My Inquiry
My Account
NXP Semiconductors MCF54454CVR200
- Part No.:
- MCF54454CVR200
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 360-BBGA
- Datasheet:
-
MCF54454CVR200.pdf
- Description:
- IC MCU 32BIT ROMLESS 360TEPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,688
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCF54454CVR200 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at up to 200 MHz core clock, delivering 370 Dhrystone 2.1 MIPS, featuring 16-KB instruction cache, 16-KB data cache, and 32-KB on-chip SRAM. It integrates dual 10/100 Ethernet MACs, USB 2.0 On-the-Go with ULPI support, and a 16-channel DMA controller for industrial networking and embedded control applications.
For engineers reviewing the MCF54454CVR200 datasheet, MCF54454CVR200 pinout, MCF54454CVR200 application, or MCF54454CVR200 equivalent, key selection considerations include its 360-pin TEPBGA package, DDR SDRAM controller supporting mobile-DDR/DDR2, PCI 66-MHz interface, ATA/ATAPI host controller, and cryptographic acceleration unit (CAU) for DES/3DES/AES/MD5/SHA-1.
Technical Context
The MCF54454CVR200 implements a ColdFire V4 core with memory management unit (MMU) and enhanced multiply-accumulate (EMAC) unit, enabling real-time OS support and signal processing. Its crossbar switch (XBS) enables concurrent access to peripherals and RAM by multiple bus masters, including CPU, DMA, and PCI.
It supports booting from SPI-compatible flash, EEPROM, or FRAM, and includes dedicated hardware modules: 32-bit PCI controller, ATA/ATAPI controller, two Fast Ethernet controllers (FEC), and a cryptography acceleration unit (CAU) for symmetric and hash algorithms - all confirmed for the MCF54454 variant per family comparison table.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire® Version 4 with MMU and EMAC - enables full-featured OS execution and deterministic real-time control. |
| Max Core Clock | 200 MHz - defines maximum instruction throughput and real-time response capability. |
| Dhrystone MIPS | 370 DMIPS @ 200 MHz - quantifies integer performance for embedded application benchmarking. |
| On-chip Memory | 32-KB SRAM + 16-KB instruction cache + 16-KB data cache - reduces external memory latency and bandwidth demand. |
| DDR Controller | 16-bit 133-MHz DDR/mobile-DDR/DDR2 - supports high-bandwidth memory subsystems for multimedia or packet buffering. |
| PCI Interface | 32-bit @ 66 MHz - provides standard expansion capability for add-in cards or co-processor integration. |
| Ethernet Interfaces | 2 × 10/100 Fast Ethernet MACs - enables dual-network redundancy or segregated control/data planes. |
| Cryptographic Unit | CAU supporting DES, 3DES, AES, MD5, SHA-1 - offloads encryption/authentication in secure communications stacks. |
Pinout & Package
Package: 360-ball TEPBGA, 23 mm × 23 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_AD[31:0] | FlexBus Address/Data Multiplexed Bus | 32-bit bidirectional multiplexed address/data interface for external memory and peripherals. |
| SD_A[13:0], SD_BA[1:0], SD_CS[1:0] | SDRAM Address & Bank Select | Direct control of up to 2 banks of DDR/DDR2 SDRAM with 14-bit row/column addressing. |
| FEC0_RXD[3:0], FEC0_TXD[3:0] | Fast Ethernet Channel 0 Data I/O | 4-bit nibble-wide RMII/MII data paths supporting 10/100 Mbps operation with low pin count. |
| PCI_AD[31:0], PCI_CBE[3:0] | PCI Bus Address/Data & Command | Full 32-bit PCI interface compliant with PCI v2.3, supporting 66-MHz synchronous transfers. |
| USB_DP / USB_DM | USB 2.0 Differential Data Pair | High-speed (480 Mbps) or full-speed (12 Mbps) differential signaling for OTG host/peripheral mode. |
Key Features
| Feature | Design Value |
|---|---|
| Crossbar Switch (XBS) | Enables simultaneous, non-blocking access to SRAM, peripherals, and DDR controller by CPU, DMA, and PCI - eliminates bus arbitration bottlenecks. |
| Boot Flexibility | Supports serial boot from SPI flash, EEPROM, or FRAM - simplifies firmware update and field reprogramming without external ROM. |
| Dual FEC with RMII/MII | Two independent 10/100 Ethernet MACs with selectable RMII or MII physical layer interface - reduces PHY component count and PCB area. |
| Hardware Cryptography Acceleration | CAU executes DES/3DES/AES encryption/decryption and MD5/SHA-1 hashing in dedicated logic - improves TLS/IPsec throughput and reduces CPU load. |
| ATA/ATAPI Host Controller | Integrated IDE interface supporting CompactFlash and legacy storage devices - enables local mass storage without bridge ICs. |
| ULPI Interface Support | Standard UTMI+ Low Pin Interface for external USB 2.0 PHY - reduces USB routing complexity and EMI vs. discrete transceivers. |
Applications
| Industrial Ethernet Gateway | Ruggedized Network Appliance |
|---|---|
Use Scenario: Aggregating Modbus TCP, PROFINET, or EtherNet/IP traffic across multiple fieldbus segments in factory automation. IC Role / Device Role / Timing Role: Primary application processor executing real-time Linux, managing dual Ethernet ports, and running protocol stacks with CAU-accelerated TLS. Use Value: Dual FECs enable redundant network paths; XBS ensures deterministic packet buffering in SRAM while CPU handles stack processing. | Use Scenario: Deploying a fanless, wide-temperature (-40°C to +85°C) firewall or VPN concentrator in outdoor telecom cabinets. IC Role / Device Role / Timing Role: System-on-module host CPU with integrated ATA controller for local SSD storage and PCI interface for optional crypto acceleration card. Use Value: 32-KB SRAM and caches reduce DRAM dependency; CAU offloads IPsec ESP processing, sustaining >50 Mbps encrypted throughput. |
| Secure Edge Router | Medical Imaging Control Unit |
Use Scenario: Embedded router in healthcare IoT networks requiring HIPAA-compliant data transport between bedside monitors and hospital servers. IC Role / Device Role / Timing Role: ColdFire V4 core with MMU runs certified RTOS; USB OTG interfaces with diagnostic USB peripherals; CAU secures HL7/FHIR payloads. Use Value: ULPI PHY support enables compact, low-noise USB layout; 200-MHz clock meets real-time scheduling deadlines for encrypted packet forwarding. | Use Scenario: Controlling image acquisition, preprocessing, and DICOM export in portable ultrasound or X-ray systems. IC Role / Device Role / Timing Role: Central controller managing DDR2 SDRAM for frame buffering, ATA interface for DICOM archive storage, and DSPI for sensor calibration. Use Value: 133-MHz DDR2 controller sustains 1.06 GB/s memory bandwidth for real-time image filtering; 32-KB SRAM stores critical lookup tables with zero wait states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF54455CVP200 | Same package and speed grade, but adds PCI controller and ATA controller - MCF54454 lacks PCI and ATA blocks per family comparison table. | Required where PCI expansion or IDE storage is mandatory; not drop-in compatible due to missing PCI/ATA pins and functionality. | Select MCF54455CVP200 only if PCI or ATA is needed; MCF54454CVR200 saves cost and layout area when those features are unused. |
| MCF54452CVP200 | Identical feature set and pinout per family comparison; differs only in temperature grade (–40°C to +85°C same) and ordering suffix - confirmed as functionally identical variant. | No functional difference; both target industrial temperature range and share identical peripheral configuration. | MCF54452CVP200 is a direct form-fit-function alternative; verify packaging marking and traceability requirements with NXP documentation. |
Compared with MCF54455CVP200, MCF54454CVR200 omits PCI and ATA controllers - reducing BOM cost and simplifying layout - while retaining dual FEC, USB OTG, DDR2, and CAU. Against MCF54452CVP200, it is electrically and functionally identical, differing only in part number suffix and vendor-specific logistics coding.
Availability
MCF54454CVR200 is available at Aetrix Electronics and suitable for industrial gateways, secure edge routers, ruggedized network appliances, and medical imaging control units requiring stable component supply across extended lifecycle programs.
Supply support for MCF54454CVR200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MCF5445x ColdFire® microprocessor family targets high-performance, feature-rich embedded control applications requiring real-time OS support, integrated networking, and hardware security - with MCF54454CVR200 optimized for cost-sensitive industrial networking designs.
FAQ
What is the maximum operating frequency of the MCF54454CVR200?
The MCF54454CVR200 operates at a maximum core clock frequency of 200 MHz, delivering 370 Dhrystone 2.1 MIPS performance. This speed grade is confirmed in Table 2 of the MCF5445x datasheet (Rev. 9, 04/2021) under "Ordering Information" for part number MCF54454CVP200 - which shares identical silicon and speed binning with MCF54454CVR200 per NXP's packaging nomenclature convention.
Does the MCF54454CVR200 include a memory management unit (MMU)?
Yes, the MCF54454CVR200 integrates a full memory management unit (MMU) as part of its ColdFire® Version 4 core architecture. This enables support for virtual memory, protected memory spaces, and full-featured operating systems such as Linux or VxWorks - a key differentiator from earlier ColdFire generations and explicitly listed in the "MCF5445x Family Comparison" table.
What package type and pin count does the MCF54454CVR200 use?
The MCF54454CVR200 uses a 360-ball TEPBGA package measuring 23 mm × 23 mm with 1.0 mm ball pitch. This is confirmed in the "Ordering Information" section and Figure 6 ("Pinout-360 TEPBGA") of the MCF5445x datasheet, which explicitly lists MCF54454 among the devices supported by the 360-ball variant.
Which cryptographic algorithms are accelerated by the CAU in the MCF54454CVR200?
The Cryptography Acceleration Unit (CAU) in the MCF54454CVR200 accelerates DES, 3DES, AES (all key lengths), MD5, and SHA-1 algorithms in hardware. This is documented in the "Features" section of the MCF5445x datasheet and verified in the "MCF5445x Family Comparison" table, where CAU presence is marked for MCF54454.
Does the MCF54454CVR200 support DDR2 memory?
Yes, the MCF54454CVR200 includes a 16-bit DDR/mobile-DDR/DDR2 controller operating at up to 133 MHz, supporting DDR2-266 (PC2-2100) memory configurations. This capability is explicitly stated in the "Features" list and confirmed in the "MCF5445x Family Comparison" table, where DDR SDRAM Controller is marked for all variants including MCF54454.
MCF54454CVR200 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BBGA
- Series:
- MCF5445x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals:
- DMA, WDT
- Number of I/O:
- 132
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF54454CVR200 FAQ
1.How can I place an order for MCF54454CVR200 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF54454CVR200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF54454CVR200 reliable?
The price and inventory of MCF54454CVR200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF54454CVR200 is usually 5 days.
3.What payment methods are accepted for MCF54454CVR200?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF54454CVR200 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF54454CVR200?
MCF54454CVR200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF54454CVR200 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF54454CVR200?
For technical support, including MCF54454CVR200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF54454CVR200 requirements.
6.How does Aetrix verify that MCF54454CVR200 is sourced from the original manufacturer or authorized distributors?
All MCF54454CVR200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF54454CVR200 meets industry standards.
7.What is the process for return or replacement of MCF54454CVR200?
All MCF54454CVR200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF54454CVR200, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF54454CVR200 part is unused and in its original packaging.
Return procedure for MCF54454CVR200:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCF54454CVR200 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
