NXP Semiconductors MCF54455CVP200
- Part No.:
- MCF54455CVP200
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 360-BBGA
- Datasheet:
-
MCF54455CVP200.pdf
- Description:
- IC MCU 32BIT ROMLESS 360BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCF54455CVP200 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 200 MHz, delivering 370 Dhrystone 2.1 MIPS, featuring 16-KB instruction cache, 16-KB data cache, 32-KB internal SRAM, dual 10/100 Ethernet MACs, and a 32-bit PCI controller - deployed in industrial networking gateways requiring deterministic real-time processing and multi-protocol connectivity.
For engineers reviewing the MCF54455CVP200 datasheet, MCF54455CVP200 pinout, MCF54455CVP200 application, or MCF54455CVP200 equivalent, key selection considerations include DDR2/DDR SDRAM interface timing compliance, PCI bus arbitration behavior, cold-swap-safe power sequencing, and cryptographic acceleration unit (CAU) support for AES/SHA-1 offload in secure edge devices.
Technical Context
The MCF54455CVP200 implements a superscalar ColdFire V4 core with hardware MMU for full virtual memory management and integrated EMAC for high-efficiency multiply-accumulate operations in signal processing tasks. Its crossbar switch (XBS) enables concurrent access to peripherals and RAM by multiple bus masters including CPU, DMA, USB OTG, and PCI.
It integrates a 16-channel eDMA controller, dual Fast Ethernet controllers supporting MII/RMII modes, ULPI-compliant USB 2.0 On-the-Go, ATA/ATAPI host interface, and a dedicated Cryptography Acceleration Unit (CAU) supporting DES, 3DES, AES, MD5, and SHA-1 algorithms - all operating under a single synchronized clock domain derived from its PLL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ColdFire® Version 4 with MMU and EMAC - enables full Linux OS support and real-time DSP workloads |
| Max Core Frequency | 200 MHz - guarantees sustained 370 Dhrystone 2.1 MIPS performance at industrial temperature range (–40°C to +85°C) |
| Memory Subsystem | 16-KB instruction cache + 16-KB data cache + 32-KB on-chip SRAM - reduces external memory latency for boot code and critical ISR execution |
| DDR Interface | 133-MHz DDR/mobile-DDR/DDR2 controller - supports up to 266 MT/s data rate with programmable timing registers |
| PCI Interface | 32-bit PCI controller @ 66 MHz - compliant with PCI Rev 2.2, supports both host and agent modes with configurable BARs |
| Cryptography Engine | Dedicated CAU for AES-128/192/256, DES/3DES, MD5, SHA-1 - offloads ~90% of crypto processing from main CPU in IPsec/TLS stacks |
| Package | 360-ball TEPBGA, 23 mm × 23 mm - compatible with standard BGA reflow profiles and industrial PCB thermal management |
Pinout & Package
Package: 360-ball Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 23 mm × 23 mm, 1.27 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_AD[31:0] | FlexBus Address/Data Multiplexed Bus | 32-bit multiplexed address/data interface for external NOR/NAND flash, SRAM, and peripherals - supports burst transfers and wait-state insertion |
| SD_A[13:0], SD_BA[1:0], SD_CS[1:0] | SDRAM Address & Chip Select | Direct control of DDR/DDR2 SDRAM banks and rows/columns - supports auto-precharge and self-refresh modes |
| FEC0_RXD[3:0], FEC0_TXD[3:0] | Fast Ethernet Controller 0 Data I/O | 4-bit nibble-wide MII interface for 10/100 Mbps Ethernet - configurable as RMII with shared REF_CLK |
| PCI_AD[31:0], PCI_CBE[3:0] | PCI Address/Data & Command/Byte Enable | Full 32-bit PCI bus interface - supports memory-mapped I/O, bus mastering, and PCI interrupt assertion via INTA |
| USB_DP, USB_DM | USB 2.0 Differential Data Pair | On-chip transceiver compliant with USB 2.0 High-Speed signaling - requires external 1.5-kΩ pull-up on DP for device mode detection |
Key Features
| Feature | Design Value |
|---|---|
| Version 4 ColdFire Core with MMU | Enables full POSIX-compliant OS deployment (e.g., Linux, VxWorks) with memory protection and virtual addressing |
| Crossbar Switch (XBS) | Eliminates bus contention between CPU, DMA, USB OTG, and PCI - ensures deterministic latency for time-critical peripherals |
| Dual 10/100 Ethernet MACs | Independent MII/RMII interfaces allow simultaneous operation on two physical networks - ideal for firewall or bridging applications |
| Cryptography Acceleration Unit (CAU) | Hardware-accelerated AES encryption/decryption at >20 MB/s - reduces CPU load during TLS handshake and packet encryption |
| Boot from SPI Flash/EEPROM/FRAM | Supports secure boot via encrypted image verification using CAU - eliminates need for external boot ROM or FPGA configuration |
Applications
| Industrial Gateway | Secure Edge Router |
|---|---|
Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET traffic across factory floor PLCs and SCADA systems. IC Role / Device Role / Timing Role: Primary application processor executing protocol stack translation, real-time packet forwarding, and deterministic scheduling via MMU-managed memory partitions. Use Value: Dual Ethernet MACs enable segregated control and data planes; CAU accelerates encrypted tunneling (IPsec) without degrading throughput below 85 Mbps line rate. | Use Scenario: Deployed in remote substations for encrypted telemetry (IEC 61850 GOOSE) and firmware updates over cellular backhaul. IC Role / Device Role / Timing Role: Host processor managing secure boot, TLS 1.2 termination, AES-GCM packet encryption, and watchdog-monitored failover between LTE and satellite links. Use Value: Integrated CAU handles full TLS record encryption at 15+ Mbps; 32-KB SRAM stores cryptographic keys in protected memory region. |
| Medical Imaging Controller | Avionics Data Concentrator |
Use Scenario: Real-time acquisition and preprocessing of ultrasound Doppler data before transmission to PACS via DICOM over TLS. IC Role / Device Role / Timing Role: High-throughput data mover interfacing with ADCs via FlexBus, performing FFT-based beamforming in SRAM, and streaming encrypted DICOM over dual Ethernet. Use Value: 200 MHz ColdFire V4 core delivers 370 MIPS for real-time signal processing; DDR2 controller sustains 1.6 GB/s memory bandwidth for frame buffering. | Use Scenario: ARINC 664 (AFDX) endpoint consolidating sensor data from flight control, navigation, and environmental systems onto a deterministic switched network. IC Role / Device Role / Timing Role: Deterministic traffic shaper and scheduler enforcing AFDX virtual link bandwidth allocation and latency bounds using MMU-protected partitioning. Use Value: Crossbar switch ensures zero-latency access to Ethernet MACs and DMA for time-triggered frame injection; PCI interface connects to legacy MIL-STD-1553 bridge ASIC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCF54455VP266 | Same die, 266 MHz max frequency, 0°C to +70°C temperature grade | Targeted for commercial-grade embedded systems with relaxed thermal constraints and higher performance headroom | Select when system cooling allows 266 MHz operation and industrial temperature range is not required |
| MCF54454CVP200 | Same package and speed grade, lacks ATA/ATAPI controller and CAU | Suitable for cost-sensitive networking applications where storage interface and hardware crypto are unnecessary | Choose when ATA host interface and cryptographic acceleration are not needed to reduce BOM cost |
Compared with MCF54455VP266, the MCF54455CVP200 offers guaranteed operation at –40°C to +85°C and lower dynamic power at 200 MHz; compared with MCF54454CVP200, it adds production-ready ATA/ATAPI and CAU blocks essential for secure industrial storage and encrypted communications.
Availability
MCF54455CVP200 is available at Aetrix Electronics and suitable for industrial gateways, secure edge routers, medical imaging controllers, and avionics data concentrators requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MCF54455CVP200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MCF54455 belongs to the ColdFire® microprocessor family designed for high-performance, real-time embedded applications demanding rich peripheral integration, deterministic execution, and hardware security acceleration in harsh environments.
FAQ
What is the maximum operating temperature range for the MCF54455CVP200?
The MCF54455CVP200 is rated for industrial temperature operation from –40°C to +85°C. This specification is guaranteed per the datasheet's ordering information table and applies to all electrical and timing parameters under specified voltage and loading conditions. The "C" prefix in the part number explicitly denotes this extended temperature grade, distinguishing it from commercial-grade variants like the MCF54455VP266.
Does the MCF54455CVP200 support booting from serial flash devices?
Yes, the MCF54455CVP200 supports booting from SPI-compatible flash, EEPROM, and FRAM devices via its integrated serial boot facility (SBF). Boot mode is selected using BOOTMOD[1:0] pins, and the SBF provides configurable clock polarity, phase, and bit-width settings. This eliminates dependency on external boot ROM and enables field-upgradable firmware images stored in low-cost serial memory.
How many Ethernet MACs does the MCF54455CVP200 integrate, and what interfaces do they support?
The MCF54455CVP200 integrates two independent 10/100 Fast Ethernet MACs (FEC0 and FEC1). Each supports MII and RMII physical layer interfaces, with configurable pin multiplexing. FEC0 pins are assigned to the 256 MAPBGA package, while both FEC0 and FEC1 are fully routed on the 360 TEPBGA package used by the MCF54455CVP200 - enabling true dual-network operation without external PHY sharing.
Is the Cryptography Acceleration Unit (CAU) in the MCF54455CVP200 enabled and functional at 200 MHz?
Yes, the CAU in the MCF54455CVP200 is fully operational at its rated 200 MHz core frequency. The CAU operates synchronously with the CPU clock and is validated across the entire industrial temperature range. It supports AES-128/192/256, DES/3DES, MD5, and SHA-1 algorithms in both ECB and CBC modes, with DMA-assisted data transfer to minimize CPU intervention during bulk encryption.
What power supply sequencing requirements must be observed for reliable startup of the MCF54455CVP200?
The MCF54455CVP200 requires strict sequencing: IVDD (core logic) must ramp after EVDD (I/O) and SDVDD (SDRAM) but before PVDD (PLL). Rise times must be ≤50 V/ms to prevent ESD clamp activation. The datasheet specifies no minimum delay between EVDD/SDVDD and IVDD power-up, but IVDD must stabilize before releasing reset. Failure to follow this sequence risks undefined I/O states or PLL lock failure.
MCF54455CVP200 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BBGA
- Series:
- MCF5445x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- Coldfire V4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- I2C, SPI, SSI, UART/USART, USB OTG
- Peripherals:
- DMA, WDT
- Number of I/O:
- 132
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MCF54455CVP200 FAQ
1.How can I place an order for MCF54455CVP200 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCF54455CVP200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCF54455CVP200 reliable?
The price and inventory of MCF54455CVP200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCF54455CVP200 is usually 5 days.
3.What payment methods are accepted for MCF54455CVP200?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCF54455CVP200 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCF54455CVP200?
MCF54455CVP200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCF54455CVP200 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCF54455CVP200?
For technical support, including MCF54455CVP200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCF54455CVP200 requirements.
6.How does Aetrix verify that MCF54455CVP200 is sourced from the original manufacturer or authorized distributors?
All MCF54455CVP200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCF54455CVP200 meets industry standards.
7.What is the process for return or replacement of MCF54455CVP200?
All MCF54455CVP200 units undergo pre-shipment inspection (PSI). If there is an issue with MCF54455CVP200, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCF54455CVP200 part is unused and in its original packaging.
Return procedure for MCF54455CVP200:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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