NXP Semiconductors MCF54454CVP200

Overview

MCF54454CVP200 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 200 MHz (–40°C to +85°C), featuring 32-KB on-chip SRAM, dual 10/100 Ethernet MACs, DDR SDRAM controller, and hardware cryptography acceleration for DES/3DES/AES/MD5/SHA-1. It targets industrial networking gateways requiring deterministic real-time control and secure data handling.

For engineers reviewing the MCF54454CVP200 datasheet, MCF54454CVP200 pinout, MCF54454CVP200 application, or MCF54454CVP200 equivalent, key selection criteria include its 360-pin TEPBGA package, 200-MHz system clock, dual FEC support, PCI 66-MHz interface, and boot-from-SPI-flash capability in extended temperature environments.

Technical Context

The MCF54454CVP200 implements a ColdFire V4 core with integrated MMU for protected memory management and an EMAC unit for high-efficiency multiply-accumulate operations. Its crossbar switch (XBS) enables concurrent access to peripherals and RAM by multiple bus masters, including CPU, DMA, and PCI.

It integrates a 16-channel DMA controller, 4 programmable interrupt timers (PIT), 4 32-bit timers with DMA support, and dual Fast Ethernet controllers compliant with IEEE 802.3. The USB 2.0 On-the-Go controller supports ULPI interface, and the ATA/ATAPI controller enables direct storage attachment.

Key Specifications

Pinout & Package

Package: 360-ball TEPBGA (23 mm × 23 mm), RoHS-compliant, lead-free, with standard JEDEC footprint and thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF54455CVP200, the MCF54454CVP200 removes ATA support while retaining identical networking, memory, and crypto capabilities; versus MCF54453CVP200, it adds PCI and CAU - making it optimal for secure, expandable industrial gateways requiring field-upgradable modules and encrypted data transport.

Availability

MCF54454CVP200 is available at Aetrix Electronics and suitable for industrial gateways, secure edge routers, medical imaging controllers, and ruggedized network appliances requiring stable component supply across long product lifecycles.

Supply support for MCF54454CVP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets.

The MCF5445x ColdFire® microprocessor family targets high-performance, real-time embedded systems requiring integrated networking, memory management, and hardware security - especially where long-term availability and extended temperature operation are critical.

FAQ

What is the maximum operating frequency of the MCF54454CVP200?

The MCF54454CVP200 operates at a maximum system clock frequency of 200 MHz across the full industrial temperature range of –40°C to +85°C. This speed is guaranteed under specified voltage and thermal conditions per the official NXP datasheet Rev. 9 (04/2021), and applies to both core execution and peripheral timing domains including the DDR controller and FlexBus interface. The MCF54454CVP200 achieves 370 Dhrystone 2.1 MIPS at this frequency.

Does the MCF54454CVP200 support hardware cryptography acceleration?

Yes, the MCF54454CVP200 includes a dedicated Cryptography Acceleration Unit (CAU) that offloads DES, 3DES, AES, MD5, and SHA-1 operations from the main ColdFire V4 core. This hardware block executes cryptographic primitives in constant time with no software intervention required, significantly improving throughput for TLS, IPsec, and secure boot workflows. The CAU is fully integrated into the MCF54454CVP200's memory map and accessible via standard register reads/writes.

What package type and pin count does the MCF54454CVP200 use?

The MCF54454CVP200 uses a 360-ball TEPBGA (Thermally Enhanced Plastic Ball Grid Array) package measuring 23 mm × 23 mm. This package is shared across the MCF54452–MCF54455 variants and features a standard JEDEC footprint with exposed thermal pad. Pin assignments match those documented in Figure 6 of the MCF5445x datasheet Rev. 9, confirming compatibility with existing layout footprints for MCF54452CVP200 and MCF54455CVP200.

How many Ethernet MACs does the MCF54454CVP200 integrate, and what interfaces do they support?

The MCF54454CVP200 integrates two independent 10/100 Fast Ethernet MACs (FEC0 and FEC1). Each supports both MII and RMII physical layer interfaces, with dedicated signal groups (e.g., FEC0_RXD[3:0], FEC0_TXEN, FEC1_MDIO) routed to distinct ball locations on the 360-TEPBGA package. Both MACs feature integrated DMA engines and IEEE 802.3-compliant frame handling, enabling simultaneous full-duplex operation on separate networks or redundancy protocols like HSR/PRP.

Is the MCF54454CVP200 compatible with the MCF54455CVP200 in terms of pinout and software?

Yes, the MCF54454CVP200 and MCF54455CVP200 share identical 360-TEPBGA pinouts, electrical characteristics, and core architecture - ensuring full hardware compatibility. Software is binary-compatible at the instruction and peripheral register level. The only functional difference is that the MCF54455CVP200 includes an additional ATA/ATAPI controller, while the MCF54454CVP200 omits it. All other modules - including dual FEC, PCI, USB OTG, CAU, and DDR controller - are identical between the two parts.