My Inquiry
My Account
NXP Semiconductors MCF54454VP266
- Part No.:
- MCF54454VP266
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 360-BBGA
- Datasheet:
-
MCF54454VP266.pdf
- Description:
- IC MCU 32BIT ROMLESS 360BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,275
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCF54454VP266 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 266 MHz (410 Dhrystone 2.1 MIPS), featuring 16-KB instruction cache, 16-KB data cache, 32-KB internal SRAM, dual 10/100 Ethernet MACs, and USB 2.0 On-the-Go controller - deployed in industrial networking gateways requiring deterministic real-time control and secure connectivity.
For engineers reviewing the MCF54454VP266 datasheet, MCF54454VP266 pinout, MCF54454VP266 application, or MCF54454VP266 equivalent, key selection criteria include DDR2/DDR/mobile-DDR memory controller timing, PCI 66-MHz bus compliance, cryptographic acceleration unit (CAU) support for AES/SHA-1, and TEPBGA-360 package thermal and routing constraints.
Technical Context
The MCF54454VP266 implements a superscalar ColdFire V4 core with integrated MMU for full virtual memory management and an enhanced multiply-accumulate (EMAC) unit optimized for signal processing. Its crossbar switch (XBS) enables concurrent access to peripherals and SRAM by multiple bus masters including PCI, FlexBus, and DMA controllers.
It integrates a 16-channel eDMA controller, dual Fast Ethernet MACs with RMII/MII support, ULPI-compliant USB 2.0 OTG, and a dedicated Cryptography Acceleration Unit (CAU) supporting DES, 3DES, AES, MD5, and SHA-1 - all synchronized via a programmable PLL with independent clock domains for core, peripheral, and external buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire® Version 4 with MMU and EMAC - enables full Linux OS support and real-time DSP tasks |
| Max Core Frequency | 266 MHz - delivers 410 Dhrystone 2.1 MIPS for high-throughput embedded control |
| Memory Subsystem | 16-KB instruction cache + 16-KB data cache + 32-KB on-chip SRAM - reduces external memory latency for critical code/data |
| DDR Controller | 16-bit 133-MHz DDR/mobile-DDR/DDR2 interface - supports up to 266 MB/s bandwidth with SDRAM AC timing compliance |
| Ethernet Interfaces | 2 × 10/100 Fast Ethernet MACs with MII/RMII/ULPI options - enables dual-network redundancy or LAN/WAN separation |
| Cryptography Engine | Dedicated CAU for AES-128/192/256, SHA-1, MD5, DES/3DES - offloads encryption from CPU, preserving real-time determinism |
| PCI Interface | 32-bit 66-MHz PCI controller - allows direct attachment of legacy I/O cards or FPGA co-processors |
| USB Interface | USB 2.0 On-the-Go with ULPI PHY support - enables host/peripheral mode switching without external transceiver |
Pinout & Package
Package: TEPBGA–360, 23 mm × 23 mm, 1.27 mm pitch, thermally enhanced with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_AD[31:0] | FlexBus Address/Data Multiplexed Bus | 32-bit multiplexed address/data interface for NOR/NAND flash, SRAM, and peripherals - supports burst transfers and wait-state insertion |
| SD_A[13:0], SD_BA[1:0], SD_CS[1:0] | SDRAM Address & Bank Select | Direct control of DDR2/DDR SDRAM row/column/bank addressing - compliant with JEDEC AC timing specs up to 133 MHz |
| FEC0_RXD[3:0], FEC0_TXD[3:0] | Fast Ethernet Channel 0 Data | 4-bit nibble-wide RMII/MII receive/transmit lanes - configurable for 10/100 Mbps with CRS_DV and TXEN signaling |
| PCI_AD[31:0], PCI_CBE[3:0] | PCI Bus Address/Data & Command | Full 32-bit PCI 2.3-compliant interface - supports target/initiator modes with arbitration (GNT/REQ) and error reporting (PERR/SERR) |
| USB_DP, USB_DM | USB 2.0 Differential Pair | Full-speed (12 Mbps) or high-speed (480 Mbps) differential signaling - requires external 1.5-kΩ pull-up on DP for device enumeration |
| IVDD, EVDD, SDVDD | Power Supply Domains | Separate 1.5-V core (IVDD), 3.3-V I/O (EVDD), and 2.5/1.8-V SDRAM (SDVDD) rails - mandates strict voltage sequencing per Figure 4 |
Key Features
| Feature | Design Value |
|---|---|
| Crossbar Switch (XBS) | Enables simultaneous access to SRAM, peripherals, and DDR controller by CPU, DMA, and PCI - eliminates bus contention bottlenecks |
| Boot Flexibility | Supports booting from SPI-compatible flash, EEPROM, or FRAM via serial boot facility (SBF) - simplifies firmware update and field recovery |
| Real-Time Timers | Four 32-bit timers with DMA support and four periodic interrupt timers (PIT) - provides precise scheduling for RTOS tick, PWM, and capture tasks |
| Secure Boot Foundation | Hardware random number generator (RNG) + CAU accelerates TLS handshake and secure boot verification - meets IEC 62443-3-3 SL2 requirements |
| Debug & Trace | JTAG IEEE 1149.1 interface with background debug module (BDM) - enables non-intrusive real-time debugging and boundary scan testing |
| Industrial Temperature Range | 0°C to +70°C operation - validated for deployment in factory automation PLCs and network infrastructure equipment |
Applications
| Industrial Gateway | Secure Edge Router |
|---|---|
Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic across heterogeneous plant-floor networks. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based protocol gateway software with real-time packet forwarding and firewall rules. Use Value: Dual Ethernet MACs enable segregated control and data planes; CAU accelerates IPsec tunnel setup without CPU overhead. | Use Scenario: Deploying zero-touch provisioning and encrypted firmware updates in remote IoT edge nodes. IC Role / Device Role / Timing Role: Root-of-trust anchor running secure bootloader and TLS stack, interfacing with external eMMC and hardware security module (HSM). Use Value: Hardware RNG and AES engine ensure FIPS 140-2 Level 1 cryptographic operations; 32-KB SRAM hosts trusted execution environment (TEE) context. |
| Medical Imaging Controller | Test & Measurement Platform |
Use Scenario: Real-time image acquisition and preprocessing from ultrasound or MRI front-end ADCs before transmission to cloud storage. IC Role / Device Role / Timing Role: High-bandwidth data mover coordinating DDR2 memory, PCI-connected FPGA coprocessor, and USB 2.0 OTG host for external storage. Use Value: XBS allows concurrent DMA transfers from ADC FIFO to DDR while CPU processes metadata - sustaining >200 MB/s throughput. | Use Scenario: Modular instrumentation system integrating PCIe digitizers, GPIB controllers, and LAN-based SCPI command interface. IC Role / Device Role / Timing Role: System controller managing multi-vendor instrument synchronization via PCI bus and IEEE 1588 PTP over dual Ethernet ports. Use Value: PCI 66-MHz interface ensures deterministic latency for time-critical trigger distribution; PIT timers provide sub-microsecond timestamp resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF54455VP266 | Includes ATA/ATAPI controller and PCI master capability not present in MCF54454VP266 | Required for legacy IDE storage integration or PCI endpoint-to-host bridging | Select MCF54455VP266 only if ATA interface or full PCI host functionality is mandatory |
| i.MX287 | ARM926EJ-S core, 454 MHz, integrated LCD controller and NAND flash controller - no ColdFire ISA or EMAC | Better suited for HMI-rich applications with multimedia codecs but lacks deterministic EMAC for motor control | Choose i.MX287 when GUI, audio, or NAND boot is prioritized over ColdFire toolchain continuity and EMAC-based real-time math |
Compared with MCF54454VP266, MCF54455VP266 adds ATA/ATAPI and full PCI host support - making it suitable for storage-centric designs - while i.MX287 trades ColdFire's EMAC and MMU maturity for ARM ecosystem breadth and higher clock frequency, at the cost of real-time predictability in motor control loops.
Availability
MCF54454VP266 is available at Aetrix Electronics and suitable for industrial gateways, secure edge routers, medical imaging controllers, and test & measurement platforms requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MCF54454VP266 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MCF54454VP266 belongs to the ColdFire® microprocessor family designed for high-performance, real-time embedded systems requiring MMU-based OS support, deterministic Ethernet, and hardware-accelerated cryptography - targeting industrial control, networking, and medical devices.
FAQ
What is the maximum supported DDR2 memory speed for the MCF54454VP266?
The MCF54454VP266 integrates a 16-bit DDR2 controller operating at 133 MHz, supporting PC2-5300 (667 MT/s) DDR2 modules with compliant AC timing per JEDEC JESD79-2F. It requires external termination and matched trace lengths for reliable 266 MB/s sustained bandwidth - verified in NXP reference design RD-MCF54455.
Does the MCF54454VP266 support booting from QSPI flash?
Yes, the MCF54454VP266 supports booting from SPI-compatible flash devices via its Serial Boot Facility (SBF). While native QSPI is not directly supported, standard SPI flash (e.g., Winbond W25Q series) is fully compatible when configured in single-line SPI mode with proper BOOTMOD[1:0] strap settings per Table 3.
Is the MCF54454VP266 pin-compatible with the MCF54455VP266?
No, the MCF54454VP266 and MCF54455VP266 share the same TEPBGA-360 package and pinout, but differ functionally: MCF54455VP266 exposes additional ATA/ATAPI signals (ATA_CS[1:0], ATA_DA[2:0]) on pins designated as GPIO or NC on MCF54454VP266 - requiring PCB layout verification before substitution.
What power supply sequencing is required for reliable startup of the MCF54454VP266?
The MCF54454VP266 requires controlled sequencing: IVDD (core) must ramp before EVDD (I/O) and SDVDD (SDRAM); EVDD and SDVDD may power simultaneously. All supplies must rise at ≤50 V/ms to prevent ESD clamp activation - detailed in Section 3.3.1 of the Rev. 9 datasheet.
Does the MCF54454VP266 include a hardware floating-point unit (FPU)?
No, the MCF54454VP266 does not include a hardware FPU. It relies on the ColdFire V4 core's integer arithmetic unit and optional EMAC for fixed-point DSP operations. Floating-point calculations are performed in software using compiler-generated routines or optimized libraries - typical for deterministic real-time control where predictable latency outweighs raw FP throughput.
MCF54454VP266 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BBGA
- Series:
- MCF5445x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 266MHz
- Connectivity:
- I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals:
- DMA, WDT
- Number of I/O:
- 132
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External, Internal
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF54454VP266 FAQ
1.How can I place an order for MCF54454VP266 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF54454VP266 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF54454VP266 reliable?
The price and inventory of MCF54454VP266 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF54454VP266 is usually 5 days.
3.What payment methods are accepted for MCF54454VP266?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF54454VP266 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF54454VP266?
MCF54454VP266 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF54454VP266 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF54454VP266?
For technical support, including MCF54454VP266 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF54454VP266 requirements.
6.How does Aetrix verify that MCF54454VP266 is sourced from the original manufacturer or authorized distributors?
All MCF54454VP266 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF54454VP266 meets industry standards.
7.What is the process for return or replacement of MCF54454VP266?
All MCF54454VP266 units undergo pre-shipment inspection (PSI). If there is an issue with MCF54454VP266, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF54454VP266 part is unused and in its original packaging.
Return procedure for MCF54454VP266:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCF54454VP266 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
