NXP Semiconductors MCF54455VR266

Overview

MCF54455VR266 from NXP Semiconductors is a ColdFire® Version 4 microprocessor with MMU and EMAC, operating at 266 MHz (410 Dhrystone 2.1 MIPS), featuring 32-KB on-chip SRAM, dual 10/100 Ethernet MACs, USB 2.0 OTG with ULPI, and a 32-bit PCI controller. It targets industrial networking gateways requiring deterministic real-time processing, secure communications, and multi-protocol I/O.

For engineers reviewing the MCF54455VR266 datasheet, MCF54455VR266 pinout, MCF54455VR266 application, or MCF54455VR266 equivalent, key selection criteria include DDR2/DDR/mobile-DDR memory controller support, cryptographic acceleration (AES/DES/SHA-1), dual FEC timing compliance, and TEPBGA-360 package thermal performance in extended temperature range (0°C to +70°C).

Technical Context

The MCF54455VR266 integrates a ColdFire V4 core with hardware MMU for full virtual memory management and an enhanced multiply-accumulate unit (EMAC) optimized for signal processing. Its crossbar switch (XBS) enables concurrent access to peripherals and RAM by multiple bus masters including CPU, DMA, and PCI.

It supports booting from SPI flash, EEPROM, or FRAM, and includes a dedicated cryptography acceleration unit (CAU) for DES, 3DES, AES, MD5, and SHA-1. The 16-channel DMA controller offloads data movement across SDRAM, FlexBus, USB, and Ethernet interfaces without CPU intervention.

Key Specifications

Pinout & Package

Package: TEPBGA–360 (23 mm × 23 mm), ball pitch 1.0 mm, 360 I/O balls. Designed for high-density PCB layouts with controlled impedance routing for DDR2, PCI, and Ethernet signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Compared with MCF54454VP266, the MCF54455VR266 adds ATA/ATAPI controller support for direct PATA device interfacing-critical for industrial storage applications-while maintaining identical performance, security, and connectivity features. Against MPC8313EVRAGDB, it offers lower power, ColdFire toolchain continuity, and integrated CAU for symmetric crypto, but lacks asymmetric acceleration.

Availability

MCF54455VR266 is available at Aetrix Electronics and suitable for industrial networking gateways, secure remote terminal units (RTUs), medical imaging edge processors, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for MCF54455VR266 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in microcontrollers, RF, and analog technologies.

The MCF54455VR266 belongs to the ColdFire® microprocessor family, designed specifically for high-performance, real-time embedded applications demanding integrated networking, security, and memory subsystems in harsh environments.

FAQ

What is the maximum DDR2 data rate supported by the MCF54455VR266?

The MCF54455VR266 supports a 16-bit DDR2 interface operating at 133 MHz clock frequency, enabling a peak data rate of 266 MT/s (megatransfers per second). This matches JEDEC DDR2-266 (PC2-2100) specifications and requires careful PCB layout for signal integrity, including matched trace lengths and controlled impedance routing per the MCF54455 Hardware Design Considerations document.

Does the MCF54455VR266 include hardware cryptographic acceleration?

Yes, the MCF54455VR266 integrates a dedicated Cryptography Acceleration Unit (CAU) that offloads DES, 3DES, AES, MD5, and SHA-1 operations from the ColdFire V4 core. This hardware block reduces encryption/decryption latency by >90% compared to software-only implementations, making the MCF54455VR266 suitable for IPsec, TLS, and secure boot applications without compromising real-time performance.

What package and pin count does the MCF54455VR266 use?

The MCF54455VR266 uses a TEPBGA–360 package with 360 I/O balls in a 23 mm × 23 mm footprint and 1.0 mm ball pitch. This package is specified for the MCF54452–MCF54455 variants and supports high-speed interfaces including DDR2, PCI, and dual Ethernet PHYs. Pin assignments are fully documented in Figure 6 of the MCF5445x datasheet Rev. 9.

Can the MCF54455VR266 boot directly from serial flash memory?

Yes, the MCF54455VR266 supports booting from SPI-compatible flash, EEPROM, and FRAM devices via its integrated serial boot facility (SBF). This eliminates the need for parallel NOR flash and associated address decoding logic, reducing BOM cost and PCB area. Boot mode is configured using BOOTMOD[1:0] pins, and the SBF handles initialization of clocks, PLL, and memory controllers before transferring control to user code.

What is the operating temperature range for the MCF54455VR266?

The MCF54455VR266 is rated for operation from 0°C to +70°C ambient temperature. This commercial-grade temperature range is specified in the ordering information table (Table 2) of the MCF5445x datasheet Rev. 9 and applies to the 'V' suffix variant. For extended industrial (-40°C to +85°C) operation, the 'C' suffix variant (e.g., MCF54455CVP200) is available, though at a lower 200 MHz speed grade.