptographic acceleration unit (CAU) for DES/3DES/AES/MD5/SHA-1.
Technical Context
The MCF54453CVP200 implements a ColdFire V4 core with hardware MMU enabling full virtual memory management and an integrated EMAC for high-efficiency multiply-accumulate operations in signal processing. Its crossbar switch (XBS) architecture enables concurrent access to peripherals and RAM by multiple bus masters, including CPU, DMA, and PCI.
It integrates a 16-bit DDR/mobile-DDR/DDR2 controller running at 133 MHz, USB 2.0 On-the-Go with ULPI interface, ATA/ATAPI controller, and two independent Fast Ethernet controllers compliant with IEEE 802.3. The CAU offloads cryptographic computation while the RNG provides entropy for secure key generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire® Version 4 with MMU and EMAC - enables full OS support (e.g., Linux) and real-time DSP workloads |
| Max Core Clock | 200 MHz - delivers up to 370 Dhrystone 2.1 MIPS for deterministic embedded control |
| On-Chip Memory | 32-KB SRAM + 16-KB instruction cache + 16-KB data cache - reduces external memory latency for time-critical ISR execution |
| DDR Controller | 16-bit, 133-MHz DDR/mobile-DDR/DDR2 - supports up to 266 MB/s bandwidth for video buffering or packet forwarding |
| Ethernet Interfaces | 2 × 10/100 Fast Ethernet MACs - enables dual-port routing, bridging, or redundant network interfaces |
| Cryptography Unit | CAU supporting DES, 3DES, AES, MD5, SHA-1 - accelerates TLS handshake and IPsec payload processing in firmware |
| PCI Interface | 32-bit, 66-MHz PCI controller - allows direct attachment of legacy I/O cards or FPGA co-processors |
| Temperature Range | -40°C to +85°C - qualified for uncontrolled industrial cabinet environments without forced cooling |
Pinout & Package
Package: 360-ball TEPBGA, 23 mm × 23 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_AD[31:0] | FlexBus Address/Data Multiplexed Bus | 32-bit multiplexed address/data interface for NOR/NAND flash, SRAM, or FPGA glueless connection |
| SD_A[13:0], SD_BA[1:0], SD_CS[1:0] | SDRAM Address & Chip Select | Direct control of up to 512 MB DDR SDRAM with bank addressing and row/column activation |
| FEC0_RXD[3:0], FEC0_TXD[3:0] | Fast Ethernet Channel 0 Data | MII-mode 4-bit parallel interface supporting 100 Mbps full-duplex operation with CRC validation |
| PCI_AD[31:0], PCI_CBE[3:0] | PCI Bus Address/Data & Command | Full 32-bit PCI 2.2-compliant interface enabling plug-in peripheral expansion without bridge logic |
| USB_DM / USB_DP | USB 2.0 Differential Pair | Integrated transceiver supporting host/peripheral mode; requires external 1.5-kΩ pull-up on DP for device enumeration |
| IVDD, EVDD, SDVDD | Power Supply Domains | Three independent supply rails: core (1.5 V), I/O (3.3 V), and SDRAM (2.5 V or 1.8 V) - mandates separate filtering per domain |
Key Features
| Feature | Design Value |
|---|---|
| Crossbar Switch (XBS) | Enables simultaneous CPU, DMA, and PCI master access to shared peripherals or SRAM - eliminates bus arbitration bottlenecks in multi-threaded applications |
| Boot Flexibility | Supports booting from SPI-compatible flash, EEPROM, or FRAM - simplifies field firmware updates and eliminates need for boot ROM |
| Dual Fast Ethernet MACs | Independent MII interfaces with integrated PHY timing control - enables Layer 2 switching or firewall packet inspection without external switch IC |
| Hardware Cryptography Acceleration | Offloads symmetric encryption/decryption and hash generation from CPU - preserves MIPS budget for application logic during TLS/IPsec sessions |
| Real-Time Timers | Four 32-bit timers with DMA trigger capability - supports precise PWM generation, input capture for encoder feedback, or periodic task scheduling |
| USB OTG with ULPI | ULPI interface reduces pin count vs. UTMI+ and enables low-cost external PHYs - supports battery-powered field service tools via USB device mode |
Applications
| Industrial Gateway | Secure Network Appliance |
|---|---|
Use Scenario: Aggregating Modbus TCP, CANopen, and EtherNet/IP traffic across factory floor networks into a unified OPC UA server. IC Role / Device Role / Timing Role: Primary application processor executing real-time protocol stacks, managing dual Ethernet ports for upstream/downstream segmentation, and handling encrypted cloud telemetry upload. Use Value: Integrated CAU accelerates TLS 1.2 handshakes; 32-KB SRAM buffers protocol translation state; XBS prevents DMA contention during concurrent packet ingress/egress. | Use Scenario: Embedded firewall appliance performing deep packet inspection, NAT, and IPsec tunnel termination for remote site connectivity. IC Role / Device Role / Timing Role: Host processor running Linux-based iptables and strongSwan, using both Ethernet MACs for WAN/LAN isolation and CAU for ESP payload decryption. Use Value: Hardware AES offload achieves >40 Mbps IPsec throughput at <15% CPU utilization; PCI interface enables optional FPGA-based pattern matching accelerator. |
| Medical Imaging Controller | Ruggedized Telematics Unit |
Use Scenario: Controlling ultrasound beamforming FPGA, buffering raw sensor data in DDR, and compressing frames for DICOM export over Gigabit Ethernet (via external PHY). IC Role / Device Role / Timing Role: Real-time system controller coordinating DMA transfers between SDRAM, DSPI (for FPGA config), and USB (for DICOM archive), with deterministic timer-triggered acquisition windows. Use Value: 200-MHz V4 core ensures sub-10 µs interrupt latency for echo sampling triggers; 16-KB caches minimize instruction fetch stalls during burst transfers. | Use Scenario: In-vehicle telematics platform collecting GPS, CAN bus diagnostics, and cellular modem status for fleet management reporting. IC Role / Device Role / Timing Role: Central host managing UART-connected GPS and cellular modules, FEC1 for OBD-II Ethernet gateway, and DSPI for secure element communication. Use Value: -40°C to +85°C rating ensures operation in parked vehicle extremes; CAU secures OTA firmware updates; ATA controller supports local eMMC storage for log buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF54455CVP200 | Same package and speed grade but adds PCI controller and ATA/ATAPI interface; otherwise identical core, cache, and peripheral set | Required where legacy PCI add-in cards or parallel ATA storage (e.g., CompactFlash) must be supported | Select MCF54455CVP200 only if PCI or ATA functionality is needed; MCF54453CVP200 reduces BOM cost and layout complexity when unused |
| MCF54452CVP200 | Identical package, speed, and temperature grade but lacks Cryptography Acceleration Unit (CAU) and second Ethernet MAC | Suitable for non-secure, single-network-edge applications such as basic HMI or serial-to-Ethernet converters | Choose MCF54452CVP200 when cryptographic offload and dual Ethernet are unnecessary - lowers power and software certification scope |
Compared with MCF54455CVP200, MCF54453CVP200 removes redundant PCI/ATA logic to reduce die size and dynamic power; versus MCF54452CVP200, it adds CAU and second FEC - making it optimal for secure, dual-interface industrial gateways without PCI legacy requirements.
Availability
MCF54453CVP200 is available at Aetrix Electronics and suitable for industrial gateways, secure network appliances, medical imaging controllers, and ruggedized telematics units requiring stable component supply across extended product lifecycles.
Supply support for MCF54453CVP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets.
The MCF5445x ColdFire® microprocessor family was designed for high-performance, real-time embedded applications demanding integrated security, dual-network connectivity, and deterministic memory subsystems - targeting industrial control, networking, and medical systems.
FAQ
What is the maximum operating frequency of the MCF54453CVP200?
The MCF54453CVP200 operates at a maximum core clock frequency of 200 MHz, delivering up to 370 Dhrystone 2.1 MIPS performance. This speed grade is validated across the full industrial temperature range (-40°C to +85°C) and is supported by the 360-ball TEPBGA package's thermal and electrical characteristics. The MCF54453CVP200 does not support 266 MHz operation - that speed is reserved for the VP266 variant suffix.
Does the MCF54453CVP200 include a hardware cryptography accelerator?
Yes, the MCF54453CVP200 includes a Cryptography Acceleration Unit (CAU) that supports DES, 3DES, AES, MD5, and SHA-1 algorithms in hardware. This unit offloads compute-intensive cryptographic operations from the ColdFire V4 core, reducing CPU utilization during TLS handshakes or IPsec packet processing. The CAU is present in MCF54453CVP200 and MCF54455CVP200 but omitted in MCF54452CVP200.
What package type and pin count does the MCF54453CVP200 use?
The MCF54453CVP200 uses a 360-ball TEPBGA (Thermally Enhanced Plastic Ball Grid Array) package measuring 23 mm × 23 mm with 1.0 mm ball pitch. This package is shared across the MCF54452–MCF54455 variants and supports full signal routing for DDR, PCI, dual Ethernet, and FlexBus interfaces. It is distinct from the 256-ball MAPBGA used by the lower-pin-count MCF54450/MCF54451 derivatives.
How many Ethernet MACs does the MCF54453CVP200 integrate?
The MCF54453CVP200 integrates two independent 10/100 Fast Ethernet MACs (FEC0 and FEC1), each with full MII interface support. Both MACs operate concurrently and can be configured for separate network segments - for example, one for upstream WAN connectivity and one for downstream LAN or fieldbus bridging. This dual-MAC capability is consistent across MCF54452 through MCF54455, distinguishing them from earlier ColdFire generations.
Is the MCF54453CVP200 compatible with the MCF54455CVP200 in terms of pinout and software?
The MCF54453CVP200 and MCF54455CVP200 share identical pinout, package, speed grade, and temperature specification, ensuring PCB footprint compatibility. Software is largely compatible at the register and peripheral driver level; however, MCF54455CVP200 exposes additional PCI and ATA/ATAPI controller registers absent in MCF54453CVP200. Applications not using those peripherals will run unchanged on either part.
MCF54453CVP200 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BBGA
- Series:
- MCF5445x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals:
- DMA, WDT
- Number of I/O:
- 132
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF54453CVP200 FAQ
1.How can I place an order for MCF54453CVP200 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF54453CVP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF54453CVP200 reliable?
The price and inventory of MCF54453CVP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF54453CVP200 is usually 5 days.
3.What payment methods are accepted for MCF54453CVP200?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF54453CVP200 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF54453CVP200?
MCF54453CVP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF54453CVP200 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF54453CVP200?
For technical support, including MCF54453CVP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF54453CVP200 requirements.
6.How does Aetrix verify that MCF54453CVP200 is sourced from the original manufacturer or authorized distributors?
All MCF54453CVP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF54453CVP200 meets industry standards.
7.What is the process for return or replacement of MCF54453CVP200?
All MCF54453CVP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF54453CVP200, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF54453CVP200 part is unused and in its original packaging.
Return procedure for MCF54453CVP200:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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